SECOND AMENDMENTCredit Agreement • June 6th, 2019 • TTM Technologies Inc • Printed circuit boards • New York
SECOND AMENDMENT, dated as of June 3, 2019 (this “Amendment”), to the ABL Credit Agreement, dated as of May 31, 2015 (as amended by the First Amendment, dated as of September 27, 2016, the “Credit Agreement”), among TTM TECHNOLOGIES, INC. (the “Borrower”), the several banks and other financial institutions or entities from time to time parties thereto (the “Lenders”), JPMORGAN CHASE BANK, N.A., as administrative agent (in such capacity, the “Administrative Agent”) and the other agents parties thereto.
AMENDED AND RESTATED FACILITY AGREEMENT DATED 4 JUNE 2019 US$150,000,000Facility Agreement • June 6th, 2019 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated between, among others, TTM Technologies Enterprises (HK) Limited as a Borrower and The Hongkong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
