Multi Fineline Electronix Inc Sample Contracts

MULTI-FINELINE ELECTRONIX, INC. INDEMNIFICATION AGREEMENT
Indemnification Agreement • June 3rd, 2004 • Multi Fineline Electronix Inc • Printed circuit boards • Delaware

This Indemnification Agreement (this “Agreement”) is entered into as of , 2004 (the “Effective Date”), by and between MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (the “Company”), and (“Indemnitee”).

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AGREEMENT AND PLAN OF MERGER among MULTI-FINELINE ELECTRONIX, INC., SUZHOU DONGSHAN PRECISION MANUFACTURING CO., LTD., and DRAGON ELECTRONIX MERGER SUB INC. Dated as of February 4, 2016
Agreement and Plan of Merger • February 4th, 2016 • Multi Fineline Electronix Inc • Printed circuit boards • Delaware

This AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of this 4th day of February, 2016, by and among Multi-Fineline Electronix, Inc., a Delaware corporation (the “Company”), Suzhou Dongshan Precision Manufacturing Co., Ltd., a company organized under the laws of the People’s Republic of China (“Parent”), and Dragon Electronix Merger Sub Inc., a Delaware corporation and indirect wholly-owned subsidiary of Parent (“Merger Sub”).

Comprehensive Credit Line Agreement Agreement No.
Comprehensive Credit Line Agreement • August 6th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards • Shanghai

According to pertinent stipulations by laws and regulations, such as the “Commercial Bank Law of the People’s Republic of China” and the ‘Provisional Rules on the Administration of Power of Attorney and Credit Line Authorization by Commercial Banks’, Party A and Party B have, on the basis of equality, self-willingness and honesty and good faith, concluded the following agreement for mutual compliance through friend consultation.

Shares* MULTI-FINELINE ELECTRONIX, INC. Common Stock UNDERWRITING AGREEMENT
Underwriting Agreement • May 14th, 2004 • Multi Fineline Electronix Inc • Printed circuit boards • New York

Multi-Fineline Electronix, Inc., a Delaware corporation (the “Company”), proposes to issue and sell shares (the “Company Firm Shares”) of the Company’s common stock, $0.001 par value per share (the “Common Stock”), and the stockholders of the Company named in Schedule II hereto (the “Selling Stockholders”) propose to sell an aggregate of shares (the “Selling Stockholder Firm Shares”) of Common Stock, in each case to you and to the several other Underwriters named in Schedule I hereto (collectively, the “Underwriters”), for whom you are acting as representatives (the “Representatives”). The Company have also agreed to grant to you and the other Underwriters an option (the “Option”) to purchase up to an additional shares (the “Option Shares”), on the terms and for the purposes set forth in Section 1(b). The Company Firm Shares and the Selling Stockholder Firm Shares are referred to collectively herein as the “Firm Shares,” and the Firm Shares and the Option Shares are referred to collect

COLLABORATION AGREEMENT
Collaboration Agreement • August 6th, 2008 • Multi Fineline Electronix Inc • Printed circuit boards

In view to further strengthen the close relationship between Party A (hereinafter called A) and Party B (hereinafter called B) and on the base of the principles of equality and mutual benefit, both parties, through friendly negotiation, have agreed to enter into the following agreement under the terms specified as followed:

COLLABORATION AGREEMENT
Collaboration Agreement • August 3rd, 2006 • Multi Fineline Electronix Inc • Printed circuit boards

In view to further strengthen the close relationship between Party A (hereinafter called A) and Party B (hereinafter called B) and on the base of the principles of equality and mutual benefit, both parties, through friendly negotiation, have agreed to enter into the following agreement under the terms specified as followed:

Line of Credit Agreement No.: 2008 Wu Zhong Yin Shou Zi No. 0805006
Credit Agreement • January 30th, 2008 • Multi Fineline Electronix Inc • Printed circuit boards

To develop friendly and mutually beneficial cooperative relations, Party A and Party B have hereby voluntarily concluded the following agreement on the principles of equality, mutual benefit and good faith.

