Convertible Bond Exchange Agreement Sample Contracts

CONVERTIBLE BOND EXCHANGE AGREEMENT

Convertible Bond Exchange Agreement • November 27th, 2009 • ThaiLin Semiconductor Corp. • Semiconductors & related devices • New York

• Contract Type
  Convertible Bond Exchange Agreement
• Filed
  November 27th, 2009
• Company
  ThaiLin Semiconductor Corp.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

THIS CONVERTIBLE BOND EXCHANGE AGREEMENT, dated as of September 29, 2009 (this “Agreement”), is entered into by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., a company incorporated in Bermuda (the “Company”) and ThaiLin Semiconductor Corp. (the “Holder”, and together with the Company, the “Parties”).