CREDIT AGREEMENTCredit Agreement • March 29th, 2007 • Hoku Scientific Inc • Miscellaneous electrical machinery, equipment & supplies • Hawaii
Intending to be legally bound by this Credit Agreement (the “Agreement”), dated March 23, 2007 (the “Effective Date”), BANK OF HAWAII, a Hawaii corporation, whose mailing address is P.O. Box 2900, Honolulu, Hawaii 96846 (the “Bank”) and HOKU MATERIALS, INC., a Delaware corporation, whose address is 1075 Opakapaka Street, Kapolei, Hawaii 96707 (the “Borrower”) agree as follows:
= CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTEDHoku Scientific Inc • March 29th, 2007 • Miscellaneous electrical machinery, equipment & supplies • Hawaii
AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO RULE 24B-2 OF THE SECURITIES EXCHANGE ACT OF 1934, AS AMENDED.
