EXHIBIT 10.1 SEVENTH AMENDMENT TO LOAN AND SECURITY AGREEMENT This Amendment is made effective as of the 1st day of December, 2002, by and among HEI, Inc., a Minnesota corporation ("HEI"), Cross Technology, Inc., a Minnesota corporation ("Cross" and,...Loan and Security Agreement • January 14th, 2003 • Hei Inc • Semiconductors & related devices
EXHIBIT 2.2 REGISTRATION RIGHTS AGREEMENT THIS REGISTRATION RIGHTS AGREEMENT, dated the 24th of January, 2003, between COLORADO MEDTECH, INC., a Colorado corporation (the "Holder") and HEI, INC., a Minnesota corporation (the "Company"). WHEREAS,...Registration Rights Agreement • February 10th, 2003 • Hei Inc • Semiconductors & related devices • New York
EXHIBIT 2.1 AGREEMENT AND PLAN OF REORGANIZATION BY AND AMONGAgreement and Plan of Reorganization • March 21st, 2000 • Hei Inc • Semiconductors & related devices • Minnesota
1 EXHIBIT 99.2 STOCK PURCHASE AGREEMENT This Stock Purchase Agreement (including the Exhibits hereto, the "Agreement"), dated as of August 29, 2001, is entered into by and among the Investors listed on Exhibit A hereto (each an "Investor" or jointly...Stock Purchase Agreement • September 4th, 2001 • Hei Inc • Semiconductors & related devices • Minnesota
RECITALS:Registration Rights Agreement • September 4th, 2001 • Hei Inc • Semiconductors & related devices • Minnesota
HEI, INC. EMPLOYMENT AGREEMENTEmployment Agreement • December 16th, 2003 • Hei Inc • Semiconductors & related devices • Minnesota
AMENDMENT TO RIGHTS AGREEMENT THIS AMENDMENT between HEI Inc., a Minnesota corporation (the "Company"), and Norwest Bank Minnesota, National Association, a national bank association (the "Rights Agent"), dated as of March 13, 1998 (this "Amendment"),...Rights Agreement • March 19th, 1998 • Hei Inc • Semiconductors & related devices
EXHIBIT 2.1 PURCHASE AGREEMENTPurchase Agreement • February 10th, 2003 • Hei Inc • Semiconductors & related devices • New York
AMENDMENT NO. 1 TO PATENT, TRADEMARK AND LICENSE AGREEMENT THIS AMENDMENT, made as of the ______ day of October, 2001, by HEI, Inc., a Minnesota corporation (the "Mortgagor"), in favor of LASALLE BUSINESS CREDIT, INC. (the "Mortgagee").License Agreement • November 9th, 2001 • Hei Inc • Semiconductors & related devices
WITNESSETH:Term Loan Agreement • December 16th, 2003 • Hei Inc • Semiconductors & related devices • Minnesota
EXHIBIT 10.1c SECOND AMENDMENT TO LOAN AND SECURITY AGREEMENT This Amendment is made effective as of the 16th day of April, 2001, by and between HEI, Inc., a Minnesota corporation (the "Borrower"), and LaSalle Business Credit, Inc., a Delaware...Loan and Security Agreement • November 9th, 2001 • Hei Inc • Semiconductors & related devices
EXHIBIT 10.50 ASSET PURCHASE AGREEMENT DATED OCTOBER 31, 2003Asset Purchase Agreement • December 16th, 2003 • Hei Inc • Semiconductors & related devices • Massachusetts
FORM OF AGREEMENT EXHIBIT 10.4 REGARDING EMPLOYMENT/COMPENSATION UPON CHANGE IN CONTROL THIS AGREEMENT is entered into as of ____________, 1997, by and between HEI, INC., a Minnesota corporation (herein called the "Company"), and ____________________...Form of Agreement • December 1st, 1997 • Hei Inc • Semiconductors & related devices • Minnesota
EXHIBIT 10.1" EIGHTH AMENDMENT TO LOAN AND SECURITY AGREEMENT This Amendment is made effective as of the 9th day of April, 2003, by and among HEI, Inc., a Minnesota corporation ("HEI"), Cross Technology, Inc., a Minnesota corporation ("Cross" and,...Loan and Security Agreement • April 18th, 2003 • Hei Inc • Semiconductors & related devices
EXHIBIT 10.1b FIRST AMENDMENT TO CREDIT AGREEMENT This Amendment is made effective as of the 31st day of August, 2000, by and between HEI, Inc., a Minnesota corporation (the "Borrower"), and LaSalle Business Credit, Inc., a Delaware corporation (the...Credit Agreement • November 9th, 2001 • Hei Inc • Semiconductors & related devices
RECITALS:Credit Agreement • November 27th, 1998 • Hei Inc • Semiconductors & related devices • Minnesota
WITNESSETH:Hei Inc • December 16th, 2003 • Semiconductors & related devices • Minnesota
LEASEHei Inc • April 10th, 2003 • Semiconductors & related devices • Colorado
WITNESSETH:Hei Inc • December 16th, 2003 • Semiconductors & related devices • Minnesota
CURRENT NOTEHei Inc • November 27th, 1998 • Semiconductors & related devices
WAIVER AND AMENDMENT Dated as of December 29, 2004Waiver and Amendment • January 5th, 2005 • Hei Inc • Semiconductors & related devices
Reference is made to that certain Term Loan Agreement (the “Loan Agreement”), dated October 14, 2003, and amended effective as of November 30, 2004, by and between HEI Inc., a Minnesota corporation (the “Borrower”) and Commerce Bank, a Minnesota banking corporation (the “Lender”).
