Micron Technology Inc Sample Contracts
Date:______________________ __________________________________________ Officer ATTACHMENT 1 TO "AGREEMENT AND AMENDMENT TO SEVERANCE AGREEMENT" BY AND BETWEEN MICRON TECHNOLOGY, INC. AND /NAME/Severance Agreement • March 25th, 1997 • Micron Technology Inc • Semiconductors & related devices • Idaho
RECITALSVoting Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
TABLE OF CONTENTS Page ---- ARTICLE I - THE OFFER..........................................................1 1.1 The Offer...........................................................1 1.2 Company...Merger Agreement • June 20th, 1997 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 2 AGREEMENT AND PLAN OF MERGERMerger Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
AGREEMENT ---------Stock Option Agreement • June 20th, 1997 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 10.135 SECOND AMENDED AND RESTATED REVOLVING CREDIT AGREEMENT Dated as of September 1, 1998Revolving Credit Agreement • November 2nd, 1998 • Micron Technology Inc • Semiconductors & related devices • California
EXHIBIT 1.2 MICRON TECHNOLOGY, INC. DEBT SECURITIES UNDERWRITING AGREEMENT To the Representatives of the several Underwriters named in the respective Pricing Agreements hereinafter described. Ladies and Gentlemen: From time to time Micron Technology,...Underwriting Agreement • June 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices • New York
ARTICLE 1. GRANT OF WARRANT AND EXERCISE PRICEWarrant Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 1 ACQUISITION AGREEMENT*Acquisition Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 10.116 MICRON TECHNOLOGY, INC. REGISTRATION RIGHTS AGREEMENT Dated as of June 28, 1996 TABLE OF CONTENTS -----------------Registration Rights Agreement • October 4th, 1996 • Micron Technology Inc • Semiconductors & related devices • Idaho
TOIndenture • July 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices • New York
VOTING AGREEMENTVoting Agreement • July 29th, 1998 • Micron Technology Inc • Semiconductors & related devices • California
EXHIBIT 2 INVESTOR RIGHTS AGREEMENTInvestor Rights Agreement • May 28th, 1999 • Micron Technology Inc • Semiconductors & related devices • California
ContractCredit Agreement • December 8th, 2014 • Micron Technology Inc • Semiconductors & related devices • New York
Exhibit 10.139 PURCHASE AGREEMENT This Purchase Agreement (the "Agreement") is made this 30th day of September, 1998, by and between Micron Technology, Inc., a Delaware, U.S.A. corporation, with its principal place of business at 8000 South Federal...Purchase Agreement • January 13th, 1999 • Micron Technology Inc • Semiconductors & related devices • New York
EXHIBIT 1.2 PRICING AGREEMENTPricing Agreement • July 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices
EXHIBIT 10.123 THIRD AMENDMENT TO FIRST AMENDED AND RESTATED --------------------------------------------- REVOLVING CREDIT AGREEMENT --------------------------Revolving Credit Agreement • July 13th, 1998 • Micron Technology Inc • Semiconductors & related devices • California
Exhibit 10.140 PURCHASE AGREEMENT ------------------ This Purchase Agreement (the "Agreement") is made, as of October 1, 1998, by and among Micron Technology, Inc., a Delaware, U.S.A. corporation, with its principal place of business at 8000 South...Purchase Agreement • January 13th, 1999 • Micron Technology Inc • Semiconductors & related devices • Idaho
RECITALSAffiliate Agreement • July 29th, 1998 • Micron Technology Inc • Semiconductors & related devices • Delaware
TOIndenture • June 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices • New York
RECITALS A. Concurrently with the execution of this Agreement, the Company, Interland Acquisition Corporation, a Delaware corporation and a wholly owned first-tier subsidiary of the Company ("MERGER SUB"), and Interland, Inc., a Georgia corporation...Shareholder Agreement • April 4th, 2001 • Micron Technology Inc • Semiconductors & related devices • Delaware
INDEMNIFICATION AGREEMENTIndemnification Agreement • March 21st, 2025 • Micron Technology Inc • Semiconductors & related devices • Delaware
This Indemnification Agreement (this “Agreement”) is dated as of [insert date], and is between Micron Technology, Inc., a Delaware corporation (the “Company”), and [insert name of indemnitee] (“Indemnitee”).
