Viasystems Inc Sample Contracts

1 EXHIBIT 10.26 VIASYSTEMS, INC. 9 3/4% Series B Senior Subordinated Notes due 2007 PURCHASE AGREEMENT
Viasystems Inc • March 31st, 1998 • Printed circuit boards • New York
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AGREEMENT
Agreement • March 31st, 1998 • Viasystems Inc • Printed circuit boards
RECITALS:
Agreement and Plan of Merger • June 20th, 1997 • Viasystems Inc • Delaware
and
Share Purchase Agreement • October 15th, 1999 • Viasystems Inc • Printed circuit boards • Hong Kong
RECITALS:
Agreement and Plan of Merger • June 20th, 1997 • Viasystems Inc • Delaware
SECOND AMENDMENT
Viasystems Inc • March 31st, 1998 • Printed circuit boards • New York
1 EXHIBIT 4.4 SECOND AMENDED AND RESTATED CREDIT AGREEMENT
Credit Agreement • June 20th, 1997 • Viasystems Inc • New York
AGREEMENT BETWEEN
Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards
EXHIBIT 4.5 AMENDED AND RESTATED GUARANTEE AND COLLATERAL AGREEMENT
Guarantee and Collateral Agreement • June 20th, 1997 • Viasystems Inc • New York
JANUARY 1998 AGREEMENT
Viasystems Inc • March 31st, 1998 • Printed circuit boards
INDENTURE
Indenture • March 31st, 1998 • Viasystems Inc • Printed circuit boards • New York
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RECITALS:
4 Agreement and Plan of Merger • June 20th, 1997 • Viasystems Inc • Delaware
AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENT
Executive Employment Agreement • November 14th, 2005 • Viasystems Inc • Printed circuit boards • Missouri

This Agreement is made and entered into as of the 15th day of August, 2005 by and among Viasystems Group, Inc. ("Viasystems") and, Viasystems, Inc. ("Inc." and, together with Viasystems and the other subsidiaries of Viasystems set forth on the signature pages hereto, "Employer"), and Gerald G. Sax ("Employee").

FOURTH AMENDMENT TO THE CREDIT AGREEMENT
The Credit Agreement • March 30th, 2005 • Viasystems Inc • Printed circuit boards • New York

FOURTH AMENDMENT, dated as of March 18, 2005 (the “Amendment”), to the Credit Agreement, dated as of January 31, 2003, as amended by the First Amendment dated as of March 19, 2003, the Second Amendment dated as of December 3, 2003 and the Third Amendment and First Waiver dated as of October 7, 2004 (the “Credit Agreement”), among VIASYSTEMS GROUP, INC. (“Holdings”), VIASYSTEMS, INC. (the “Borrower”), the several banks and other financial institutions from time to time parties thereto (the “Lenders”) and JPMORGAN CHASE BANK, N.A., as administrative agent for the Lenders (in such capacity, the “Administrative Agent”).

RECITALS:
Acquisition Agreement • June 20th, 1997 • Viasystems Inc • New York
June 15, 2005 David J. Webster St. Louis, MO 63105 Dear Dave:
Viasystems Inc • March 31st, 2006 • Printed circuit boards

Reference is hereby made to that certain Amended and Restated Executive Employment Agreement dated as of January 31, 2003 by and among Viasystems Group, Inc. (“Group” and, together with its subsidiaries parties thereto, “Viasystems”) and David J. Webster (“Employee”). Group is currently exploring the sale of the wire harness division (the “Division”). In connection therewith, Employee and Wire Harness Industries, Inc. entered into an agreement (the “Harness Agreement”) dated as of June _15_, 2005.

STOCK PURCHASE AGREEMENT BY AND AMONG ELECTRICAL COMPONENTS INTERNATIONAL HOLDINGS COMPANY, VIASYSTEMS GROUP, INC., WIRE HARNESS HOLDING COMPANY, INC. AND WIRE HARNESS INDUSTRIES, INC. Dated as of March 21, 2006
Stock Purchase Agreement • March 22nd, 2006 • Viasystems Inc • Printed circuit boards • New York

This STOCK PURCHASE AGREEMENT, dated as of March 21, 2006 (this “Agreement”), is entered into by and among Electrical Components International Holdings Company, a Delaware corporation (“Purchaser”), Viasystems Group, Inc., a Delaware corporation (“Parent”), Wire Harness Holding Company, Inc., a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Seller”), and Wire Harness Industries, Inc., a Delaware corporation and a direct wholly-owned subsidiary of Seller (the “Company”).

AGREEMENT
Agreement • August 23rd, 2006 • Viasystems Inc • Printed circuit boards

US$80,000,000 CREDIT FACILITIES for VIASYSTEMS KALEX PRINTED CIRCUIT BOARD LIMITED VIASYSTEMS ASIA PACIFIC COMPANY LIMITED KALEX CIRCUIT BOARD (CHINA) LIMITED arranged by UBS AG HONG KONG BRANCH with UBS AG, SINGAPORE BRANCH as Facility Agent and UBS AG, SINGAPORE BRANCH as Security Agent 17 August, 2006

VIASYSTEMS, INC. AND EACH OF THE GUARANTORS PARTY HERETO 12.00% SENIOR SECURED NOTES DUE 2015 INDENTURE Dated as of November 24, 2009 Wilmington Trust FSB Trustee
Monitoring and Oversight Agreement • December 2nd, 2009 • Viasystems Inc • Printed circuit boards • New York

INDENTURE dated as of November 24, 2009 among Viasystems, Inc., a Delaware corporation (the “Company”), the Guarantors party hereto and Wilmington Trust FSB, as trustee (the “Trustee”).

RECITALS
Environmental, Health and Safety Agreement • June 20th, 1997 • Viasystems Inc • New York
Dated August17, 2009 between Guangzhou Termbray Electronics Technology Co., Ltd as Borrower and China Construction Bank Guangzhou Economic and Technological Development District Branch as Lender CREDIT FACILITY CONTRACT
Credit Facility Contract • September 10th, 2009 • Viasystems Inc • Printed circuit boards

Guangzhou Termbray Electronics Technology Co., Ltd, located at 888 Jiu Fu West Road, Jiu Long Town, Luo Gang District, Guangzhou P.R.C. 510555 with Mr. Daniel J. Weber as its legal representative (or principal officer) and its fax number 020-8781-1571 and its telephone number 020-8749-0139 (“Party A”);

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