AGREEMENT AND PLAN OF RECAPITALIZATION AND MERGER dated as of March 13, 1999 by and among HYUNDAI ELECTRONICS INDUSTRIES CO., LTD., HYUNDAI ELECTRONICS AMERICA, CHIPPAC, INC., and CHIPPAC MERGER CORP.Agreement and Plan of Recapitalization And • November 24th, 1999 • Chippac LTD • California
Contract Type FiledNovember 24th, 1999 Company Jurisdiction