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and as Collateral Agent Dated as of July 3, 2018 JPMORGAN CHASE BANK, N.A. and HSBC SECURITIES (USA) INC....Credit Agreement • October 15th, 2018 • Micron Technology Inc • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT, dated as of July 3, 2018, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), JPMORGAN CHASE BANK, N.A. (“JPMorgan”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”) and as collateral agent (in such capacity and including any successors in such capacity, the “Collateral Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
EXHIBIT 10.125 MICRON TECHNOLOGY, INC. REGISTRATION RIGHTS AGREEMENT Dated as of July 20, 1998 REGISTRATION RIGHTS AGREEMENT REGISTRATION RIGHTS AGREEMENT, dated as of July 20, 1998 among Micron Technology, Inc., a Delaware corporation ("Micron" or...Registration Rights Agreement • July 20th, 1998 • Micron Technology Inc • Semiconductors & related devices • Idaho
MICRON TECHNOLOGY, INC. 1.625% CONVERTIBLE SENIOR NOTES DUE 2033 2.125% CONVERTIBLE SENIOR NOTES DUE 2033 PURCHASE AGREEMENTPurchase Agreement • February 12th, 2013 • Micron Technology Inc • Semiconductors & related devices • New York
The undersigned understands that Morgan Stanley & Co. LLC (“Morgan Stanley”) proposes to enter into a Purchase Agreement (the “Purchase Agreement”) with Micron Technology, Inc., a Delaware corporation (the “Company”), providing for the offering (the “Offering”) by the several initial purchasers, including Morgan Stanley (the “Initial Purchasers”), of up to approximately $600,000,000 aggregate principal amount of Convertible Senior Notes (the “Securities”). The Securities will be convertible into shares of common stock, par value $0.10 per share, of the Company (the “Common Stock”).
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and HSBC BANK USA, NATIONAL ASSOCIATION, as Administrative Agent Dated as of March 12, 2025 HSBC SECURITIES (USA) INC. as Sole Bookrunner HSBC SECURITIES (USA)...Credit Agreement • March 21st, 2025 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE Dated as of April 30, 2015 Between MICRON TECHNOLOGY, INC. and U.S. BANK NATIONAL ASSOCIATION, as Trustee 5.625% SENIOR NOTES DUE 2026Indenture • April 30th, 2015 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE, dated as of April 30, 2015 between Micron Technology, Inc., a Delaware corporation, and U.S. Bank National Association, a national banking association, as Trustee.
TERM LOAN CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and PNC BANK, NATIONAL ASSOCIATION, as Administrative Agent Dated as of January 17, 2025BNP PARIBAS, CANADIAN IMPERIAL BANK OF COMMERCE, NEW YORK...Term Loan Credit Agreement • March 21st, 2025 • Micron Technology Inc • Semiconductors & related devices • New York
and Norwest Bank Minnesota, National Association TrusteeSupplemental Trust Indenture • July 3rd, 1997 • Micron Technology Inc • Semiconductors & related devices
AGREEMENT AND PLAN OF MERGER BY AND AMONG MICRON TECHNOLOGY, INC. MARCH 2006 MERGER CORP. AND LEXAR MEDIA, INC.Merger Agreement • March 10th, 2006 • Micron Technology Inc • Semiconductors & related devices • Delaware
This AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of March 8, 2006, by and among Micron Technology, Inc., a Delaware corporation (“Parent”), March 2006 Merger Corp., a Delaware corporation and direct wholly owned subsidiary of Parent (“Merger Sub”), and Lexar Media, Inc., a Delaware corporation (the “Company”).
and Norwest Bank Minnesota, National Association TrusteeSecond Supplemental Trust Indenture • October 16th, 1998 • Micron Technology Inc • Semiconductors & related devices
AGREEMENT ---------Indemnification & Liability • July 29th, 1998 • Micron Technology Inc • Semiconductors & related devices • Idaho
MICRON TECHNOLOGY, INC. as Issuer and U.S. BANK NATIONAL ASSOCIATION as TrusteeIndenture • February 12th, 2013 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE dated as of February 12, 2013 between Micron Technology, Inc., a Delaware corporation (the “Company”), and U.S. Bank National Association, a national banking association, as Trustee.
INDENTURE Dated as of April 30, 2015 Between MICRON TECHNOLOGY, INC. and U.S. BANK NATIONAL ASSOCIATION, as Trustee 5.250% SENIOR NOTES DUE 2024Indenture • April 30th, 2015 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE, dated as of April 30, 2015 between Micron Technology, Inc., a Delaware corporation, and U.S. Bank National Association, a national banking association, as Trustee.
AMENDMENT NO. 2 TO CREDIT AGREEMENTCredit Agreement • June 29th, 2023 • Micron Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO CREDIT AGREEMENT, dated as of June 7, 2023 (this “Amendment”) by HSBC Bank USA, National Association, as administrative agent under the Existing Credit Agreement (as defined below) (in such capacity and including any successors in such capacity, the “Administrative Agent”).