HEI, INC. EMPLOYMENT AGREEMENTEmployment Agreement • July 12th, 2006 • Hei Inc • Semiconductors & related devices • Minnesota
This Employment Agreement is made and entered into as of July 10, 2006, and effective as of July 7, 2006 (the “Effective Date”), by and among HEI, Inc., a Minnesota corporation (the “Corporation”), and Nina M. Anderson (“Employee”).
REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • March 9th, 2004 • Hei Inc • Semiconductors & related devices • Minnesota
This Registration Rights Agreement (this “Agreement”) is made and entered into as of February 23, 2004, between HEI, Inc., a Minnesota corporation (the “Company”), and the investor identified on the signature page to this Agreement (“Purchaser”).
REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • February 19th, 2004 • Hei Inc • Semiconductors & related devices • Minnesota
This Registration Rights Agreement (this “Agreement”) is made and entered into as of February 13, 2004, among HEI, Inc., a Minnesota corporation (the “Company”), and the individuals and entities listed on Schedule 1 hereto (each, a “Purchaser” and, collectively, the “Purchasers”). The Company and the Purchasers are sometimes referred to in this Agreement individually as a “Party” and collectively as the “Parties”).
Commerce Leasing Corporation Commerce Mortgage Company WAIVER AND AMENDMENT Dated as of May 27, 2006Hei Inc • June 22nd, 2006 • Semiconductors & related devices
Reference is made to that certain Term Loan Agreement (the “Loan Agreement”), dated October 28, 2003, by and between HEI Inc., a Minnesota corporation (the “Borrower”) and Commerce Financial Group, Inc., a Minnesota corporation (the “Lender”), as amended by the certain Waiver and Amendment dated as of November 30, 2003, between Borrower and Lender; and that certain Promissory Note (the “Promissory Note”), dated October 28, 2003, made by the Borrower in favor of the Lender.
FORM OF WARRANTHei Inc • May 11th, 2005 • Semiconductors & related devices • Minnesota
This Warrant and any securities acquired upon exercise of this Warrant have not been registered under the Securities Act of 1933, as amended, or any state securities laws. The securities may not be offered for sale, sold, transferred or assigned in the absence of an effective registration statement for the securities under such Act or applicable state securities laws or pursuant to an applicable exemption to the registration requirements of such Act and such laws.
EXHIBIT 2.5 FIRST ADDENDUM THIS ADDENDUM ("Addendum"), made and entered into as of the 12th day of September, 2002, to that Lease dated January 7, 2002, is made by and between EASTSIDE PROPERTIES, LLC (hereinafter called "Landlord"), and COLORADO...Hei Inc • April 9th, 2003 • Semiconductors & related devices
RECITALSAgreement Regarding Additional Security Deposit • April 10th, 2003 • Hei Inc • Semiconductors & related devices • Colorado
WAIVER AND RELEASE AGREEMENTWaiver and Release Agreement • February 1st, 2005 • Hei Inc • Semiconductors & related devices • Minnesota
Douglas Nesbit (“Employee”) and HEI, Inc. (“Employer”) freely and voluntarily enter into this Waiver and Release Agreement (“Agreement”), intending to be legally bound, according to the terms set forth below.
