FOUNDRY AGREEMENT MODIFIED EXCLUSIVELY FOR CONEXANT SYSTEMS, INC. CONFIDENTIALFoundry Agreement • December 17th, 2002 • Conexant Systems Inc • Semiconductors & related devices • California
FOUNDRY AGREEMENTFoundry Agreement • December 13th, 2005 • Pixelplus Co., Ltd. • Semiconductors & related devices • California
This Foundry Agreement (the “Agreement”) is entered into this 22nd day of November, 2005 (the “Effective Date”) by and between Pixelplus Co. Ltd., with offices at 5th Floor, Intellige 1, KINS Tower, 25-1 Jeongja-dong, Bundang-gu, Seongnam-si, Gyeonggi-do 463-811, Korea (“Pixelplus”), on behalf of itself and its wholly-owned subsidiaries Pixelplus Semiconductor, Inc., and Pixelplus Shanghai Co., Limited (collectively, “Buyer”); and United Microelectronics Corporation, an ROC Corporation with a principal place of business at No. 3, Li-Hsin Rd., Science-Based Industrial Park, Hsin-Chu City, Taiwan 30077, ROC (“Seller” or “Manufacturer”).
ContractFoundry Agreement • November 2nd, 2004 • Monolithic Power Systems Inc • Semiconductors & related devices
MONOLITHIC POWER SYSTEMS, INC HAS REQUESTED THAT PORTIONS OF THIS DOCUMENT BE ACCORDED CONFIDENTIAL TREATMENT PURSUANT TO RULE 406 OF REGULATION C PROMULGATED UNDER THE SECURITIES ACT OF 1933, AS AMENDED. ACCORDINGLY, CERTAIN INFORMATION IN THIS EXHIBIT HAS BEEN OMITTED AND FILED SEPARATELY WITH THE COMMISSION. OMITTED INFORMATION HAS BEEN REPLACED BY [*].
FOUNDRY AGREEMENTFoundry Agreement • October 28th, 2010 • Spansion Inc. • Semiconductors & related devices
THIS FOUNDRY AGREEMENT (the “Agreement”) is made effective on the “Effective Date” (as defined below), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (“Spansion”), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (“Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (“TI”). Spansion, Spansion Nihon, and TI are collectively referred to as “Parties” to this Agreement and, individually, as a “Party” to this Agreement.
FOURTH AMENDMENT TO FOUNDRY AGREEMENT Spansion and SMICFoundry Agreement • February 23rd, 2012 • Spansion Inc. • Semiconductors & related devices
AMENDMENT No. 3 to Foundry Agreement between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion Trading LimitedFoundry Agreement • July 7th, 2011 • Spansion Inc. • Semiconductors & related devices
This Amendment No. 3 (“Amendment”) to the Foundry Agreement is entered into this 11th day of March, 2011, (the “Effective Date”) by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (“Spansion”), Nihon Spansion Trading Limited, as successor in interest to Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (“Spansion Nihon”) (Spansion Nihon and Spansion, the “Spansion Entities”), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (“TI”). Spansion, Spansion Nihon, and TI are collectively referred to as “Parties” to this Amendment and, individually, as a “Party” to this Amendment.
FOUNDRY AGREEMENTFoundry Agreement • March 31st, 2010 • ALPHA & OMEGA SEMICONDUCTOR LTD • California
THIS FOUNDRY AGREEMENT (this “Agreement”) is made as of January 10, 2002 (the “Effective Date”) by and between Hua Hong NEC Electronics Company Limited, a company incorporated under the laws of the People’s Republic of China (the “PRC”), whose principal offices is at No. 1188 Chuan Qiao Road, Pu Dong New District, Shanghai, China (“HHNEC”); and Alpha and Omega Semiconductor Limited, a company incorporated under the laws of Bermuda, whose registered office is at 479 East Evelyn Avenue, Sunnyvale, CA 94086, USA (“AOS”).
ContractFoundry Agreement • February 23rd, 2011 • Spansion Inc. • Semiconductors & related devices
[*] Certain information in this document has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions.
