TTM Technologies Inc Sample Contracts
LEASE AGREEMENTLease Agreement • June 22nd, 2000 • TTM Technologies Inc
BETWEENStock Purchase Agreement • December 27th, 2002 • TTM Technologies Inc • Printed circuit boards • New York
Exhibit 4.5 PACIFIC CIRCUITS, INC. WARRANT AGREEMENT This WARRANT AGREEMENT is dated as of July 13, 1999 (the "AGREEMENT") and entered into by and among Pacific Circuits, Inc., a Washington corporation (the "COMPANY "), and the purchasers party hereto...Warrant Agreement • June 22nd, 2000 • TTM Technologies Inc • New York
Exhibit 10.18 FIRST AMENDMENT TO LEASE This First Amendment to Lease ("Amendment") is made as of February 1999 by Harbor Building, LLC ("Lessor") and Power Circuits, Inc. ("Lessee") with respect to the following: A. Lessor and Lessee are parties to...Lease • June 22nd, 2000 • TTM Technologies Inc
Exhibit 4.6 SUBSCRIPTION AGREEMENT (this "AGREEMENT"), dated as of July 13, 1999 (this "AGREEMENT"), by and among PACIFIC CIRCUITS, INC., a Washington corporation (the "COMPANY") and those purchasers of the Company's common stock listed on Schedule I...Subscription Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
among TTM TECHNOLOGIES, INC., as Borrower,Credit Agreement • November 16th, 2000 • TTM Technologies Inc • Printed circuit boards • North Carolina
Exhibit 1.1: Form of Underwriting Agreement UNDERWRITING AGREEMENT September __, 2000 Robertson Stephens, Inc. Chase Securities Inc. Donaldson, Lufkin & Jenrette Securities Corporation First Union Securities, Inc. as Representatives of the several...Underwriting Agreement • September 20th, 2000 • TTM Technologies Inc • Printed circuit boards • New York
EXCHANGE AGREEMENT AND PLAN OF REORGANIZATIONExchange Agreement • August 4th, 2000 • TTM Technologies Inc • Printed circuit boards • Washington
FORM OF DIRECTOR AND OFFICER [AMENDED AND RESTATED] INDEMNIFICATION AGREEMENTIndemnification Agreement • December 15th, 2014 • TTM Technologies Inc • Printed circuit boards • Delaware
THIS [AMENDED AND RESTATED] INDEMNIFICATION AGREEMENT (the “Agreement”) is made and entered into as of [ ], 2014 between TTM Technologies, Inc., a Delaware corporation (the “Company”), and [ ] (“Indemnitee”).
TTM TECHNOLOGIES, INC. AND AMERICAN STOCK TRANSFER & TRUST COMPANY, LLC, as Trustee INDENTURE Dated as of December 20, 2013 1.75% Convertible Senior Notes due 2020Indenture • December 20th, 2013 • TTM Technologies Inc • Printed circuit boards • New York
INDENTURE, dated as of December 20, 2013, between TTM TECHNOLOGIES, INC., a Delaware corporation, as issuer (the “Company”, as more fully set forth in Section 1.01) and AMERICAN STOCK TRANSFER & TRUST COMPANY, LLC, a New York limited liability trust company, as trustee (the “Trustee”, as more fully set forth in Section 1.01).
