Deposition of Solder Bumps Sample Clauses

Deposition of Solder Bumps. The Consortium will develop a new generation of solder bump processes for flip-chip packaging, that will result in technologies of greater density and lower cost than the current manufacturing state of the art. These new technologies will be logical extensions of current processes and will offer substantial advancement of flip-chip interconnect. The enhanced technologies will be characterized and design rules generated as follows: AGREEMENT NUMBER: MDA972-95-3-0031 ATTACHMENT NO. 1, PAGE 3 . Fine Pitch Flip-Chip: Develop a process capable of 6 mil pitch peripheral bonding. This process will also provide a barrier metal sealing off the pads thus reducing the susceptibility of product corrosion. . Solder Jetting approach will be developed for deposition of eutectic Sn/Pb solder using the principles of ink jet printing. In this technique, a piezoelectric transducer generates an impulse which drives the displacement of a molten droplets of solder from a reservoir. Goal is to deposit on a 10 mil pitch at 10 bumps/sec. This process cost will be compared to full wafer bumping to determine when it is cost effective. . Solder wire bonding approach will be developed to attach solder directly on the aluminum IC pads. This would eliminate the use of UMB and could using the conventional wire bonding equipment currently used in IC Au wire assembly. This process cost will also be compared to full wafer bumping to determine when it is cost effective. . Pb free bump metallurgy and deposition process will be developed with reflow temperatures compatible with SMA processes. . 5/95 Sn/Pb reflow process will be developed. . High fatigue life alloys will be developed that will improve temperature cycling performance by 2X. The new alloys to be investigated will be reflowable at 230C and compatible with SMA processes.
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Related to Deposition of Solder Bumps

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