AMENDMENT NO. 7 TO THE AMENDED AND RESTATED FOUNDRY AGREEMENT DATED SEPTEMBER 28, 2006Foundry Agreement • October 31st, 2012 • Spansion Inc. • Semiconductors & related devices
THIS AMENDMENT NO. 7 (this “Amendment”) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006, and as amended effective June 19, 2008, and as amended a second time effective December 31, 2008, and as amended a third time effective June 15, 2009, and as amended a fourth time effective May 24, 2010, and as amended a fifth time effective January 1, 2011, and as amended a sixth time effective September 1, 2010 (the “Agreement”), by and among Spansion, Inc., a Delaware corporation, Spansion Technology LLC, a Delaware limited liability company, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansion’s obligations hereunder and under the Agreement (collectively, “Spansion U.S.”), Spansion Japan Limited, a Japanese corporation (“Spansion Japan”), and assigned by Spansion Japan to Nihon Spansion Limited (“Nihon”), effective May 24, 2010, and assigned by Nihon to Nihon Spansion Trading Limited (“PSKK”), effective
AMENDMENT NO. 1 TO THE FOUNDRY AGREEMENT DATED SEPTEMBER 28, 2006Foundry Agreement • August 8th, 2008 • Spansion Inc. • Semiconductors & related devices
THIS AMENDMENT NO. 1 (this “Amendment”) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006 (the “Agreement”), by and between Spansion Inc., a Delaware corporation, Spansion Technology, Inc., a Delaware corporation, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansion’s obligations hereunder and under the Agreement (“Guarantors”), Spansion Japan Limited, a Japanese corporation (“Spansion”), and Fujitsu Limited, a Japanese corporation (“Fujitsu”), and assigned by Fujitsu to Fujitsu Microelectronics Limited, a Japanese corporation (“FML”), effective March 21, 2008, is made and entered into as of June 19, 2008 (the “Amendment Date”).
AMENDMENT NO. 6 TO THE AMENDED AND RESTATED FOUNDRY AGREEMENT DATED SEPTEMBER 28, 2006Foundry Agreement • July 7th, 2011 • Spansion Inc. • Semiconductors & related devices
THIS AMENDMENT NO. 6 (this “Amendment”) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006, and as amended effective June 19, 2008, and as amended a second time effective December 31, 2008, and as amended a third time effective June 15, 2009, and as amended a fourth time effective May 24, 2010, and as amended a fifth time effective January 1, 2011 (the “Agreement”), by and among Spansion, Inc., a Delaware corporation, Spansion Technology LLC, a Delaware limited liability company, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansion’s obligations hereunder and under the Agreement (collectively, “Spansion U.S.”), Spansion Japan Limited, a Japanese corporation (“Spansion Japan”), and assigned by Spansion Japan to Nihon Spansion Limited (“Nihon”), effective May 24, 2010, and assigned by Nihon to Nihon Spansion Trading Limited (“PSKK”), effective December 27, 2010, and Fujitsu Limited, a Japanese corpor
AMENDMENT NO. 3 TO THE AMENDED AND RESTATED FOUNDRY AGREEMENT DATED SEPTEMBER 28, 2006Foundry Agreement • December 31st, 2009 • Spansion Inc. • Semiconductors & related devices
THIS AMENDMENT NO. 3 (this “Amendment”) to the Amended and Restated Foundry Agreement entered into as of September 28, 2006, and as amended effective June 19, 2008, and as amended a second time effective December 31, 2008 (the “Agreement”), by and between Spansion, Inc., a Delaware corporation, Spansion Technology, Inc., a Delaware corporation, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansion’s obligations hereunder and under the Agreement (“Guarantors”), Spansion Japan Limited, a Japanese corporation (“Spansion”), and Fujitsu Limited, a Japanese corporation (“Fujitsu”), and assigned by Fujitsu to Fujitsu Microelectronics Limited, a Japanese corporation (“FML”), effective March 21, 2008, is made and entered into as of June 30, 2009 (the “Amendment Date”).
AMENDMENT No. 2 to Foundry Agreement between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion LimitedFoundry Agreement • February 23rd, 2011 • Spansion Inc. • Semiconductors & related devices
This Amendment No. 2 (“Amendment No. 2”) to the Foundry Agreement is entered into this 15th day of October, 2010 (the “Effective Date”), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (“Spansion”), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (“Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (“TI”). Spansion, Spansion Nihon, and TI are collectively referred to as “Parties” to this Amendment No. 2 and, individually, as a “Party” to this Amendment No. 2.
