Sampling Plan. 3.1 Inspect all of the wafers in the lot for Gross and Fine defects as defined in sections 4.1 and 4.2. 3.2 For the Fine Visual Inspection, the sampling plan is: 5 areas per wafer, 21 die per area Accept/Reject = 1/2 Quality level = 5% LTPD
Appears in 2 contracts
Sources: Corporate Agreement (FSC Semiconductor Corp), Corporate Agreement (FSC Semiconductor Corp)