Foundry Agreement Sample Contracts

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Akoustis Technologies, Inc. – Foundry Agreement (May 29th, 2015)

This Foundry (Manufacturing) Agreement (this "Agreement") is made this 27th day of February, 2015 between AKOUSTIS, INC., a Delaware corporation, and its affiliates ("AKOUSTIS") and Global Communication Semiconductors, LLC, a California limited liability company ("GCS") and is effective upon the Effective Date, collectively as "Parties" or singly as "Party."

Am Product Foundry Agreement (November 1st, 2013)

This AM PRODUCT FOUNDRY AGREEMENT (the "Agreement") is made and entered into as of the Closing Date (as defined in the Stock Purchase Agreement (as defined below)) (the "Effective Date") by and between Fujitsu Semiconductor Limited, a corporation organized and existing under the laws of Japan, with a registered office at 2-10-23 Shinyokohama, Kohoku-ku, Yokohama, Kanagawa 222-0033, Japan ("FSL") and Spansion LLC, a corporation organized and existing under the laws of Delaware, with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453 ("Spansion").

Amendment No. 7 to the Amended and Restated Foundry Agreement Dated September 28, 2006 (October 31st, 2012)

THIS AMENDMENT NO. 7 (this "Amendment") to the Amended and Restated Foundry Agreement entered into as of September 28, 2006, and as amended effective June 19, 2008, and as amended a second time effective December 31, 2008, and as amended a third time effective June 15, 2009, and as amended a fourth time effective May 24, 2010, and as amended a fifth time effective January 1, 2011, and as amended a sixth time effective September 1, 2010 (the "Agreement"), by and among Spansion, Inc., a Delaware corporation, Spansion Technology LLC, a Delaware limited liability company, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansion's obligations hereunder and under the Agreement (collectively, "Spansion U.S."), Spansion Japan Limited, a Japanese corporation ("Spansion Japan"), and assigned by Spansion Japan to Nihon Spansion Limited ("Nihon"), effective May 24, 2010, and assigned by Nihon to Nihon Spansion Trading Limited ("PSKK"), effective

Foundry Agreement (September 21st, 2011)

This amended and restated FOUNDRY AGREEMENT (the Agreement) is made and entered into as of the 28th day of September, 2006 by and between Fujitsu Limited, a corporation organized and existing under the laws of Japan, with a registered office at 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki 211-8588 Japan (Fujitsu); Spansion Inc., a corporation organized and existing under the laws of Delaware, with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, Spansion Technology, Inc., a corporation organized and existing under the laws of Delaware (STI), with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, and Spansion LLC, a limited liability company organized and existing under the laws of Delaware (Spansion LLC), with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, solely in their capacities as guarantors of Spansions obligations hereunder (collectively Guarantors); and Spansion Japan Limited, a corporation

AMENDMENT No. 3 to Foundry Agreement Between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion Trading Limited (July 7th, 2011)

This Amendment No. 3 (Amendment) to the Foundry Agreement is entered into this 11th day of March, 2011, (the Effective Date) by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (Spansion), Nihon Spansion Trading Limited, as successor in interest to Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (Spansion Nihon) (Spansion Nihon and Spansion, the Spansion Entities), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (TI). Spansion, Spansion Nihon, and TI are collectively referred to as Parties to this Amendment and, individually, as a Party to this Amendment.

Amendment No. 6 to the Amended and Restated Foundry Agreement Dated September 28, 2006 (July 7th, 2011)

THIS AMENDMENT NO. 6 (this Amendment) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006, and as amended effective June 19, 2008, and as amended a second time effective December 31, 2008, and as amended a third time effective June 15, 2009, and as amended a fourth time effective May 24, 2010, and as amended a fifth time effective January 1, 2011 (the Agreement), by and among Spansion, Inc., a Delaware corporation, Spansion Technology LLC, a Delaware limited liability company, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansions obligations hereunder and under the Agreement (collectively, Spansion U.S.), Spansion Japan Limited, a Japanese corporation (Spansion Japan), and assigned by Spansion Japan to Nihon Spansion Limited (Nihon), effective May 24, 2010, and assigned by Nihon to Nihon Spansion Trading Limited (PSKK), effective December 27, 2010, and Fujitsu Limited, a Japanese corporation (Fujits

AMENDMENT No. 2 to Foundry Agreement Between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion Limited (February 23rd, 2011)

This Amendment No. 2 (Amendment No. 2) to the Foundry Agreement is entered into this 15th day of October, 2010 (the Effective Date), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (Spansion), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (TI). Spansion, Spansion Nihon, and TI are collectively referred to as Parties to this Amendment No. 2 and, individually, as a Party to this Amendment No. 2.

AMENDMENT No. 1 to Foundry Agreement Between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion Limited (November 1st, 2010)

This Amendment No. 1 (Amendment No. 1) to the Foundry Agreement is entered into this 15th day of September 2010, (the Effective Date) by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (Spansion), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (TI). Spansion, Spansion Nihon, and TI are collectively referred to as Parties to this Amendment and, individually, as a Party to this Amendment.

