SECOND AMENDMENT ---------------- This Second Amendment, dated as of September 9, 1997, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Microelectronic Packaging Inc /Ca/ • November 12th, 1997 • Semiconductors & related devices • New York
EXHIBIT "C"Registration Rights Agreement • May 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.98 LOAN AND SECURITY AGREEMENT --------------------------- This Loan and Security Agreement (this "Agreement"), effective 13 May, 1997 (the "Effective Date"), is by and between (a) Texas Instruments Singapore (Pte) Limited, a Singapore...Loan and Security Agreement • August 14th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Exhibit 10.104 EMPLOYMENT AGREEMENT This Employment Agreement ("Agreement") is made and entered into effective as of the 6th day of October, 1997 ("Effective Date") by and between Microelectronic Packaging, Inc. a California corporation ("Company"),...Employment Agreement • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
WITNESSETH: ----------Stock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.93 AMENDED AND RESTATED -------------------- CONSULTING SERVICES AGREEMENT -----------------------------Consulting Services Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.89 AMENDED LOAN AND SECURITY AGREEMENT ----------------------------------- This Agreement ("Amended Agreement"), effective January 2, 1997, ("Effective Date") is by and between NS Electronics Bangkok (1993) Ltd. ("NSEB") and Microelectronic...Loan and Security Agreement • April 15th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
WITNESSETH:Stock Option Agreement • December 2nd, 1999 • Meltronix Inc • Semiconductors & related devices • California
EXHIBIT 99.7 MICROELECTRONIC PACKAGING, INC. STOCK ISSUANCE AGREEMENT ------------------------ AGREEMENT made this _____ day of ___________________ 19____, by and between Microelectronic Packaging, Inc., a California corporation, and , a Participant...Stock Issuance Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 99.6 MICROELECTRONIC PACKAGING, INC. NON-EMPLOYEE DIRECTOR AUTOMATIC STOCK OPTION AGREEMENT RECITALS -------- A. The Corporation has approved an automatic option grant program under the 1993 Stock Option/Stock Issuance Plan (the "Plan")...Microelectronic Packaging Inc /Ca/ • February 25th, 1998 • Semiconductors & related devices • California
Agreement among Schlumberger Technologies, Inc. ATE Division,Confidentiality Agreement • March 31st, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT "A" SECOND AMENDMENT TO DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
FIRST AMENDMENT TO DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTRelease Agreement • July 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
THIRD AMENDMENT --------------- This Third Amendment, dated as of December 8, 1997, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Microelectronic Packaging Inc /Ca/ • March 31st, 1998 • Semiconductors & related devices • New York
Agreement No. 98-143 ------ Effective Date: 7/21/98 -------Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • Illinois
EXHIBIT 10.84 MICROELECTRONIC PACKAGING, INC. Amendment to Convertible Debentures ____ through ____ This Amendment to Convertible Debentures ____ through ____ (the "Original Debentures") is dated as of this 16th day of December, 1996, by and between...Microelectronic Packaging Inc /Ca/ • January 15th, 1997 • Semiconductors & related devices • California
EXHIBIT 10.84 RESTRUCTURING, SETTLEMENT AND MUTUAL RELEASE AGREEMENT ---------------------------- This Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of this 24th day of September, 1998 the "Effective...Settlement and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.102 STANDARD LEASE 9577 CHESAPEAKE DRIVE By and Between John Hancock Mutual Life Insurance Company, a Massachusetts corporation, as LessorLease • November 12th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
WITNESSETH:Agreement • October 28th, 1996 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
FOURTH AMENDMENT ---------------- This Fourth Amendment, dated as of January 30, 1998, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Microelectronic Packaging Inc /Ca/ • March 31st, 1998 • Semiconductors & related devices • New York
EXHIBIT 10.72 VIA FAX AND EMAIL January 19, 1999 Mr. Thomas J. Gentry Vice President, Corporate Staff Manager, Treasury Services Texas Instruments Incorporated P.O. Box 650311 MS 3994 Dallas, TX 75265 RE: Conditional Agreement Reached on Conversion of...Microelectronic Packaging Inc /Ca/ • April 15th, 1999 • Semiconductors & related devices
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • May 14th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT "E" ASSIGNMENT AGREEMENTAssignment Agreement • May 28th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Exhibit 10.76 RESTRUCTURING SETTLEMENT AND MUTUAL RELEASE AGREEMENT This Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of this 14th day of April, 1998, by and among Microelectronic Packaging, Inc....Restructuring Settlement and Mutual Release Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC.Assignment of Interest Under Letter Agreement • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
THIS ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC. ("Assignment"), is entered into effective as of April 21, 1999 ("Effective Date"), between FI Financial, LLC ("FIF"), and the party whose name appears below, which party is referred to herein as the "Assignee":
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTConversion Agreement • May 14th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
The Seidler Companies IncorporatedLetter Agreement • March 31st, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
This agreement is pursuant to an agreement between Microelectronic Packaging Inc and Innoventure (S) Pte Ltd dated 29 July 1993 (hereinafter "the Principal ------------ Agreement") and a Novation Agreement between the same parties dated and sets out...Microelectronic Packaging Inc /Ca/ • April 15th, 1997 • Semiconductors & related devices
COMMON STOCK PURCHASE AGREEMENT This COMMON STOCK PURCHASE AGREEMENT (the "Agreement") is dated as of September ___, 2001, by and among Meltronix, Inc., a corporation organized under the laws of the State of California (the "Company") (OTCBB: "MTNX")...Common Stock Purchase Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices • California
THE SECURITIES REPRESENTED HEREBY HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933 (AS AMENDED), AND MAY NOT BE OFFERED, SOLD OR OTHERWISE TRANSFERRED, PLEDGED OR HYPOTHECATED IN THE ABSENCE OF A REGISTRATION STATEMENT IN EFFECT WITH RESPECT...Loan Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices
ADDENDUM TO STOCK OPTION AGREEMENTStock Option Agreement • February 25th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
SECURED PROMISSORY NOTE $200,000.00 Date: April 6, 2001 FOR VALUE RECEIVED, Meltronix, Inc., a California corporation ("Meltronix"), promises to pay to La Jolla Cove Investors, Inc. ("LJCI"), the principal sum of Two Hundred Thousand Dollars...Registration Rights Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices
SECURITIES PURCHASE AGREEMENT Securities Purchase Agreement dated as of January 2, 2002 (this "Agreement") by and between Meltronix, Inc., a California corporation, with principal executive offices located at 9577 Chesapeake Drive, San Diego, CA 92123...Securities Purchase Agreement Securities Purchase Agreement • January 8th, 2002 • Meltronix Inc • Semiconductors & related devices • California
