FOUNDRY SERVICES Sample Clauses

FOUNDRY SERVICES. If TI elects the options set forth in Article 7.2.2, 7.2.3, or 7.2.4 above, then the following conditions shall apply.
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FOUNDRY SERVICES. 2.1 Minimum Wafer Foundering. Upon the terms and conditions set forth herein, at SEEQ's request, HMC shall manufacture Articles of Products for delivery to SEEQ. HMC may also, but shall not be obligated to, manufacture wafers for Products Developed by SEEQ in addition to the Products, as determined by the PARTIES. After execution of the Settlement Agreement, HMC shall, upon request from SEEQ, based on a four (4) week month, make wafer starts available to SEEQ at a minimum of (a) 125-millimeter wafers (or equivalents in other size wafers) started during the period from the Effective Date through August 31, 1995, (b) 125-millimeter wafer starts (or equivalents in other size wafers) started per month (at the rate of approximately wafers per week) during the period from September 1, 1995 until the earlier of (i) the end of the term of the 1990 Foundry Agreement , or (ii) the date in which the Products have been qualified by SEEQ for manufacture on the Stepper, and (c) 125-millimeter wafer starts (or equivalents in other size wafers) started per month (at the rate of approximately wafers per week) during the period following the date on which the Products have been qualified by SEEQ for manufacture on the Stepper. 4 2.2
Sample 1
FOUNDRY SERVICES. For the Term of this Agreement, TSMC shall manufacture and TSMC NA sell and deliver to Company Contract Wafers and Company Product and at Company’s request TSMC shall perform mask-making (and photolithography optimization). In addition, TSMC shall perform wafer probe testing and other associated manufacturing tasks including performing failure analysis, process engineering, and pre-production testing, qualification and optimization activities described below. Subject to section 9.4, Foundry shall transport **** to **** and obtain and maintain **** for Contract Wafers. TSMC shall also work with Company to successfully conclude the technology transfer of necessary manufacturing technology, and other activities agreed upon by the Parties in writing and set forth in any Process Supplement or Product Supplement. Collectively, these tasks to be performed by TSMC and TSMC NA are the “Foundry Services.” Foundry agrees to perform the Foundry Services in accordance with the terms and conditions of this Agreement. Company will be responsible for product design; for assembly, final test, marking and packaging; and for distribution and sales and may perform or arrange for mask-making.
Sample 1
FOUNDRY SERVICES. TSMC agrees to provide Customer with, and Customer agrees to procure from TSMC, foundry services to commercially manufacture for Customer in accordance with the specifications to be mutually agreed by Customer and TSMC in writing from time to time (the “Customer Specifications”) and the [***] requirements [***] to manufacture Customer’s designed integrated circuits [***] (“Wafer”) according to the terms and conditions of this Agreement.
Sample 1
FOUNDRY SERVICES. Subject to the terms of this Agreement and unless Spansion otherwise agrees in writing, SMIC shall (a) manufacture solely for, and sell and deliver to, Spansion the Contract Wafers, Sorted Contract Wafers and Spansion Product, as applicable, using 300mm manufacturing processes, or such other manufacturing processes as agreed upon from time to time, (b) at Spansion’s request, perform mask-making (and photolithography optimization), (c) perform Wafer probe testing and other associated manufacturing tasks including performing failure analysis, process engineering, and pre-production testing, qualification and optimization activities, as further described below, (d) transport and deliver Contract Wafers to Spansion’s chosen assembly, test, marking and packaging facilities and obtain and maintain all necessary import/export and customs clearances for such Contract Wafers; and (e) cooperate with Spansion to successfully conclude the other activities agreed upon by the Parties in writing and set forth in any Process Supplement or Product Supplement (collectively, the “Foundry Services”). SMIC agrees to perform the Foundry Services in accordance with the terms and conditions of this Agreement. SMIC is obligated to follow direction given by Spansion as to the manufacture of Contract Wafers including direction regarding systems, data, or the movement of Contract Wafers. SMIC shall be obligated to follow the discipline, procedures, and system requirements as if it was an internal Spansion fab. Except as otherwise agreed in writing by the Parties, Spansion will be responsible for product design, assembly, final test, marking, packaging, distribution and sales of the Spansion Products and may perform or arrange for mask-making.
Sample 1
FOUNDRY SERVICES. 2.1 Minimum Wafer Foundering. Upon the terms and conditions set forth herein, at SEEQ's request, HMC shall manufacture Articles of [*] Products for delivery to SEEQ. HMC may also, but shall not be obligated to, manufacture wafers for Products Developed by SEEQ in addition to the [*] Products, as determined by the PARTIES. After execution of the Settlement Agreement, HMC shall, upon request from SEEQ, based on a four (4) week month, make wafer starts available to SEEQ at a minimum of (a) [*] 125-millimeter wafers (or equivalents in other size wafers) started during the period from the Effective Date through August 31, 1995, (b) [*] 125-millimeter wafer starts (or equivalents in other size wafers) started per month (at the rate of approximately [*] wafers per week) during the period from September 1, 1995 until the earlier of (i) the end of the term of the 1990 Foundry Agreement, or (ii) the date in which the [*] Products have been qualified by SEEQ for manufacture on the [*] Stepper, and (c) [*] 125-millimeter wafer starts (or equivalents in other size wafers) started per month (at the rate of approximately [*] wafers per week) during the period following [*] INDICATES THAT MATERIAL HAS BEEN OMITTED AND CONFIDENTIAL TREATMENT HAS BEEN REQUESTED THEREFOR. ALL SUCH OMITTED MATERIAL HAS BEEN FILED SEPARATELY WITH THE COMMISSION PURSUANT TO RULE 24b-2. the date on which the [*] Products have been qualified by SEEQ for manufacture on the [*] Stepper.
Sample 1
FOUNDRY SERVICES. Notwithstanding anything to the contrary in this Agreement, Company may use High Performance Information to produce Foundry Products or produce Foundry Products on SOI Wafers only for sale, lease or transfer to IBM, other Participating Parties in the Development Project from which such High Performance Information is derived, licensees of such High Performance Information from IBM or sale, lease or transfer to Advanced Micro Devices, Inc. from any subsequent assignee. For avoidance of doubt, Industry Standard Information may be used to produce Foundry Products for any Third Party, subject to all the terms and conditions of this Agreement including Section 5(b) of this Participation Agreement.
Sample 1
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FOUNDRY SERVICES. 2.1 Minimum Wafer Foundering. Upon the terms and conditions set forth herein, at SEEQ's request, HMC shall manufacture Articles of [*] Products for delivery to SEEQ. HMC may also, but shall not be obligated to, manufacture wafers for Products Developed by SEEQ in addition to the [*] Products, as determined by the PARTIES. After execution of the Settlement Agreement, HMC shall, upon request from SEEQ, based on a four (4) week month, make wafer starts available to SEEQ at a minimum of (a) [*] 125-millimeter wafers (or equivalents in other size wafers) started during the period from the Effective Date through August 31, 1995, (b) [*] 125-millimeter wafer starts (or equivalents in other size wafers) started per month (at the rate of approximately [*] wafers per week) during the period from September 1, 1995 until the earlier of (i) the end of the term of the 1990 Foundry Agreement, or (ii) the date in which the [*] Products have been qualified by SEEQ for manufacture on the [*] Stepper, and (c) [*] 125-millimeter wafer starts (or equivalents in other size wafers) started per month (at the rate of approximately [*] wafers per week) during the period following the date on which the [*] Products have been qualified by SEEQ for manufacture on the [*] Stepper.
Sample 1

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