TTM Technologies, Inc.Underwriting Agreement • December 20th, 2013 • TTM Technologies Inc • Printed circuit boards • New York
TTM Technologies, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as Representatives (the “Representatives”), an aggregate of $220,000,000 principal amount of its 1.75% Convertible Senior Notes due 2020 (the “Firm Securities”), and, at the option of the Underwriters, up to an additional aggregate of $30,000,000 principal amount of its 1.75% Convertible Senior Notes due 2020 (the “Additional Securities”). The Firm Securities and the Additional Securities are herein referred to as the “Securities.” The Securities will be issued pursuant to an Indenture dated as of December 20, 2013 (the “Indenture”), between the Company and American Stock Transfer & Trust Company, LLC (the “Trustee”). The Securities will be convertible into cash, shares (the “Underlying Securities”) of common stock of the Company, par value $0.001 per share (the “Common Stock”) or a combination o
EMPLOYMENT AGREEMENTEmployment Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
Ms. Stacey Peterson 455 Longfellow Avenue Hermosa Beach, CA 90254 Dear Stacey: This letter is intended to reflect your most recent discussions with Doug McCormick regarding your compensation package at TTM to ensure that we are in agreement on the...Employment Agreement • August 4th, 2000 • TTM Technologies Inc • Printed circuit boards
Exhibit 10.8 EMPLOYMENT AGREEMENT This Employment Agreement (the "AGREEMENT") dated as of December 15, 1998 is entered into between PACIFIC CIRCUITS, INC., a Washington corporation (the "COMPANY"), and Steve Pointer (the "EMPLOYEE"). In consideration...Employment Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
and theSecurities Purchase Agreement • June 22nd, 2000 • TTM Technologies Inc • New York
EMPLOYMENT AGREEMENT --------------------Employment Agreement • August 4th, 2000 • TTM Technologies Inc • Printed circuit boards • Washington
TTM TECHNOLOGIES, INC. 12,000,000 Shares of Common Stock Underwriting AgreementUnderwriting Agreement • November 18th, 2016 • TTM Technologies Inc • Printed circuit boards • New York
The stockholder named in Schedule 2 hereto (the “Selling Stockholder”) of TTM Technologies, Inc., a Delaware corporation (the “Company”), proposes to sell to the several underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as representative (in such capacity, the “Representative”), an aggregate of 12,000,000 shares of common stock, par value $0.001 per share (the “Common Stock”), of the Company (the “Underwritten Shares”), and, at the option of the Underwriters, up to an additional 1,800,000 shares of Common Stock of the Company (the “Option Shares”). The Underwritten Shares and the Option Shares are herein referred to as the “Shares.” The shares of Common Stock of the Company to be outstanding after giving effect to the sale of the Shares are referred to herein as the “Stock.”
PART II AMENDMENTS TO EXISTING CREDIT AGREEMENTCredit Agreement • November 16th, 2000 • TTM Technologies Inc • Printed circuit boards
ARTICLE I DEFINITIONSRegistration Rights Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
EMPLOYMENT AGREEMENTEmployment Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
Exhibit 10.3 AMENDED, RESTATED AND CONSOLIDATED MANAGEMENT AND CONSULTING AGREEMENT TC MANAGEMENT, L.L.C. TC MANAGEMENT IV, L.L.C. BROCKWAY MORAN & PARTNERS MANAGEMENT, L.P. SEPTEMBER 19, 2000 TTM Technologies, Inc. 17550 N.E. 67th Court Redmond, WA...Management and Consulting Agreement • November 16th, 2000 • TTM Technologies Inc • Printed circuit boards • Washington
Exhibit 10.17 INDEMNIFICATION AGREEMENT This Indemnification Agreement ("Agreement") is made as of August ___, 2000 by and between TTM Technologies, Inc., a Washington corporation (the "Company"), and [______________] ("Indemnitee"). WHEREAS,...Indemnification Agreement • August 4th, 2000 • TTM Technologies Inc • Printed circuit boards • Washington
SENIOR NOTES INDENTURE Dated as of March 10, 2021 Among TTM TECHNOLOGIES, INC. THE GUARANTORS LISTED ON THE SIGNATURE PAGES HERETO and WILMINGTON TRUST, NATIONAL ASSOCIATION, as Trustee 4.000% SENIOR NOTES DUE 2029Senior Notes Indenture • March 10th, 2021 • TTM Technologies Inc • Printed circuit boards • New York
INDENTURE, dated as of March 10, 2021, among TTM Technologies, Inc., a Delaware corporation (the “Company”), the Guarantors listed on the signature pages hereto and Wilmington Trust, National Association, as Trustee.
ARTICLE I DEFINITIONSRegistration Rights Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
AMENDED AND RESTATED TERM LOAN CREDIT AGREEMENT among TTM TECHNOLOGIES, INC. as Borrower, The Several Lenders from Time to Time Parties Hereto, JPMORGAN CHASE BANK, N.A., as Administrative Agent, Dated as of May 30, 2023, JPMORGAN CHASE BANK, N.A.,...Term Loan Credit Agreement • May 30th, 2023 • TTM Technologies Inc • Printed circuit boards • New York
AMENDED AND RESTATED TERM LOAN CREDIT AGREEMENT (this “Agreement”), dated as of May 30, 2023, among TTM Technologies, Inc., a Delaware corporation (the “Borrower”), the several banks and other financial institutions or entities from time to time parties to this Agreement (the “Lenders”), JPMorgan Chase Bank, N.A., as administrative agent, and the other agents from time to time parties hereto.