FOUNDRY AGREEMENTFoundry Agreement • November 3rd, 2006 • Spansion Inc. • Semiconductors & related devices
This amended and restated FOUNDRY AGREEMENT (the “Agreement”) is made and entered into as of the 28th day of September, 2006 by and between Fujitsu Limited, a corporation organized and existing under the laws of Japan, with a registered office at 1-1, Kamikodanaka 4-chome, Nakahara-ku, Kawasaki 211-8588 Japan (“Fujitsu”); Spansion Inc., a corporation organized and existing under the laws of Delaware, with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, Spansion Technology, Inc., a corporation organized and existing under the laws of Delaware (“STI”), with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, and Spansion LLC, a limited liability company organized and existing under the laws of Delaware (“Spansion LLC”), with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, solely in their capacities as guarantors of Spansion’s obligations hereunder (collectively “Guarantors”); and Spansion Japan Limited, a
AGREEMENTFoundry Agreement • June 29th, 2005 • Tower Semiconductor LTD • Semiconductors & related devices
FOUNDRY AGREEMENTFoundry Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices
**** Confidential treatment has been requested as to certain portions of this agreement. Such omitted confidential information has been designated by asterisks and has been filed separately with the Securities and Exchange Commission pursuant to Rule 406 under the Securities Act of 1933, as amended, and the Commission’s rules and regulations promulgated under the Freedom of Information Act, pursuant to a request for confidential treatment.****
THIRD AMENDED & RESTATED FOUNDRY AGREEMENTFoundry Agreement • April 29th, 2010 • Spansion Inc. • Semiconductors & related devices • California
THIS THIRD AMENDED & RESTATED FOUNDRY AGREEMENT (the “Agreement”) is made effective as of February 2, 2010 (the “Effective Date”), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (“Spansion”), and Spansion Japan Limited, having its registered place of business at 2, Takaku-Kogyodanchi, Aizuwakamatsu-shi, Fukushima 965-0060, Japan (“Spansion Japan”).
AMENDMENT No. 1 to Foundry Agreement between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion LimitedFoundry Agreement • November 1st, 2010 • Spansion Inc. • Semiconductors & related devices
This Amendment No. 1 (“Amendment No. 1”) to the Foundry Agreement is entered into this 15th day of September 2010, (the “Effective Date”) by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (“Spansion”), Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (“Spansion Nihon), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S (“TI”). Spansion, Spansion Nihon, and TI are collectively referred to as “Parties” to this Amendment and, individually, as a “Party” to this Amendment.
ContractFoundry Agreement • July 7th, 2011 • Spansion Inc. • Semiconductors & related devices
[*] Certain information in this document has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions.
Subject: Extension of the Amended and Restated Foundry Agreement Reference: Amended and Restated Foundry Agreement, dated September 28, 2006Foundry Agreement • February 23rd, 2011 • Spansion Inc. • Semiconductors & related devices
FOUNDRY AGREEMENTFoundry Agreement • November 7th, 2008 • Spansion Inc. • Semiconductors & related devices • California
This Foundry Agreement is entered into as of August 31, 2007 (the “Effective Date”), by and between Semiconductor Manufacturing International Corporation, a Cayman Islands company, on behalf of itself and its Affiliates, including without limitation the Facilities (as defined below) (“SMIC”), and Spansion LLC, a limited liability company organized in the State of Delaware, on behalf of itself and its Affiliates (“Spansion”). In consideration of the mutual covenants and conditions contained herein, the Parties agree as follows:
AMENDMENT No. 4 to Foundry Agreement between Texas Instruments Incorporated and Spansion LLC and Nihon Spansion Trading LimitedFoundry Agreement • February 23rd, 2012 • Spansion Inc. • Semiconductors & related devices
This Amendment No. 4 (“Amendment”) to the Foundry Agreement is entered into this 8th day of November, 2011 (the “Effective Date”), by and between Spansion LLC, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California 94088-3453, U.S.A. (“Spansion”), Nihon Spansion Trading Limited, as successor in interest to Nihon Spansion Limited, having its principal place of business at 1-14, Nishin-cho, Kawasaki-shi, Kawasaki-ku, Kanagawa 210-0024, Japan (“Spansion Nihon”) (Spansion Nihon and Spansion, the “Spansion Entities”), and Texas Instruments Incorporated, having its principal place of business at 12500 TI Boulevard, Dallas, Texas 75266, U.S.A. (“TI”). Spansion, Spansion Nihon, and TI are collectively referred to as “Parties” to this Amendment and, individually, as a “Party” to this Amendment.
AMENDMENT NO. 2 TO THE AMENDED AND RESTATED FOUNDRY AGREEMENT DATED SEPTEMBER 28, 2006Foundry Agreement • May 13th, 2009 • Spansion Inc. • Semiconductors & related devices
THIS AMENDMENT NO. 2 (this “Amendment”) to the Amended and Restated Foundry Agreement made and entered into as of September 28, 2006, as amended effective as of June 19, 2008 (the “Agreement”), by and between Spansion Inc., a Delaware corporation, Spansion Technology, Inc., a Delaware corporation, and Spansion LLC, a Delaware limited liability company, solely in their capacities as guarantors of Spansion’s obligations hereunder and under the Agreement (“Guarantors”), Spansion Japan Limited, a Japanese corporation (“Spansion”), and Fujitsu Limited, a Japanese corporation (“Fujitsu”), and assigned by Fujitsu to Fujitsu Microelectronics Limited, a Japanese corporation (“FML”), effective March 21, 2008, is made and entered into to be effective as of December 31, 2008 (the “Amendment Date”).
