BETWEENLoan Agreement • October 16th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • California
AS TENANTLease Agreement • April 12th, 2000 • Stanford Microdevices Inc • Semiconductors & related devices • California
RECITALSLoan Agreement • August 16th, 2000 • Stanford Microdevices Inc • Semiconductors & related devices • California
AGREEMENTAgreement • March 1st, 2000 • Stanford Microdevices Inc • California
1 EXHIBIT 10.10 SUPPLY AGREEMENT This Agreement (the "Agreement") is entered into this 7th day of October, 1999 by and between Spectrian, Inc., Semiconductor Division, having its office at 350 West Java Drive, Sunnyvale, California, 94089, hereinafter...Supply Agreement • May 18th, 2000 • Stanford Microdevices Inc • Semiconductors & related devices • California
SUBLEASESublease Agreement • April 12th, 2000 • Stanford Microdevices Inc • Semiconductors & related devices
1 EXHIBIT 10.17 ELK PROPERTY MANAGEMENT LIMITED November 19, 1999 Stanford Microdevices, Inc 522 Almanor Avenue Sunnyvale, CA 94086 Attention: Tom Scannell Re: 350 Palladium Dr. Office Space Dear Sirs Further to our discussions we are pleased to make...Stanford Microdevices Inc • April 12th, 2000 • Semiconductors & related devices
RECITALSSecurity Agreement • October 16th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • California
1 Exhibit 4.2 INVESTORS' RIGHTS AGREEMENT OCTOBER 5, 1999Rights Agreement • March 1st, 2000 • Stanford Microdevices Inc • California
BETWEENOffice Lease • March 1st, 2000 • Stanford Microdevices Inc • California
NORTEL AGREEMENT NO. _____ PURCHASER AGREEMENT NO. _____ VOLUME PURCHASE AGREEMENT This Volume Purchase Agreement (the "Agreement") is between Nortel Networks Corporation, a company incorporated under the laws of Canada, having an office at 185...Volume Purchase Agreement • May 18th, 2000 • Stanford Microdevices Inc • Semiconductors & related devices • Ontario
AGREEMENT AND PLAN OF MERGER by and among SIRENZA MICRODEVICES, INC. METRIC ACQUISITION CORPORATION and MICRO LINEAR CORPORATION Dated as of August 14, 2006Agreement and Plan of Merger • August 17th, 2006 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of August 14, 2006 by and among Sirenza Microdevices, Inc., a Delaware corporation (“Parent”), Metric Acquisition Corporation, a Delaware corporation and a wholly-owned subsidiary of Parent (“Merger Sub”), and Micro Linear Corporation, a Delaware corporation (the “Company”). All capitalized terms used in this Agreement shall have the respective meanings ascribed thereto in Article I hereof.
Common StockStanford Microdevices Inc • April 12th, 2000 • Semiconductors & related devices • Maryland
1 EXHIBIT 10.1 FOUNDRY AGREEMENT This Agreement (the "Agreement") is entered into this 22 day of June, 2000 by and between Global Communication Semiconductor, Inc. hereinafter referred to as "GCS" and Stanford Microdevices Inc. hereinafter referred to...Foundry Agreement • August 16th, 2000 • Stanford Microdevices Inc • Semiconductors & related devices
7,000,000 Shares SIRENZA MICRODEVICES, INC. Common Stock, par value $0.001 per share PURCHASE AGREEMENTPurchase Agreement • February 20th, 2007 • Sirenza Microdevices Inc • Semiconductors & related devices • New York
The stockholders listed in Schedule I hereto (the “Selling Stockholders”) of Sirenza Microdevices, Inc., a Delaware corporation (the “Company”), propose to sell to Piper Jaffray & Co. (the “Underwriter”) an aggregate of 7,000,000 shares (the “Securities”) of Common Stock, $0.001 par value per share (the “Common Stock”) of the Company. The Securities consist of outstanding shares of Common Stock to be sold by the Selling Stockholders. The Company and the Selling Stockholders hereby confirm their agreement with respect to the sale of the Securities to the Underwriter.