Foundry Agreement (October 28th, 2010)

THIS FOUNDRY AGREEMENT (the Agreement) is made effective on the Effective Date (as defined below), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (Spansion), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (TI). Spansion, Spansion Nihon, and TI are collectively referred to as Parties to this Agreement and, individually, as a Party to this Agreement.

Foundry Agreement (September 17th, 2010)

THIS FOUNDRY AGREEMENT (the Agreement) is made effective on the Effective Date (as defined below), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (Spansion), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (TI). Spansion, Spansion Nihon, and TI are collectively referred to as Parties to this Agreement and, individually, as a Party to this Agreement.

Third Amended & Restated Foundry Agreement (April 29th, 2010)

THIS THIRD AMENDED & RESTATED FOUNDRY AGREEMENT (the Agreement) is made effective as of February 2, 2010 (the Effective Date), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (Spansion), and Spansion Japan Limited, having its registered place of business at 2, Takaku-Kogyodanchi, Aizuwakamatsu-shi, Fukushima 965-0060, Japan (Spansion Japan).

Alpha And Omega Semiconductor – Second Addendum to the FOUNDRY AGREEMENT (March 31st, 2010)

THIS Second Addendum (the Second Addendum) to the Foundry Agreement dated January 10, 2002 (the Foundry Agreement) is made effective as of the 11th day of April, 2007 (Effective Date) by and between Shanghai Hua Hong NEC Electronics Company Limited., a Chinese limited liability company with offices at No. 1188 Chuan Qiao Road, Pu Dong New District, Shanghai, China (HHNEC), and Alpha and Omega Semiconductor Limited, a Bermuda exempted company with offices at 495 Mercury Drive, Sunnyvale, California 94085, USA (AOS).

Alpha And Omega Semiconductor – First Addendum to the FOUNDRY AGREEMENT (March 31st, 2010)

THIS First Addendum to the Foundry Agreement by and between Hua Hong NEC Electronics Company Limited, a Chinese limited liability company with offices at No. 1188 Chuan Qiao Road, Pu Dong New District, Shanghai, China (HHNEC), and Alpha and Omega Semiconductor Limited, a Bermuda exempted company with offices at 495 Mercury Drive, Sunnyvale, California 94085, USA (AOS), is made effective as of this 28th day of July, 2005, pursuant to Section 10.9 of the Foundry Agreement (dated January 10, 2002 by and between HHNEC and AOS).

Alpha And Omega Semiconductor – Foundry Agreement (March 31st, 2010)

THIS FOUNDRY AGREEMENT (this Agreement) is made as of January 10, 2002 (the Effective Date) by and between Hua Hong NEC Electronics Company Limited, a company incorporated under the laws of the Peoples Republic of China (the PRC), whose principal offices is at No. 1188 Chuan Qiao Road, Pu Dong New District, Shanghai, China (HHNEC); and Alpha and Omega Semiconductor Limited, a company incorporated under the laws of Bermuda, whose registered office is at 479 East Evelyn Avenue, Sunnyvale, CA 94086, USA (AOS).

Amendment No. 3 to the Amended and Restated Foundry Agreement Dated September 28, 2006 (December 31st, 2009)

THIS AMENDMENT NO. 3 (this Amendment) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006, and as amended effective June 19, 2008, and as amended a second time effective December 31, 2008 (the Agreement), by and between Spansion, Inc., a Delaware corporation, Spansion Technology, Inc., a Delaware corporation, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansions obligations hereunder and under the Agreement (Guarantors), Spansion Japan Limited, a Japanese corporation (Spansion), and Fujitsu Limited, a Japanese corporation (Fujitsu), and assigned by Fujitsu to Fujitsu Microelectronics Limited, a Japanese corporation (FML), effective March 21, 2008, is made and entered into as of June 30, 2009 (the Amendment Date).

Amendment No. 2 to the Amended and Restated Foundry Agreement Dated September 28, 2006 (May 13th, 2009)

THIS AMENDMENT NO. 2 (this Amendment) to the Amended and Restated Foundry Agreement made and entered into as of September 28, 2006, as amended effective as of June 19, 2008 (the Agreement), by and between Spansion Inc., a Delaware corporation, Spansion Technology, Inc., a Delaware corporation, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansions obligations hereunder and under the Agreement (Guarantors), Spansion Japan Limited, a Japanese corporation (Spansion), and Fujitsu Limited, a Japanese corporation (Fujitsu), and assigned by Fujitsu to Fujitsu Microelectronics Limited, a Japanese corporation (FML), effective March 21, 2008, is made and entered into to be effective as of December 31, 2008 (the Amendment Date).