FOUNDRY AGREEMENTFoundry Agreement • November 24th, 2009 • California
THIS FOUNDRY AGREEMENT (the “Agreement”) is made as of February 23, 2004 (the “Effective Date”), by and between FASL LLC, having its principal office at One AMD Place, Sunnyvale, California 94088-3453, U.S.A. (“FASL”), and FASL JAPAN LIMITED, having its registered place of business at 6, Mondenmachi-Kogyodanchi, Aizuwakamatsu 965, Japan (“FASL JAPAN”).
Amendment of Foundry AgreementFoundry Agreement • November 2nd, 2001 • Quicklogic Corporation • Semiconductors & related devices
The undersigned, QuickLogic Corporation, hereby agrees to amend the terms of the Foundry Agreement dated December 11, 2000 entered into with Tower Semiconductor Ltd. (the "Company")(the "Foundry Agreement") as set forth below:
FOUNDRY AGREEMENTFoundry Agreement • May 21st, 2012 • Integrated Device Technology Inc • Semiconductors & related devices • California
This FOUNDRY AGREEMENT (the “Agreement”) is made this 3rd day of August, 2009, (the “Effective Date”), by and between INTEGRATED DEVICE TECHNOLOGY, INC., a Delaware corporation with its principal place of business at 6024 Silver Creek Valley Road, San Jose, CA 95138 (“IDT”), Taiwan Semiconductor Manufacturing Co., Ltd., a company duly incorporated under the laws of the Republic of China with its principal place of business at No. 8, Li-Hsin Rd., 6, Science-Based Industrial Park, Hsin-Chu, Taiwan 300-77, R.O.C., and TSMC North America, a California corporation with its principal place of business at 2585 Junction Avenue, San Jose, CA 95014 (together with Taiwan Semiconductor Manufacturing Co., Ltd., “TSMC”).
Second Addendum to the FOUNDRY AGREEMENTFoundry Agreement • March 31st, 2010 • ALPHA & OMEGA SEMICONDUCTOR LTD
THIS Second Addendum (the “Second Addendum”) to the Foundry Agreement dated January 10, 2002 (the “Foundry Agreement”) is made effective as of the 11th day of April, 2007 (“Effective Date”) by and between Shanghai Hua Hong NEC Electronics Company Limited., a Chinese limited liability company with offices at No. 1188 Chuan Qiao Road, Pu Dong New District, Shanghai, China (“HHNEC”), and Alpha and Omega Semiconductor Limited, a Bermuda exempted company with offices at 495 Mercury Drive, Sunnyvale, California 94085, USA (“AOS”).
FIRST AMENDMENT TO FOUNDRY AGREEMENTFoundry Agreement • November 7th, 2008 • Spansion Inc. • Semiconductors & related devices
THIS FIRST AMENDMENT is by and between SPANSION LLC, a limited liability company organized in the State of Delaware, having its principal place of business at 915 DeGuigne Drive, Sunnyvale, California, 94088-3453, on behalf of itself and its Affiliates (hereinafter referred to as “Spansion”), and Semiconductor Manufacturing International Corporation, a Cayman Islands company, having its principal place of business at 18 Zhangjiang Road, Pudong New Area, Shanghai, P.R.C. Zip: 201203, on behalf of itself and its Affiliates, including without limitation the Facilities (as defined in the Foundry Agreement) (hereinafter called “SMIC”).
FOUNDRY AGREEMENTFoundry Agreement • September 21st, 2011 • Spansion Technology LLC • Semiconductors & related devices
FOUNDRY AGREEMENTFoundry Agreement • May 29th, 2015 • Akoustis Technologies, Inc. • Services-prepackaged software • California
This Foundry (Manufacturing) Agreement (this “Agreement”) is made this 27th day of February, 2015 between AKOUSTIS, INC., a Delaware corporation, and its affiliates (“AKOUSTIS”) and Global Communication Semiconductors, LLC, a California limited liability company (“GCS”) and is effective upon the Effective Date, collectively as “Parties” or singly as “Party.”
AM PRODUCT FOUNDRY AGREEMENTFoundry Agreement • November 1st, 2013 • Spansion Inc. • Semiconductors & related devices
This AM PRODUCT FOUNDRY AGREEMENT (the “Agreement”) is made and entered into as of the Closing Date (as defined in the Stock Purchase Agreement (as defined below)) (the “Effective Date”) by and between Fujitsu Semiconductor Limited, a corporation organized and existing under the laws of Japan, with a registered office at 2-10-23 Shinyokohama, Kohoku-ku, Yokohama, Kanagawa 222-0033, Japan (“FSL”) and Spansion LLC, a corporation organized and existing under the laws of Delaware, with a registered office at 915 DeGuigne Drive, Sunnyvale, California 94088-3453 (“Spansion”).
