Placing and Subscription Agreement Sample Contracts

Dated 4 June 2014 (1) SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and (2) DATANG HOLDINGS (HONGKONG) INVESTMENT COMPANY LIMITED and (3) DEUTSCHE BANK AG, HONG KONG BRANCH and (4) J.P. MORGAN SECURITIES (ASIA PACIFIC) LIMITED PLACING AND...

Placing and Subscription Agreement • April 28th, 2015 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong

• Contract Type
  Placing and Subscription Agreement
• Filed
  April 28th, 2015
• Company
  Semiconductor Manufacturing International Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Hong Kong

PLACING AND SUBSCRIPTION AGREEMENT, made on 27 October 2021 AMONG

Placing and Subscription Agreement • October 28th, 2021 • Hong Kong

• Contract Type
  Placing and Subscription Agreement
• Filed
  October 28th, 2021
• Jurisdiction
  Hong Kong