AMENDED AND RESTATED STOCKHOLDERS AGREEMENT
Stockholders Agreement • October 25th, 2005 • Multi Fineline Electronix Inc • Printed circuit boards • Delaware

This AMENDED AND RESTATED STOCKHOLDERS AGREEMENT, dated as of October 25, 2005 (this “Agreement”), among Multi-Fineline Electronix, Inc., a Delaware corporation (the “Company”), Wearnes Technology Pte. Ltd., a corporation organized under the laws of Singapore (“WT”), and United Wearnes Technology Pte. Ltd., a corporation organized under the laws of Singapore (“UWT”) (each, a “Stockholder” and collectively, the “Stockholders”), and WBL Corporation Limited, a corporation organized under the laws of Singapore (“WBL,” which, together with the Stockholders, are referred to herein as the “WBL Entities,” and together with the Company, the “Parties”). Capitalized but undefined terms shall have the meaning ascribed to such terms in Article I below.

STOCKHOLDERS AGREEMENT
Stockholders Agreement • June 22nd, 2004 • Multi Fineline Electronix Inc • Printed circuit boards • Delaware

This STOCKHOLDERS AGREEMENT dated as of June 4, 2004 (this “Agreement”) is made and entered into by and among Multi-Fineline Electronix, Inc., a Delaware corporation (including its predecessor entity, Multi-Fineline Electronix, Inc., a California corporation, the “Company”), WBL Corporation Limited, a corporation organized under the laws of Singapore (“WBL”), Wearnes Technology Pte. Ltd., a corporation organized under the laws of Singapore (“WT”), and United Wearnes Technology Pte. Ltd., a corporation organized under the laws of Singapore (“UWT”) (each of WBL, WT and UWT, a “WBL Entity,” and collectively the “WBL Entities”). Capitalized but undefined terms shall have the meaning ascribed to such terms in Article I below.

Agreement on Amount of Credit Line No.: Wu Zhong Yin Shou Zi No. 0561112
Multi Fineline Electronix Inc • January 31st, 2006 • Printed circuit boards

In order to develop friendly and cooperative relationship, Party A and Party B have reached the following agreement through consultation based on the principle of voluntariness, equality, mutual benefit and sincerity.

Credit Line Agreement No.: Wu Zhong Yin Shou Zi No. 0761002
Credit Line Agreement • January 31st, 2007 • Multi Fineline Electronix Inc • Printed circuit boards

To develop a friendly and mutually beneficial and cooperative relationship, upon consensus, Party A and Party B have hereby reached the following agreement on the principles of voluntariness, equality, mutual benefit and good faith.

CORPORATE SUPPLY AGREEMENT BETWEEN MULTI-FINELINE ELECTRONIX, INC. AND MOTOROLA, INC.
Corporate Supply Agreement • February 15th, 2007 • Multi Fineline Electronix Inc • Printed circuit boards • Illinois

This Corporate Supply Agreement (the “Agreement”), dated as of October 1, 2006 (the “Effective Date”), is between Motorola, Inc., located at 1303 E. Algonquin Road, Schaumburg, IL 60196 (“Motorola”) and Multi-Fineline Electronix, Inc., located at 3140 East Coronado Street, Anaheim, CA 92806 (“Supplier”). Each may be referred to as a party (“Party”), or they may be collectively known as parties (the “Parties”).

COOPERATION AGREEMENT BETWEEN BANK AND ENTERPRISE
Cooperation Agreement • April 15th, 2004 • Multi Fineline Electronix Inc
AMENDMENT NO. 5 AND CONSENT TO LOAN AGREEMENT
Loan Agreement • November 14th, 2011 • Multi Fineline Electronix Inc • Printed circuit boards • New York

AMENDMENT NO. 5 AND CONSENT TO LOAN AGREEMENT, dated as of September 14, 2011 (this “Agreement”), among MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“U.S. Borrower”), MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore corporation (“Singapore Borrower”, and together with U.S. Borrower, collectively, “Borrowers”), the various Subsidiaries (such capitalized term and all other capitalized terms not defined herein shall have the meanings provided for in Article I) of the Borrowers that are parties hereto, the various financial institutions that are parties hereto (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).

