CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and HSBC BANK USA, NATIONAL ASSOCIATION, as Administrative Agent Dated as of May 14, 2021 HSBC SECURITIES (USA) INC. as Sole Bookrunner HSBC SECURITIES (USA)...Credit Agreement • July 1st, 2021 • Micron Technology Inc • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT, dated as of May 14, 2021, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), HSBC BANK USA, NATIONAL ASSOCIATION (“HSBC”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
TERM LOAN CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and WELLS FARGO BANK, NATIONAL ASSOCIATION, as Administrative Agent Dated as of May 14, 2021 OVERSEA-CHINESE BANKING CORPORATION LIMITED, LOS ANGELES...Term Loan Credit Agreement • July 1st, 2021 • Micron Technology Inc • Semiconductors & related devices • New York
THIS TERM LOAN CREDIT AGREEMENT, dated as of May 14, 2021, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), WELLS FARGO BANK, NATIONAL ASSOCIATION (“Wells Fargo”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
