Specification Testing and Compliance Sample Clauses

Specification Testing and Compliance. TSMC will produce Contract Wafers for Company that meet the Product Specifications and any other quality requirements defined in the Product Supplement. In that regard: (a) Foundry shall conduct Wafer sorting according to testing procedures and using test equipment mutually agreed by the Parties, or as specifically provided in a Product Supplement. Foundry must have sufficient testing capability to handle Contract Wafers sorting requirements, including the provision of engineering analysis of test Wafers sufficient to (i) identify potential product issues at the earliest possible stage and (ii) make necessary adjustments to Contract Wafers or Company Product. (b) After Wafer completion, Foundry shall conduct testing in accordance with the Product Specifications (“Verification Test Program”), and inspect and confirm that the Contract Wafer are free of defects in materials and workmanship, and conform to the applicable Product Specifications. Foundry shall neither ship nor ▇▇▇▇ Company for any Contract Wafer that, to Foundry’s knowledge, fails to meet the Minimum Yield and Quality and Reliability Standards unless specifically instructed in writing by Company to do so. Foundry may notify Company of any Contract Wafer that is below the Minimum Yield, and Company may, at its discretion, agree to accept delivery of such Wafer at a mutually agreed upon price. Foundry must notify Company in advance of shipment of those Contract Wafers that do not comply with the foregoing criteria. (c) If TSMC detects any significant wafer fabrication related defects in any Contract Wafers, TSMC will assist in the failure analysis, and provide a commercially reasonable efforts corrective action plan to correct the failure mechanisms and/or defects. Company may review TSMC’s quality measurement and control systems upon reasonable request. (d) From time to time Company may desire to update, revise or modify Product Specifications for Contract Wafers. TSMC will use commercially reasonable efforts to implement all revisions, updates, or modifications as soon as practicable, and at a reasonable cost. If such changes impact Contract Wafer Yield, the Parties shall re-set Target Yields using the same procedure as initially used. TSMC will advise Company of any cost and schedule impact, and the date and lot number of implementation of the revision, update or modification. (e) Results from TSMC testing processes will be accessible and available to Company for review and download to Company ...