Guarantee Letter Regarding the Purchasing of the Land and the Buildings between MFC and WGSZ
Multi Fineline Electronix Inc • February 3rd, 2011 • Printed circuit boards
AMENDMENT NO. 4 AND WAIVER TO LOAN AGREEMENT
Loan Agreement • November 15th, 2010 • Multi Fineline Electronix Inc • Printed circuit boards • New York

AMENDMENT NO. 4 AND WAIVER TO LOAN AGREEMENT, dated as of August 18, 2010 (this “Agreement”), among MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“U.S. Borrower”), MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore corporation (“Singapore Borrower”, and together with U.S. Borrower, collectively, “Borrowers”), the various Subsidiaries (such capitalized term and all other capitalized terms not defined herein shall have the meanings provided for in Article I) of the Borrowers that are parties hereto, the various financial institutions that are parties hereto (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).

Bank and Enterprise Cooperation Agreement Between Multi-Fineline Electronix (Suzhou No. 2) Co. Ltd. and Shanghai Pudong Development Bank Suzhou Branch
Enterprise Cooperation Agreement • May 9th, 2006 • Multi Fineline Electronix Inc • Printed circuit boards

In order to promote the growth of businesses, the two parties, through friendly negotiations and based on the intended and mutual benefits, agree upon the following provisions of the comprehensive business cooperation agreement:

Second Supplemental Agreement to Agreement for Sales of Buildings in Stock This Second Supplemental Agreement is made by and between:
Second Supplemental Agreement • May 5th, 2011 • Multi Fineline Electronix Inc • Printed circuit boards

Party A: Wearnes Global (Suzhou) Co., Ltd., having its business address at 6F Weiyong Building, 10-1 Fengmen Road, Suzhou 215006, Jiangsu Province, hereafter referred to as “the Seller”; and

SECOND AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • May 5th, 2016 • Multi Fineline Electronix Inc • Printed circuit boards • California

SECOND AMENDMENT TO LOAN AND SECURITY AGREEMENT, dated as of May 2, 2016 (this “Agreement”), among MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore company (“Borrower”), MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“Holdings”), the various financial institutions parties hereto (collectively, the “Lenders”) and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (in such capacity, the “Agent”).

MULTI-FINELINE ELECTRONIX, INC. 3140 East Coronado Street, Suite A Anaheim, California 92806
Multi Fineline Electronix Inc • July 22nd, 2004 • Printed circuit boards

We refer to the Agreement. Unless the context otherwise requires, terms defined in the Agreement shall have the same meaning when used in this Supplemental Letter.

AMENDMENT NO. 2 TO LOAN AGREEMENT
Loan Agreement • May 6th, 2010 • Multi Fineline Electronix Inc • Printed circuit boards • New York

AMENDMENT NO. 2 TO LOAN AGREEMENT, dated as of February 15, 2010 (this “Agreement”), among MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“U.S. Borrower”), MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore corporation (“Singapore Borrower”, and together with U.S. Borrower, collectively, “Borrowers”), the various Subsidiaries (such capitalized term and all other capitalized terms not defined herein shall have the meanings provided for in Article I) of the Borrowers that are parties hereto, the various financial institutions that are parties hereto (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).

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Amended and Restated Master Development and Supply Agreement Between Apple and M-FLEX
Supply Agreement • May 3rd, 2012 • Multi Fineline Electronix Inc • Printed circuit boards • California

This Amended and Restated Master Development and Supply Agreement #C56-12-00150 (this “Agreement”) is entered into by and between Apple Inc., a California corporation located at 1 Infinite Loop, Cupertino, California 95014, United States (“Apple”), and Multi-Fineline Electronix, Inc. (aka M-FLEX), a Delaware corporation, located at 3140-A Coronado Street, Anaheim, CA 92806 (“Company”), effective as of May 2, 2012 (the “Effective Date”). This Agreement amends, restates and replaces the prior Master Development and Supply Agreement #C56-06-00844.