BY AND AMONGAgreement and Plan of Reorganization • September 25th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • California
NON-COMPETITION AGREEMENTNon-Competition Agreement • December 20th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
THIS NON-COMPETITION AGREEMENT is entered into as of December 2, 2002, by and between Charles R. Bland, an individual (the “Stockholder”) and Sirenza Microdevices, Inc, a Delaware corporation (“Sirenza Microdevices, Inc.”).
SIRENZA MICRODEVICES, INC. EXECUTIVE EMPLOYMENT AGREEMENTEmployment Agreement • November 9th, 2005 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
THIS AGREEMENT, effective July 15, 2005 (the “Agreement”), is made and entered into by and between SIRENZA MICRODEVICES, INC. (the “Company”) and Charles R. Bland (“Executive”).
VOTING AGREEMENTVoting Agreement • August 16th, 2007 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
This Voting Agreement (“Voting Agreement”) is entered into as of August 12, 2007, by and between RF Micro Devices, Inc., a North Carolina corporation (“Parent”), and (“Stockholder”).
SIRENZA MICRODEVICES, INC. FORM OF AMENDMENT TO EXECUTIVE EMPLOYMENT AGREEMENTEmployment Agreement • October 26th, 2007 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
This Amendment to the Executive Employment Agreement (the “Amendment”) is made as of October ___, 2007, by and between Sirenza Microdevices, Inc. (the “Company”), and Charles R. Bland (the “Executive”).
AGREEMENTControl Severance Agreement • March 1st, 2000 • Stanford Microdevices Inc • California
RECITALSExclusivity and Right of First Refusal Agreement • October 16th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
ASSET PURCHASE AGREEMENT By and Among SIRENZA MICRODEVICES, INC., OLIN ACQUISITION CORPORATION and VARI-L COMPANY, INC. December 2, 2002Asset Purchase Agreement • December 10th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
THIS ASSET PURCHASE AGREEMENT (the “Agreement”), is made and entered into as of December 2, 2002, by and among Sirenza Microdevices, Inc., a Delaware corporation (“Parent”), Olin Acquisition Corporation, a Delaware corporation and a wholly-owned subsidiary of Parent (“Buyer”), and Vari-L Company, Inc., a Colorado corporation (“Seller”).
SIRENZA MICRODEVICES, INC. REGISTRATION RIGHTS AGREEMENT January 30, 2004Registration Rights Agreement • February 9th, 2004 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
This Registration Rights Agreement (this “Agreement”) is made as of January 30, 2004 by and among Sirenza Microdevices, Inc., a Delaware corporation (the “Company”), and the persons and entities (each, an “Holder” and collectively, the “Holders”) listed on Exhibit A hereto. Unless otherwise defined herein, capitalized terms used in this Agreement have the meanings ascribed to them in Section 1.
SIRENZA MICRODEVICES, INC. EXECUTIVE EMPLOYMENT AGREEMENTExecutive Employment Agreement • November 9th, 2007 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
THIS AGREEMENT, effective August 11, 2007 (the “Agreement”), is made and entered into by and between SIRENZA MICRODEVICES, INC. (the “Company”) and Charles R. Bland (“Executive”).
AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among: RF Micro Devices, Inc., a North Carolina corporation; Iceman Acquisition Sub, Inc., a Delaware corporation; and Sirenza Microdevices, Inc., a Delaware corporation Dated as of August 12, 2007Agreement and Plan of Merger and Reorganization • August 16th, 2007 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
This Agreement and Plan of Merger and Reorganization (“Agreement”) is made and entered into as of August 12, 2007, by and among: RF Micro Devices, Inc., a North Carolina corporation (“Parent”); Iceman Acquisition Sub, Inc., a Delaware corporation and a wholly-owned subsidiary of Parent (“Merger Sub”); and Sirenza Microdevices, Inc., a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
STOCKHOLDER SUPPORT AGREEMENTStockholder Support Agreement • December 10th, 2002 • Sirenza Microdevices Inc • Semiconductors & related devices • California
THIS STOCKHOLDER SUPPORT AGREEMENT (the “Agreement”) is entered into as of December , 2002, by and among OLIN ACQUISITION CORPORATION, a Delaware corporation (“Buyer”), VARI-L COMPANY, INC., a Colorado corporation (“Seller”), and the undersigned stockholder of Seller (“Stockholder”).
