CONSENT TO SUBLEASELease • September 27th, 2010 • Sige Semiconductor Inc • Semiconductors & related devices • Massachusetts
THIS CONSENT TO SUBLEASE (this “Consent”) is entered into as of the 3lst day of January, 2008, by and among TRANSWESTERN BRICKSTONE SQUARE, L.L.C., a Delaware limited liability company (“Landlord”), PALM, INC., a Delaware corporation (“Sublandlord”), and SIGE SEMICONDUCTOR, INC., a Delaware corporation (“Subtenant”).
OFFICE LEASE BETWEEN TRANSWESTERN BRICKSTONE SQUARE, L.L.C., AS LANDLORD AND SIGE SEMICONDUCTOR, INC., AS TENANT BRICKSTONE SQUARE ANDOVER, MASSACHUSETTSOffice Lease • March 21st, 2011 • Sige Semiconductor Inc • Semiconductors & related devices
This Office Lease (the “Lease”) is made and entered into on this the 31st day of January, 2011, between TRANSWESTERN BRICKSTONE SQUARE, L.L.C., a Delaware limited liability company (“Landlord”), and SIGE SEMICONDUCTOR, INC., a Delaware corporation (“Tenant”).
AMENDMENT AND WAIVER March 15, 2011Amendment and Waiver • March 21st, 2011 • Sige Semiconductor Inc • Semiconductors & related devices • Delaware
This Amendment and Waiver (the “Agreement”) is by and among (a) SiGe Semiconductor, Inc., a Delaware corporation (the “Company”), and (b) the Investors (as defined in the Investor Rights Agreement (as defined below)) who hold a majority in interest of the Registrable Securities (as defined in the Investor Rights Agreement) and the Preferred Registrable Securities (as defined in the Investor Rights Agreement).
ContractSige Semiconductor Inc • September 27th, 2010 • Semiconductors & related devices
We refer to the agreement dated October 15, 2009 between SiGe Semiconductor Inc., as the “Borrower” and Royal Bank of Canada, as the “Bank” (the “Agreement”) and in particular to the Credit Facilities, Other Facilities, Security and Financial Covenants sections as well as the Terms and Conditions and Schedules “A” and “H” of the Agreement.
AMENDED AND RESTATED INVESTOR RIGHTS AGREEMENT May 8, 2007Investor Rights Agreement • August 17th, 2010 • Sige Semiconductor Inc • Semiconductors & related devices • Delaware
THIS AMENDED AND RESTATED INVESTOR RIGHTS AGREEMENT (this “Agreement”) is made as of the 8th day of May, 2007 by and among (i) SiGe Semiconductor, Inc., a Delaware corporation (the “Company”), (ii) SiGe Semiconductor Inc., a Canadian corporation and subsidiary of the Company (the “Canadian Subsidiary”), (iii) SVIC No. 4 New Technology Business Investment L.L.P. (“Samsung”), (iv) the other investors listed on Schedule A hereto (the “Existing Investors”), (v) each person who shall, after the date hereof, acquire shares of Series A-1 Preferred or Class A-1 Exchangeable Shares (each as defined below) and join in and become a party to this Agreement as an Investor by executing and delivering to the Company an Instrument of Accession (an “Instrument of Accession”) in the form of Schedule B hereto (together with Samsung and the Existing Investors, each an “Investor” and collectively, the “Investors”), (vi) International Business Machines Corporation and (vii) Fraser Milner Casgrain LLP (the “
Dated the 7th day of July 2010 HONG KONG SCIENCE AND TECHNOLOGY PARKS CORPORATION as Landlord and SIGE SEMICONDUCTOR (HONG KONG) LIMITED as Tenant LEASE of Units 309 and 310 of the 3rd Floor of Lakeside 1, No. 8 Science Park West Avenue, Phase Two,...Sige Semiconductor Inc • August 17th, 2010 • Semiconductors & related devices • Hong Kong
Net Office Lease INDEXOffice Lease Index • August 17th, 2010 • Sige Semiconductor Inc • Semiconductors & related devices
WHEREAS the Lessor is registered as owner, subject to such encumbrances, liens and interests as are notified by memorandum underwritten (or endorsed hereon) of that certain parcel of land municipally described as 1050 Morrison Drive and situated in the City of Ottawa in the Province of Ontario and more particularly described in Schedule “A” attached hereto (hereinafter called the “Land”) upon which Land is situated an office building and related improvements (the said office building and all other fixed improvements now or hereafter on the Land being hereinafter referred to as the “Building”); and,
CONFIDENTIAL TREATMENT REQUESTED]*/ INDICATES MATERIAL THAT HAS BEEN OMITTED AND FOR WHICH CONFIDENTIAL TREATMENT HAS BEEN REQUESTED. ALL SUCH OMITTED MATERIAL HAS BEEN FILED WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO RULE 406 PROMULGATED...Payment Agreement • March 21st, 2011 • Sige Semiconductor Inc • Semiconductors & related devices • California
This PAYMENT AGREEMENT (together with any Exhibits hereto, this “Agreement”) is entered into as of July 28, 2010 by and between Redpipe Networks, Inc., a California corporation (“Redpipe”), and SiGe Semiconductor, Inc., a Delaware corporation (“Supplier”).
CONDITIONAL GRANT AGREEMENTConditional Grant Agreement • August 17th, 2010 • Sige Semiconductor Inc • Semiconductors & related devices • Ontario
WITNESS that in consideration of the mutual promises and obligations contained in this Agreement, and other good and valuable consideration, the receipt and sufficiency of which are hereby expressly acknowledged by the parties, Ontario and the Recipient covenant and agree as follows:
SiGe Semiconductor, Inc. STOCK OPTION AGREEMENT 2002 Stock Plan ONTARIO PARTICIPANTSAgreement • September 27th, 2010 • Sige Semiconductor Inc • Semiconductors & related devices • Ontario
THIS AGREEMENT is entered into by and between SiGe Semiconductor, Inc., a Delaware corporation with its principal office at 1050 Morrison Drive, Suite 100, Ottawa, Ontario K2H 8K7, Canada (hereinafter the “Company”), and the undersigned Employee, Director or Consultant of the Company Group (as such term is defined below) (hereinafter the “Participant”).
CONFIDENTIAL TREATMENT REQUESTED]*/ INDICATES MATERIAL THAT HAS BEEN OMITTED AND FOR WHICH CONFIDENTIAL TREATMENT HAS BEEN REQUESTED. ALL SUCH OMITTED MATERIAL HAS BEEN FILED WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO RULE 406 PROMULGATED...Payment Agreement • August 17th, 2010 • Sige Semiconductor Inc • Semiconductors & related devices • California
This PAYMENT AGREEMENT (together with any Exhibits hereto, this “Agreement”) is entered into as of July 28, 2010 by and between /*[CONFIDENTIAL TREATMENT REQUESTED]*/, a California corporation (“/*[CONFIDENTIAL TREATMENT REQUESTED]*/”), and SiGe Semiconductor, Inc., a Delaware corporation (“Supplier”).
