Reliability Characterization Sample Clauses

Reliability Characterization. The test methodology, processing, and material properties of key materials of construction in IC packaging will be fully characterized. The following will be accomplished: * Materials screening - Various combinations of materials will be evaluated through design of experiments which will include evaluating the different choices for synergistic interaction; * The evaluation of adhesion and stress characteristics of die coatings; * The characterization of mold compounds to include manufacturability assessment (e.g. curing kinetics, rheology, and moldability) and mechanical characteristics (coefficient of thermal expansion, modulus, fracture strength, and adhesion); * Assembly Test Chips (ATCs) will be obtained for use in the evaluation of package properties; and * Reliability testing of the test ICs and product vehicles will be performed.
Sample 1
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Reliability Characterization. Materials screening and characterization similar to section 1.3.4 on ruggedization must be performed. The following will be accomplished: * The characterization of thermally enhanced molding compounds and die attach materials, * The development of thermal test chips for use in screening materials, * The assembly of 160 PQFP which will be done by IPAC and National, and * Reliability testing of test vehicles and product drivers will be performed.
Sample 1

Related to Reliability Characterization

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