STOCK PURCHASE AGREEMENTStock Purchase Agreement • February 19th, 2004 • Hei Inc • Semiconductors & related devices • Minnesota
This Stock Purchase Agreement (this “Agreement”), dated as of February 13, 2004, is entered into by and among the Investors listed on Exhibit A hereto (each an “Investor” or jointly the “Investors”) and HEI, Inc., a Minnesota corporation (the “Company”). The Investors and the Company are sometimes referred to in this Agreement individually as a “Party” and collectively as the “Parties.”
WAIVER AND AMENDMENT Dated as of January 12, 2007Waiver and Amendment • January 16th, 2007 • Hei Inc • Semiconductors & related devices
Reference is made to that certain Term Loan Agreement (the “Loan Agreement”), dated October 28, 2003, by and between HEI Inc., a Minnesota corporation (the “Borrower”) and Commerce Financial Group, Inc., a Minnesota corporation (the “Lender”), as amended by those certain Waiver and Amendment agreements dated as of November 30, 2004 and May 27, 2006, between Borrower and Lender; and that certain Promissory Note (the “Promissory Note”), dated October 28, 2003, made by the Borrower in favor of the Lender.
COMMERCIAL LOAN AGREEMENTHei Inc • April 24th, 2006 • Semiconductors & related devices
LOAN STRUCTURE. This Commercial Loan Agreement (Agreement) contemplates a single advance term Loan a multiple advance draw Loan X a revolving multiple advance draw Loan. The principal balance will not exceed $ 2,000,000.00 . Borrower will pay down a revolving draw Loan’s outstanding Principal to $ (Pay Down Balance) (Time Period). This Loan is for agricultural X business purposes.
WAIVER AND AMENDMENT Dated as of January 12, 2007Waiver and Amendment • January 16th, 2007 • Hei Inc • Semiconductors & related devices
Reference is made to that certain Term Loan Agreement (the “Loan Agreement”), dated October 28, 2003, by and between HEI Inc., a Minnesota corporation (the “Borrower”) and Commerce Bank, a Minnesota banking corporation (the “Lender”), as amended by those certain Waiver and Amendment agreements dated as of November 30, 2004 and May 26, 2006, between Borrower and Lender; and that certain Promissory Note (the “Promissory Note”), dated October 28, 2003, made by the Borrower in favor of the Lender.
Commerce Leasing Corporation Commerce Mortgage Company WAIVER Dated as of May 27, 2006Hei Inc • June 22nd, 2006 • Semiconductors & related devices
Reference is made to that certain Master Equipment Lease No. 0512231 (the “Master Lease”), dated as of December 23, 2005, by and between HEI Inc., a Minnesota corporation (the “Lessee”) and Commerce Leasing Corporation, a division of Commerce Financial Group, Inc., a Minnesota corporation (the “Lessor”); those certain lease commitments (the “Lease Commitments”) by the Lessor for the benefit of the Lessee dated as of December 5, 2005, December 8, 2005, February 23, 2006 and February 24, 2006; and those certain supplements (the “Supplements”) to the Master Lease made by the Lessee in favor of the Lessor (the Master Lease, together with the Lease Commitments and the Supplements, is collectively, the “Lease”).
EXHIBIT 10.2 [HEI INC LETTERHEAD] May 16, 2003 Whitebox Hedged High Yield Partners c/o Andrew J. Redleaf Chief Executive Officer Whitebox Advisors, LLC 3033 Excelsior Boulevard Suite 300 Minneapolis, MN 55416 Dear Andy, This letter is written to...Hei Inc • July 15th, 2003 • Semiconductors & related devices
This letter is written to confirm the understanding between HEI, Inc. ("HEI") and Whitebox Hedged High Yield Partners ("Whitebox") relating to the Subordinated Promissory Note (the "Note") of HEI dated January 24, 2003 payable to the order of Colorado Madtech, Inc. ("CMED") in the original principal amount of $2,600,000 (the "Face Value") of the Note. We understand that CMED sold the Note to Whitebox on May 8, 2003. The Note is subordinated to certain indebtedness (the "Senior Debt") of HEI to LaSalle Business Credit, Inc. ("LaSalle") in accordance with the terms of a Subordination Agreement (the "Subordination Agreement") dated January 24, 2003 executed by CMED in favor of LaSalle, which Subordination Agreement is binding upon Whitebox as the transferee of the Note.