Exhibit 10.1 STANFORD MICRODEVICES, INC. INDEMNIFICATION AGREEMENT This Indemnification Agreement ("Agreement") is effective as of _____ 2000 by and between Stanford Microdevices, Inc., a Delaware corporation (the "Company"), and the indemnitee listed...Indemnification Agreement • March 1st, 2000 • Stanford Microdevices Inc • Delaware
MICRO LINEAR CORPORATION VOTING AGREEMENTVoting Agreement • August 17th, 2006 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
THIS VOTING AGREEMENT (this “Agreement”) is made and entered into as of August 14, 2006, by and between Sirenza Microdevices, Inc., a Delaware corporation (“Parent”), Metric Acquisition Corp., a Delaware corporation (“Merger Sub” and, together with Parent, “Sirenza”), and the undersigned stockholder of Micro Linear Corporation (“Stockholder”).
Contract Change Notice/Amendment No. 07 to TRW Inc./Sirenza Microdevices Wafer Supply Agreement Agreement No. 1A551Sirenza Microdevices Inc • February 27th, 2003 • Semiconductors & related devices
INDUSTRIAL BUILDING LEASE (MULTI-TENANT) forLease Agreement • February 27th, 2003 • Sirenza Microdevices Inc • Semiconductors & related devices
OFFICE BUILDING LEASE FOR MACK-CALI REALTY, L.P., a Delaware limited partnership (as Landlord) and SIRENZA MICRODEVICES, INC., a Delaware corporation (as Tenant) Buildings A and B 303 South Technology Court Interlocken Technology Park Broomfield,...For • March 28th, 2003 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
THIS LEASE is made as of the 25th day of March, 2003, by and between Mack-Cali Realty, L.P., a Delaware limited partnership (“Landlord”), and Sirenza Microdevices, Inc., a Delaware corporation (“Tenant”).
Contract Change Notice/Amendment No. 6 to TRW Inc./Sirenza Microdevices Wafer Supply Agreement Agreement No. 1A551Sirenza Microdevices Inc • March 27th, 2002 • Semiconductors & related devices
Contract Change Notice/Amendment No. 10 to Northrop Grumman Space Technology/Sirenza Microdevices Wafer Supply Agreement No. 1A551Sirenza Microdevices Inc • August 13th, 2004 • Semiconductors & related devices
THIS AMENDMENT (“Amendment”) is made and entered into and between Sirenza Microdevices (“Buyer”) and Northrop Grumman Space Technology (“NGST”).
GLOBAL COMMUNICATION SEMICONDUCTORS, INC. AMENDED AND RESTATED INVESTORS’ RIGHTS AGREEMENT March 19, 2002Investors’ Rights Agreement • March 18th, 2003 • Sirenza Microdevices Inc • Semiconductors & related devices • California
THIS AMENDED AND RESTATED INVESTORS’ RIGHTS AGREEMENT (the “Agreement”) is made as of March 19, 2002, by and among Global Communication Semiconductors, Inc., a California corporation (the “Company”), and the persons identified as Series A-1 Investors on the attached Schedule A (“Series A-1 Investors”), the persons identified as Series B-1 Investors on the attached Schedule B (“Series B-1 Investors”), the persons identified as Series C-1 Investors on the attached Schedule C (“Series C-1 Investors”) (collectively, the “Existing Investors”) and the persons identified as Series D-1 Investors on the attached Schedule D as of the First Closing (“First Closing Series D-1 Investors”) and the persons identified as Series D-1 Investors on the attached Schedule E as of the Second Closing (“Second Closing Series D-1 Investors”) (the First Closing Series D-1 Investors and the Second Closing Series D-1 Investors are collectively referred to as the “Series D-1 Investors” or “New Investors”) (the Exis
