EXHIBIT 10.66 ESS TECHNOLOGY, INC. AMENDED AND RESTATED STOCK OPTION AGREEMENT 1. OPTION. This Amended and Restated Stock Option Agreement sets forth the terms applicable to the option (the "Option") previously granted by ESS Technology, Inc., a...Stock Option Agreement • February 3rd, 2005 • Ess Technology Inc • Semiconductors & related devices
ANDLoan Agreement • November 14th, 2002 • Ess Technology Inc • Semiconductors & related devices • California
Exhibit 10.51 LICENSE AGREEMENT AND MUTUAL RELEASE THIS LICENSE AGREEMENT AND MUTUAL RELEASE (the "Agreement") is made and entered into as of June 11, 2003(the "Effective Date"), by and between ESS TECHNOLOGY INTERNATIONAL, INC. ("ETI"), ESS...License Agreement • August 14th, 2003 • Ess Technology Inc • Semiconductors & related devices • California
RECITALSLoan Agreement • August 9th, 2004 • Ess Technology Inc • Semiconductors & related devices
Exhibit 10.53 AMENDMENT NUMBER ONE TO LOAN AGREEMENT This AMENDMENT NUMBER ONE TO LOAN AGREEMENT (the "Amendment"), dated as of July 17, 2003, is entered into by and between U.S. BANK NATIONAL ASSOCIATION ("Lender"), and ESS TECHNOLOGY, INC., a...Loan Agreement • November 14th, 2003 • Ess Technology Inc • Semiconductors & related devices
Exhibit 2.1 ESS TECHNOLOGY, INC. AGREEMENT AND PLAN OF MERGER AUGUST 15, 2003 TABLE OF CONTENTSAgreement and Plan of Merger • September 2nd, 2003 • Ess Technology Inc • Semiconductors & related devices • California
1 EXHIBIT 10.39 EMPLOYEE MATTERS AGREEMENTEmployee Matters Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices • California
RECITALSJoint Development Agreement • March 31st, 2003 • Ess Technology Inc • Semiconductors & related devices • California
1 EXHIBIT 10.32 ESS TECHNOLOGY, INC. RESIGNATION AGREEMENT This Resignation Agreement ("AGREEMENT") is made as of August 6, 1998, by and between ESS Technology, Inc. (the "COMPANY"), and John H. Barnet (the "EMPLOYEE"). WHEREAS, the Employee wishes to...Resignation Agreement • November 16th, 1998 • Ess Technology Inc • Semiconductors & related devices • California
1 EXHIBIT 10.43 MASTER TRANSITIONAL SERVICES AGREEMENTMaster Transitional Services Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices
1 EXHIBIT 10.42 MASTER CONFIDENTIAL DISCLOSURE AGREEMENTMaster Confidential Disclosure Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices
RECITALMaster Technology Ownership and License Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices
Exhibit 10.52 ADDENDUM TO THE LICENSE AGREEMENT AND MUTUAL RELEASE Reference is made to the LICENSE AGREEMENT AND MUTUAL RELEASE (the "Agreement") made and entered into as of June 11, 2003, by and between ESS Technology International Inc. ("ETI"), ESS...The License Agreement • November 14th, 2003 • Ess Technology Inc • Semiconductors & related devices
1 EXHIBIT 10.29 ESS TECHNOLOGY, INC. AGREEMENT AND MUTUAL RELEASE This Agreement and Mutual Release ("AGREEMENT") is made by and between ESS Technology, Inc. (the "COMPANY"), and Herbert J. Martin (the "EMPLOYEE"). WHEREAS, the Company and Employee...Agreement and Mutual Release • March 18th, 1997 • Ess Technology Inc • Semiconductors & related devices • California
1 EXHIBIT 2.04 MASTER DISTRIBUTION AGREEMENTMaster Distribution Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices • California
BETWEENReal Estate Matters Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices
RESEARCH AND DEVELOPMENT SERVICE AGREEMENTResearch and Development Service Agreement • May 15th, 2000 • Ess Technology Inc • Semiconductors & related devices • California
ESS To: Fred Chan From: Bo Ericsson Date: November 26, 1997 Re: EXIT AGREEMENT 1. Ericsson's last date of full time employment will be Dec 12 1997. Ericsson will serve as a consultant, reporting to Nicholas Aretakis, on a part time basis for an...Ess Technology Inc • March 31st, 1998 • Semiconductors & related devices
ADMINISTRATIVE AND MANAGEMENT SERVICE AGREEMENT (ESS to VIALTA) THIS ADMINISTRATIVE AND MANAGEMENT SERVICE AGREEMENT (this "Agreement") is entered into effective as of August 1, 1999 by and between VIALTA.com, a California corporation, with offices at...Administrative and Management Service Agreement • May 15th, 2000 • Ess Technology Inc • Semiconductors & related devices • California
AGREEMENT OF PURCHASE AND SALEAgreement of Purchase and Sale • November 9th, 2007 • Ess Technology Inc • Semiconductors & related devices • California
On ___, 2007, before me, , a notary public for the State of California, personally appeared , personally known to me (or proved to me on the basis of satisfactory evidence) to be the person whose name is subscribed to the within instrument and acknowledged to me that he/she executed the same in his/her authorized capacity, and that by his/her signature on the instrument the person, or the entity on behalf of which the person acted, executed the instrument.
