Common Contracts
4 similar Credit Agreement contracts by Micron Technology Inc, Midamerican Energy Co, SOUTHERN CALIFORNIA EDISON Co
THIRD AMENDED AND RESTATED CREDIT AGREEMENTCredit Agreement • August 7th, 2023 • Midamerican Energy Co • Electric services • New York
This Agreement amends and restates in its entirety the Second Amended and Restated Credit Agreement dated as of June 30, 2021, by and among the Borrower, MUFG Bank, Ltd., as administrative agent and the lenders party thereto from time to time (as amended, restated, supplemented or otherwise modified from time to time, the “Existing Credit Agreement”).
THIRD AMENDMENTCredit Agreement • July 27th, 2023 • SOUTHERN CALIFORNIA EDISON Co • Electric services • New York
This SECOND AMENDED AND RESTATED CREDIT AGREEMENT, dated as of May 17, 2018 (as amended, supplemented or otherwise modified from time to time, this “Agreement”), is made by and among EDISON INTERNATIONAL, a California corporation (the “Borrower”), the several banks and other financial institutions from time to time parties hereto (the “Lenders”), CITIBANK, N.A., MUFG UNION BANK, N.ALTD., WELLS FARGO BANK, N.A. and BARCLAYS BANK PLC, MIZUHO BANK, LTD., as Co-Syndication agents (in such capacity the “Co-Syndication Agents”), Bank of China, Los Angeles Branch, The Bank of New York Mellon, BNP Paribas, Morgan Stanley Senior Funding, Inc., PNC Capital Markets LLC, Royal Bank of Canada, Sumitomo Mitsui Banking Corporation, Truist Bank and TD Bank, N.A. as Documentation Agents (in their respective capacities as such, the “Documentation Agents”) and JPMORGAN CHASE BANK, N.A., as Administrative Agent for the Lenders (in such capacity, the “Administrative Agent” and, together with the Co-Syndica
AMENDMENT NO. 2 TO CREDIT AGREEMENTCredit Agreement • June 29th, 2023 • Micron Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO CREDIT AGREEMENT, dated as of June 7, 2023 (this “Amendment”) by HSBC Bank USA, National Association, as administrative agent under the Existing Credit Agreement (as defined below) (in such capacity and including any successors in such capacity, the “Administrative Agent”).
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and HSBC BANK USA, NATIONAL ASSOCIATION, as Administrative Agent Dated as of May 14, 2021 HSBC SECURITIES (USA) INC. as Sole Bookrunner HSBC SECURITIES (USA)...Credit Agreement • July 1st, 2021 • Micron Technology Inc • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT, dated as of May 14, 2021, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), HSBC BANK USA, NATIONAL ASSOCIATION (“HSBC”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
