0001193125-09-091971 Sample Contracts

APRIL 24, 2009 MULTI-FINELINE ELECTRONIX (SUZHOU) CO., LTD. AND BEIJING SHIYUAN XIDA CONSTRUCTION AND TECHNOLOGY COMPANY, A SOLE SUBSIDIARY OF CHINA ELECTRONICS ENGINEERING DESIGN INSTITUTE ENGINEERING, PROCUREMENT AND CONSTRUCTION/TURN KEY PROJECT...
Contract Agreement • April 29th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards

The Contract Agreement is made for a new building which located in Hedong Industrial Estate, North Sanfeng Road, Suzhou Chania, and is signed April 24 of 2009 in Suzhou between Multi-Fineline Electronix (Suzhou) Co., LTD, a corporation organized and existing under the laws of the People’s Republic of China (PRC) and having its registered office at Suning Industrial Estate Block A&B, South Dongwu Road, Suzhou 215128, China (Employer) of the one part, and Beijing Shiyuan Xida Construction and Technology Company, a sole subsidiary of China Electronics Engineering Design Institute and existing under the laws of the People’s Republic of China (PRC) and having its registered office at 27 Wanshou Road, Beijing 100840 (Contractor) of the second part, and China Electronics Engineering Design Institute, a Corporation organized and existing under the laws of the People’s Republic of China and having its registered office at 27 Wanshou Road, Beijing 100840 (Guarantor) of the third part.

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