Exhibit 10.104 EMPLOYMENT AGREEMENT This Employment Agreement ("Agreement") is made and entered into effective as of the 6th day of October, 1997 ("Effective Date") by and between Microelectronic Packaging, Inc. a California corporation ("Company"),...Employment Agreement • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.102 STANDARD LEASE 9577 CHESAPEAKE DRIVE By and Between John Hancock Mutual Life Insurance Company, a Massachusetts corporation, as LessorLease • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.105 [LETTERHEAD OF MICROELECTRONIC PACKAGING, INC.] October 8, 1997 Vincent Woo Assistant General Manager ORIX Leasing Singapore Limited 331 North Bridge Road #19-01/06 Odeon Towers Singapore 188720 RE: HIRE PURCHASE AGREEMENTS:...Microelectronic Packaging Inc /Ca/ • November 12th, 1997 • Semiconductors & related devices
SECOND AMENDMENT ---------------- This Second Amendment, dated as of September 9, 1997, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Microelectronic Packaging Inc /Ca/ • November 12th, 1997 • Semiconductors & related devices • New York
EXHIBIT 10.101 AMENDMENT --------- This Amendment, dated as of July 11, 1997, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Microelectronic Packaging Inc /Ca/ • November 12th, 1997 • Semiconductors & related devices • New York
