Product Purchase and Capacity Reservation Agreement Sample Contracts
Qimonda AG Confidential Materials Omitted and Filed Separately with the Securities and Exchange Commission. Confidential Portions denoted by [***]. Product Purchase And Capacity Reservation Agreement - hereinafter referred to as the “Agreement” - by...Product Purchase and Capacity Reservation Agreement • August 4th, 2006 • Qimonda AG • Semiconductors & related devices
WHEREAS, Infineon and SMIC, concurrently with this Agreement, have entered into an agreement regarding the transfer of certain know how and technologies by Infineon to SMIC for the manufacture of Contract Products (as defined below) and under which Infineon grants to SMIC certain rights to manufacture and sell Contract Products only to Infineon and/or the Infineon Subsidiaries (as defined below);
Qimonda AG Confidential Materials Omitted and Filed Separately with the Securities and Exchange Commission. Confidential Portions denoted by [***]. Product Purchase And Capacity Reservation Agreement 300mm - hereinafter referred to as the “Agreement”-...Product Purchase and Capacity Reservation Agreement • July 21st, 2006 • Qimonda AG
WHEREAS, Infineon and Winbond, on May 02, 2002, have entered into that certain Know How Transfer Agreement regarding Infineon’s 110nm DRAM technology for use with certain DRAM products and that certain Product Purchasing and Capacity Reservation Agreement and its First Addendum related thereto;
Qimonda AG Confidential Materials Omitted and Filed Separately with the Securities and Exchange Commission Confidential Portions denoted by [***] Product Purchase and Capacity Reservation Agreement by and between Hwa-Ya Semiconductor Inc., having its...Product Purchase and Capacity Reservation Agreement • July 21st, 2006 • Qimonda AG
WHERAS, NTC and Infineon have formed JV as a joint venture company for the development, manufacture and sale of semiconductor products subject to a Joint Venture Agreement (“Joint Venture Agreement”);
Qimonda AG Confidential Materials Omitted and Filed Separately with the Securities and Exchange Commission. Confidential Portions denoted by [***]. Second Addendum to the Product Purchase And Capacity Reservation Agreement 300mm -hereinafter referred...Product Purchase and Capacity Reservation Agreement • September 11th, 2007 • Qimonda Finance LLC • Semiconductors & related devices
WHEREAS, Infineon and Winbond, on May 02, 2002, have entered into that certain Know How Transfer Agreement regarding Infineon’s 110nm DRAM technology for use with certain DRAM products and that certain Product Purchasing and Capacity Reservation Agreement and its First Addendum related thereto;
Qimonda AG Confidential Materials Omitted and Filed Separately with the Securities and Exchange Commission. Confidential Portions denoted by [***]. First Addendum to the Product Purchase And Capacity Reservation Agreement 300mm -hereinafter referred...Product Purchase and Capacity Reservation Agreement • November 21st, 2006 • Qimonda AG • Semiconductors & related devices
WHEREAS, Infineon and Winbond, on May 02, 2002, have entered into that certain Know How Transfer Agreement regarding Infineon’s 110nm DRAM technology for use with certain DRAM products and that certain Product Purchasing and Capacity Reservation Agreement and its First Addendum related thereto;