AMENDMENT NO. 1 TO LOAN AGREEMENT
Loan Agreement • November 17th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards • New York

AMENDMENT NO. 1 TO LOAN AGREEMENT, dated as of August 27, 2009 (this “Agreement”), among MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“U.S. Borrower”), MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore corporation (“Singapore Borrower”, and together with U.S. Borrower, collectively, “Borrowers”), the various Subsidiaries (such capitalized term and all other capitalized terms not defined herein shall have the meanings provided for in Article I) of the Borrowers that are parties hereto, the various financial institutions that are parties hereto (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).

COLLABORATION AGREEMENT
Collaboration Agreement • August 6th, 2007 • Multi Fineline Electronix Inc • Printed circuit boards

In view to further strengthen the close relationship between Party A (hereinafter called A) and Party B (hereinafter called B) and on the base of the principles of equality and mutual benefit, both parties, through friendly negotiation, have agreed to enter into the following agreement under the terms specified as followed:

Line of Credit Agreement Number: Wuzhongyinshouzi No. 0805040
Credit Agreement • January 29th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards

In order to develop a friendly and reciprocal partnership, on the principle of voluntary, equality, mutual benefit and good faith, through negotiation, Party A and Party B enter into the following agreement.

APPLE COMPUTER, INC. MASTER DEVELOPMENT AND SUPPLY AGREEMENT
Development and Supply Agreement • December 9th, 2008 • Multi Fineline Electronix Inc • Printed circuit boards • California

THIS MASTER DEVELOPMENT AND SUPPLY AGREEMENT is entered into by and between Apple Computer, Inc., a California corporation having its principal place of business at 1 Infinite Loop, Cupertino, California 95014, United States and Apple Computer International, an Irish Corporation having its principal place of business at Holly Hill Industrial Estate, Cork City, Ireland (collectively, “Apple”), and Multi-Fineline Electronix, Inc. (aka M-FLEX), a Delaware corporation, having its principal place of business at 3140-A Coronado Street, Anaheim, CA 92806 (“Company”), effective as of June 22, 2006 (the “Effective Date”).

COLLABORATION AGREEMENT
Collaboration Agreement • August 6th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards

In view to further strengthen the close relationship between Party A (hereinafter called A) and Party B (hereinafter called B) and on the base of the principles of equality and mutual benefit, both parties, through friendly negotiation, have agreed to enter into the following agreement under the terms specified as followed:

FORM OF CORPORATE SERVICES AGREEMENT
Form Of • June 3rd, 2004 • Multi Fineline Electronix Inc • Printed circuit boards • Delaware
Guarantee Contract (Line of Credit Extension) No.: Wu Zhong Yin Bao Zi No.: 0461175
Multi Fineline Electronix Inc • May 12th, 2005 • Printed circuit boards

In order to make sure that the debtor obligations under the line of credit extension agreement (referred to as “Master Contract” hereinafter) are effectively implemented as signed by and between the debtor and Party B on October 20, 2004 with the agreement number as Wu Zhong Yin Bao Zi No.: 0461175, Party A is willing to provide security of guaranty to Party B. For the purpose of clarifying the rights and obligations between the two parties, Party A and Party B have concluded the Contract by reaching an agreement through equal negotiations in accordance with the requirements as described in contract laws, security law and other relevant laws and regulations.

Line of Credit Agreement Number: Wuzhongyinshouzi No. 0805039
Credit Agreement • January 29th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards

In order to develop a friendly and reciprocal partnership, on the principle of voluntary, equality, mutual benefit and good faith, through negotiation, Party A and Party B enter into the following agreement.

Line of Credit Extension Agreement No.: Wu Zhong Yin Shou Zi No. 0461175
Extension Agreement • May 12th, 2005 • Multi Fineline Electronix Inc • Printed circuit boards

In order to develop a friendly and mutually beneficial cooperation relationship, Party A and Party B have hereby reached the following agreement through negotiations in accordance with the principle of free will, equality, mutual benefit and integrity.

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