CREDIT AGREEMENT dated as of May 12, 2008 among MATERIAL SCIENCES CORPORATION and JPMORGAN CHASE BANK, N.A.Joinder Agreement • May 16th, 2008 • Material Sciences Corp • Coating, engraving & allied services • Illinois
CREDIT AGREEMENT dated as of May 12, 2008 (as it may be amended or modified from time to time, this “Agreement”), by and among MATERIAL SCIENCES CORPORATION, a Delaware Corporation, and each of the other Loan Parties signatory hereto and JPMORGAN CHASE BANK, N.A.
PLEDGE AND SECURITY AGREEMENTPledge and Security Agreement • May 16th, 2008 • Material Sciences Corp • Coating, engraving & allied services • Illinois
THIS PLEDGE AND SECURITY AGREEMENT (as it may be amended or modified from time to time, the “Security Agreement”) is entered into as of May 12, 2008 by and between MATERIAL SCIENCES CORPORATION, a Delaware corporation (the “Grantor”), and JPMORGAN CHASE BANK, N.A., (the “Lender”).
JPMORGAN CHASE BANK, N.A. MORTGAGEMaterial Sciences Corp • May 16th, 2008 • Coating, engraving & allied services • Illinois