TTM TECHNOLOGIES, INC. MANAGEMENT STOCK OPTION AGREEMENT STOCK OPTION AGREEMENT, dated as of ______________ (the "GRANT DATE"), between TTM Technologies, Inc., a Washington corporation (the "COMPANY"), __________ (the "PARTICIPANT"). 1. DEFINITIONS;...Management Stock Option Agreement • August 4th, 2000 • TTM Technologies Inc • Printed circuit boards • Washington
FIRST AMENDMENTAbl Credit Agreement • August 6th, 2024 • TTM Technologies Inc • Printed circuit boards • New York
AMENDED AND RESTATED ABL CREDIT AGREEMENT (this “Agreement”), dated as of May 30, 2023, among TTM Technologies, Inc., a Delaware corporation (the “Borrower”), the several banks and other financial institutions or entities from time to time parties to this Agreement (the “Lenders”), JPMorgan Chase Bank, N.A., as administrative agent, and the other agents from time to time parties hereto.
Exhibit 10.17 AMERICAN INDUSTRIAL REAL ESTATE ASSOCIATION STANDARD INDUSTRIAL/COMMERCIAL SINGLE-TENANT LEASE - NET (DO NOT USE THIS FORM FOR MULTI-TENANT BUILDINGS) 1. BASIC PROVISIONS ("BASIC PROVISIONS") 1.1 PARTIES: This Lease ("Lease"), dated for...Standard Industrial/Commercial Single-Tenant Lease - Net • June 22nd, 2000 • TTM Technologies Inc
CREDIT AGREEMENT dated as of October 27, 2006, among TTM TECHNOLOGIES, INC., as Borrower, THE GUARANTORS PARTY HERETO, as Guarantors, THE LENDERS PARTY HERETO and UBS SECURITIES LLC, as Sole Lead Arranger and Sole Bookrunner, BANK OF AMERICA, N.A.,...Credit Agreement • November 2nd, 2006 • TTM Technologies Inc • Printed circuit boards • New York
This CREDIT AGREEMENT (this “Agreement”), dated as of October 27, 2006, among TTM TECHNOLOGIES, INC., a Delaware corporation (“Borrower”), the Guarantors (such term and each other capitalized term used but not defined herein having the meaning given to it in Article I), the Lenders, UBS SECURITIES LLC, as sole lead arranger (in such capacity, “Arranger”) and sole bookrunner, BANK OF AMERICA, N.A., COMERICA BANK and SILICON VALLEY BANK, as co-documentation agents (in such capacities, “Co-Documentation Agents”), JPMORGAN CHASE BANK, N.A., as syndication agent (in such capacity, “Syndication Agent”), UBS LOAN FINANCE LLC, as swingline lender (in such capacity, “Swingline Lender”), and UBS AG, STAMFORD BRANCH, as issuing bank (in such capacity, “Issuing Bank”), as administrative agent (in such capacity, “Administrative Agent”) for the Lenders and as collateral agent (in such capacity, “Collateral Agent”) for the Secured Parties and Issuing Bank.
RECAPITALIZATION AND STOCK PURCHASE AGREEMENTRecapitalization and Stock Purchase Agreement • June 22nd, 2000 • TTM Technologies Inc • Washington
JPMorgan Chase Bank, National Association London Branch Canary Wharf London E14 5JP EnglandBase Call Option Transaction • December 20th, 2013 • TTM Technologies Inc • Printed circuit boards • New York
The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between JPMorgan Chase Bank, National Association, London Branch (“Dealer”) and TTM Technologies, Inc. (“Counterparty”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. This Confirmation shall replace any previous agreements and serve as the final documentation for the Transaction.
EMPLOYMENT AGREEMENT This Employment Agreement (the "Employment Agreement"), dated as of July 13, 1999 (the "Effective Date"), is between Power Circuits, Inc. ("PCI") and James Eisenberg ("Executive"). PCI and Executive agree as set forth below. 1....Employment Agreement • June 22nd, 2000 • TTM Technologies Inc • California
AMENDED AND RESTATED FACILITY AGREEMENT DATED 14 JUNE 2023 US$150,000,000Facility Agreement • June 20th, 2023 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated ____ between, among others, TTM Technologies Enterprises (HK) Limited as a Borrower and The Hongkong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
10,000,000] Shares TTM TECHNOLOGIES, INC. COMMON STOCK UNDERWRITING AGREEMENT Dated September , 2003Underwriting Agreement • September 2nd, 2003 • TTM Technologies Inc • Printed circuit boards • New York
FORM OF EXECUTIVE CHANGE IN CONTROL SEVERANCE AGREEMENTExecutive Change in Control Severance Agreement • May 6th, 2016 • TTM Technologies Inc • Printed circuit boards • California
This Executive Change in Control Severance Agreement (this “Agreement”), is made as of the day of , 20 (the “Effective Date”), by and between TTM Technologies, Inc., a Delaware corporation (the “Company”), and (the “Executive”).