ESS-SILAN AUDIO AND VIDEO TECHNOLOGY LICENSE AGREEMENT (v.3.0)Video Technology License Agreement • April 28th, 2008 • Ess Technology Inc • Semiconductors & related devices • California
THIS LICENSE AGREEMENT (this “Agreement”) is entered into on April 23, 2008 (the “Agreement Date”), by and between ESS Technology, Inc., a California corporation having its principal place of business at 48401 Fremont Blvd., Fremont, California 94538, U.S.A. (“ESS”), and Hangzhou Silan Microelectronics Co., Ltd., having its principal place of business at No. 4 Huang Gu Shan Road, Post Code 310012, Hang-Zhou, P.R. China (“Silan”).
RECITALSTax Sharing and Indemnity Agreement • September 5th, 2001 • Ess Technology Inc • Semiconductors & related devices
SILAN-ESS COOPERATION IN VCD AGREEMENTEss Technology Inc • November 9th, 2005 • Semiconductors & related devices • California
Therefore, in consideration of the mutual benefits flowing from cooperation in future VCD products, both parties agree as follows:
AGREEMENT AND PLAN OF MERGER by and among SEMICONDUCTOR HOLDING CORPORATION ECHO MERGERCO, INC. ESS TECHNOLOGY, INC. and ECHO TECHNOLOGY (DELAWARE), INC. Dated as of February 21, 2008Agreement and Plan of Merger • February 22nd, 2008 • Ess Technology Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”), dated February 21, 2008, is entered into by and among Semiconductor Holding Corporation, a Delaware corporation and wholly owned subsidiary of Imperium Master Fund, Ltd. (“Parent”), Echo Mergerco, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), ESS Technology, Inc., a California corporation (the “Company”) and Echo Technology (Delaware), Inc., a Delaware corporation and a wholly owned subsidiary of the Company (“Delaware Merger Sub”).
ASSIGNMENT OF INTELLECTUAL PROPERTY THIS ASSIGNMENT OF INTELLECTUAL PROPERTY ("Assignment") is entered into effective as of January 1, 2000 (the "Effective Date"), by and between ESS Technology, Inc., a California corporation, with an office at 48401...Assignment of Intellectual • May 15th, 2000 • Ess Technology Inc • Semiconductors & related devices • California
PURCHASE AGREEMENT THIS PURCHASE AGREEMENT (the "Agreement") is entered into effective as of August 1, 1999 by and between VIALTA.com, a California corporation, with principal offices at 48401 Fremont Boulevard, Fremont, California 94538 ("Buyer") and...Purchase Agreement • May 15th, 2000 • Ess Technology Inc • Semiconductors & related devices • California
1 EXHIBIT 2.1 FIRST AMENDED AND RESTATED AGREEMENT AND PLAN OF REORGANIZATION DATED AS OF APRIL 27, 1997Agreement and Plan of Reorganization • June 24th, 1997 • Ess Technology Inc • Semiconductors & related devices • California
ACCELERATION AGREEMENTAcceleration Agreement • March 16th, 2005 • Ess Technology Inc • Semiconductors & related devices • California
This Acceleration Agreement (the “Agreement”) is entered into as of ________, 2005 (the “Effective Date”), by and between ________ (the “Optionee”) and ESS Technology, Inc., a California corporation (the “Company”).
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • May 10th, 2007 • Ess Technology Inc • Semiconductors & related devices • California
This Asset Purchase Agreement (the “Agreement”) is entered into as of February 15, 2007, by and between Silicon Integrated Systems Corporation, a California corporation (“Buyer”) ESS Technology, Inc., a California corporation (“US Seller”) and ESS Technology International, Inc., a Cayman corporation (“Cayman Seller”, and collectively with US Seller, “Seller”).
ACCELERATION AGREEMENTAcceleration Agreement • March 16th, 2005 • Ess Technology Inc • Semiconductors & related devices • California
This Acceleration Agreement (the “Agreement”) is entered into as of _______, 2005 (the “Effective Date”), by and between _______ (the “Optionee”) and ESS Technology, Inc., a California corporation (the “Company”).
COMMON STOCKEss Technology Inc • January 3rd, 2002 • Semiconductors & related devices • New York
Exhibit 10.55 FIRST AMENDMENT TO LEASE AGREEMENT This First Amendment to the Amended and Restated Commercial Lease Agreement ("Amendment") is made and entered into as of July 1, 2003, by and between ESS Technology Inc., a California corporation...Lease Agreement • March 15th, 2004 • Ess Technology Inc • Semiconductors & related devices
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • May 10th, 2007 • Ess Technology Inc • Semiconductors & related devices • California
This Asset Purchase Agreement (the “Agreement”) is entered into as of February 15, 2007, by and between SiS Holding Limited, a company organized under the laws of the Cayman Islands (“Buyer”), ESS Technology, Inc., a California corporation (“US Seller”) and ESS Technology International, Inc., a Cayman corporation (“Cayman Seller,” and collectively with US Seller, “Seller”).
ESS-SILAN DVD TECHNOLOGY LICENSE AGREEMENTLicense Agreement • March 16th, 2007 • Ess Technology Inc • Semiconductors & related devices • California
THIS LICENSE AGREEMENT (the “Agreement”), effective as of November 3, 2006 (the “Effective Date”), is entered into by and between ESS Technology, Inc., a California corporation having its principal place of business at 48401 Fremont Blvd., Fremont, California 94538, U.S.A. (“ESS”), and Hangzhou Silan Microelectronics Co., Ltd., having its principal place of business at No. 4 Huang Gu Shan Road, Post Code 310012, Hang-Zhou, P.R. China (“Silan”).