Amendment No. 1 to the Foundry Agreement Dated September 28, 2006 (August 8th, 2008)

THIS AMENDMENT NO. 1 (this Amendment) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006 (the Agreement), by and between Spansion Inc., a Delaware corporation, Spansion Technology, Inc., a Delaware corporation, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansions obligations hereunder and under the Agreement (Guarantors), Spansion Japan Limited, a Japanese corporation (Spansion), and Fujitsu Limited, a Japanese corporation (Fujitsu), and assigned by Fujitsu to Fujitsu Microelectronics Limited, a Japanese corporation (FML), effective March 21, 2008, is made and entered into as of June 19, 2008 (the Amendment Date).

Foundry Agreement (November 3rd, 2006)

This amended and restated FOUNDRY AGREEMENT (the Agreement) is made and entered into as of the 28th day of September, 2006 by and between Fujitsu Limited, a corporation organized and existing under the laws of Japan, with a registered office at 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki 211-8588 Japan (Fujitsu); Spansion Inc., a corporation organized and existing under the laws of Delaware, with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, Spansion Technology, Inc., a corporation organized and existing under the laws of Delaware (STI), with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, and Spansion LLC, a limited liability company organized and existing under the laws of Delaware (Spansion LLC), with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, solely in their capacities as guarantors of Spansions obligations hereunder (collectively Guarantors); and Spansion Japan Limited, a corporation

Pixelplus Co Ltd -Adr – Foundry Agreement (December 13th, 2005)

This Foundry Agreement (the Agreement) is entered into this 22nd day of November, 2005 (the Effective Date) by and between Pixelplus Co. Ltd., with offices at 5th Floor, Intellige 1, KINS Tower, 25-1 Jeongja-dong, Bundang-gu, Seongnam-si, Gyeonggi-do 463-811, Korea (Pixelplus), on behalf of itself and its wholly-owned subsidiaries Pixelplus Semiconductor, Inc., and Pixelplus Shanghai Co., Limited (collectively, Buyer); and United Microelectronics Corporation, an ROC Corporation with a principal place of business at No. 3, Li-Hsin Rd., Science-Based Industrial Park, Hsin-Chu City, Taiwan 30077, ROC (Seller or Manufacturer).

Pixelplus Co Ltd -Adr – Foundry Agreement (December 12th, 2005)

This Foundry Agreement (the Agreement) is entered into this 22nd day of November, 2005 (the Effective Date) by and between Pixelplus Co. Ltd., with offices at 5th Floor, Intellige 1, KINS Tower, 25-1 Jeongja-dong, Bundang-gu, Seongnam-si, Gyeonggi-do 463-811, Korea (Pixelplus), on behalf of itself and its wholly-owned subsidiaries Pixelplus Semiconductor, Inc., and Pixelplus Shanghai Co., Limited (collectively, Buyer); and United Microelectronics Corporation, an ROC Corporation with a principal place of business at No. 3, Li-Hsin Rd., Science-Based Industrial Park, Hsin-Chu City, Taiwan 30077, ROC (Seller or Manufacturer).

Pixelplus Co Ltd -Adr – Foundry Agreement (December 5th, 2005)

This Foundry Agreement (the Agreement) is entered into this 22nd day of November, 2005 (the Effective Date) by and between Pixelplus Co. Ltd., with offices at 5th Floor, Intellige 1, KINS Tower, 25-1 Jeongja-dong, Bundang-gu, Seongnam-si, Gyeonggi-do 463-811, Korea (Pixelplus), on behalf of itself and its wholly-owned subsidiaries Pixelplus Semiconductor, Inc., and Pixelplus Shanghai Co., Limited (collectively, Buyer); and United Microelectronics Corporation, an ROC Corporation with a principal place of business at No. 3, Li-Hsin Rd., Science-Based Industrial Park, Hsin-Chu City, Taiwan 30077, ROC (Seller or Manufacturer).

Foundry Agreement (September 19th, 2005)

**** Confidential treatment has been requested as to certain portions of this agreement. Such omitted confidential information has been designated by asterisks and has been filed separately with the Securities and Exchange Commission pursuant to Rule 406 under the Securities Act of 1933, as amended, and the Commissions rules and regulations promulgated under the Freedom of Information Act, pursuant to a request for confidential treatment.****

Advanced Analogic Technologies, Inc. – Master WAFER FOUNDRY AGREEMENT (April 29th, 2005)

THIS WAFER FOUNDRY AGREEMENT is made effective as of the 4TH day of JUNE, 2002, by and among the Systems I.C. Division of HYNIX SEMICONDUCTOR AMERICA, a California corporation, located at 3101 North First Street, San Jose, California 95134 hereinafter (HSA) functioning as the contract facilitator and limited agent of HSI, and HYNIX SEMICONDUCTOR INC., LTD. (HSI) a Republic of Korea corporation with its principal offices located at San 136-1, Ami-ri, Bubal-eub, Ichon-si, KyoungKi-do, 467-701 Korea, performing as the FOUNDRY, and ADVANCED ANALOGIC TECHNOLOGIES, INC., a California corporation, located at 1250 Oakmead Parkway Suite 310, Sunnyvale, CA 94086, hereinafter (CUSTOMER).