Cycle Times Clause Samples
The Cycle Times clause defines the specific timeframes within which certain tasks, processes, or deliverables must be completed during the course of a contract or project. It typically sets measurable periods for each stage of work, such as production, delivery, or review, and may include benchmarks or deadlines that parties must meet. By establishing clear expectations for timing, this clause helps ensure efficient workflow management and accountability, reducing the risk of delays and misunderstandings between parties.
Cycle Times a) The standard roster pattern shall be an even time roster of up to 28 on duty days though, due to unforeseen circumstances, shortage of personnel with the required skills or due to the expected duration of the work, the roster pattern may by agreement be an alternative pattern that suits the particular requirements of the work. There will be no set limit on "seal to seal" times on the basis that decompression and bend watch are completed within the 28 days duty. It is acknowledged that the operational requirements of the job may require cycle times to be extended by agreement between the Employer and the employee/s and/or their nominated representative.
b) Where an Employer requires overcycle work to be performed such overcycle work shall be paid at the rate of double the Casual Base Rate plus allowances (ie Total Day Rate plus the Casual Base Rate). Overcycle rates shall apply from the 29th day of the duty/ work cycle.
Cycle Times. Proprietary and Confidential
Cycle Times. The Parties acknowledge and agree that the credits are paid in recognition of the diminished value of the Services resulting from Contractor’s failure to meet the agreed upon level of performance. Such credits are part of the compensation arrangement between the Parties, not a penalty or liquidated damages. Furthermore, the credits will not limit AT&T’s right to recover, in accordance with this Agreement, damages incurred by AT&T.
Cycle Times. SCI will record and report to LSI cycle times for manufacture and supply of the Products in industry-standard days per masking layer (“DPML”) by process technology. Promptly after the Effective Date, the Parties will establish cycle times for all process technologies by referencing the cycle times for the applicable Products obtained at the ▇▇▇▇▇▇▇ Facilities during the [*] period ending on the Effective Date. (Attachment C sets forth an example of cycle times.) SCI will measure DPML at the [*] percentile level and not as an average. If for any Product the DPML falls above the [*] percentile level for any measurement period or if during any measurement period there is reasonable evidence to indicate the DPML will be above the [*] percentile level when the relevant measurement for the period is made, SCI will promptly initiate such corrective actions, in coordination with LSI, as LSI reasonably deems appropriate.
Cycle Times. Cycle times, by Process for each Product, from TSMC's acceptance of MARVELL's Purchase Order until delivery of the Product to MARVELL's selected transportation carrier are set forth on Exhibit C attached hereto.
Cycle Times. Fermentation & Harvest The fermentation Process (from inoculation of the production vessel through to harvesting of the last of the culture) is estimated to be completed in no more than seven (7) days (168 hours). Occupation of any one (1) inoculum vessel is also required for no more than one (1) day (24 hours). Purification The Process is estimated to require no more than six (6) days (144 hours) occupation of the purification area for the process of each complete fermentation batch (including dispensing into final bulk containers). The total cycle time for each Batch is estimated to be no more than fourteen (14) days in the ABC 5000 facility. Occupancy times include time required for key in process control tests to be completed. B2422 Work Programme Timeline Wed 29/06/05 ID Task Name Duration Start Finish Predecessors 1 LOI signed 0 wks Fri 21/01/05 Fri 21/01/05 2 Stage 1 Data Review 9 wks Mon 20/12/04 Mon 21/02/05 12 Stage 1A Shipments to Avecia 8.57 wks Fri 21/01/05 Tue 22/03/05 18 Stage 2 Process Transfer & Fit 10 wks Mon 10/01/05 Mon 21/03/05 22 Regulatory Submission Reports 64.86 wks Mon 06/06/05 Sun 03/09/06 23 15L Familiarisation 2.29 wks Mon 11/07/05 Wed 27/07/05 30 15L Comparability 16.29 wks Mon 06/06/05 Wed 28/09/05 43 Centrifuge Trials 17.14 wks Mon 18/07/05 Tue 15/11/05 57 LPC#1 2.57 wks Fri 25/11/05 Tue 13/12/05 65 GMP Runs 24.57 wks Mon 10/10/05 Fri 31/03/06 78 LPC#2 2.57 wks Wed 10/05/06 Sun 28/05/06 86 Validation Campaign 19.57 wks Wed 19/04/06 Sun 03/09/06 100 Stage 3 Capital Specification and Procurement 28.4 wks Mon 21/03/05 Wed 05/10/05 101 Stage 3A Specification 7 wks Mon 21/03/05 Mon 09/05/05 118 Stage 3B Quotes / Order 25.83 wks Fri 08/04/05 Wed 05/10/05 135 Stage 4 15L Fermentation 22.79 wks Tue 08/03/05 Mon 15/08/05 136 Agreed scope of work with Nuvelo 0 wks Tue 15/03/05 Tue 15/03/05 7FF+6.2 wks 137 Receive R&D WCB vials 0 wks Mon 14/03/05 Mon 14/03/05 16 138 Receive RM CofA’s 0 wks Tue 08/03/05 Tue 08/03/05 9FS+3.5 wks 139 Order Av RM’s 1 wk Tue 15/03/05 Tue 22/03/05 136SS 140 Order Am RM’s 0 wks Mon 25/04/05 Mon 25/04/05 141 15L Fermentations #1a/b (Avecia media) 5 days Tue 05/04/05 Sun 10/04/05 11,137FS+22 days 142 Supply 15L #1 feedstock to DSP 0 wks Sun 10/04/05 Sun 10/04/05 141 143 15L #2a/b Fermentations (Avecia media) 5 days Tue 19/04/05 Sun 24/04/05 141FS+9 days 144 Supply 15L #2 feedstock to DSP 0 wks Sun 24/04/05 Sun 24/04/05 143 145 Interim Familiarisation Technical Data 7 wks Mon 25/04/05 Mon 13/06/05 144FS+1 day 14...
Cycle Times. NS and CSX agree to cooperate fully in the handling of SRC-owned equipment utilized in serving Kint▇▇▇ ▇▇▇ Mill▇▇▇▇ ▇▇▇tions.
Cycle Times. (a) TSMC shall use commercially reasonable efforts to ensure the following: (i) Wafers released from the Wafer Bank in accordance with Section 4.6(a) below will be processed at 1.0 days per masking layer provided the daily release quantity does not exceed 500 wafers per day in Fab 8 and 300 wafers per day in Fab 3 and (ii) non-bank Wafers shall be processed at 1.3 days per masking layer for the Products defined in Exhibit B Section 1.3; and at 1.4 days per masking layer for the Products defined in Exhibit B Section 1.4;1.5 and 1.6.
(b) Notwithstanding the foregoing, at each TSMC Facility qualified for running IDT products utilizing wafer banking, TSMC reserve three (3) “hot lots” for Engineering Wafers to be processed at a maximum of 0.8 days per masking layer, for no additional expediting fee.
(c) The foregoing cycle time in this Section 4.4 shall only apply to the Products defined in Exhibit B.