CREDIT AGREEMENT dated as of November 15, 2018 among CABOT MICROELECTRONICS CORPORATION, as the Borrower, THE LENDERS PARTY HERETO, JPMORGAN CHASE BANK, N.A., as Administrative Agent, BANK OF MONTREAL, U.S. BANK NATIONAL ASSOCIATION, HSBC BANK USA,...Credit Agreement • November 15th, 2018 • Cabot Microelectronics Corp • Semiconductors & related devices • Delaware
CREDIT AGREEMENT dated as of November 15, 2018 (this “Agreement”), among Cabot Microelectronics Corporation, a Delaware corporation (the “Borrower”), JPMorgan Chase Bank, N.A., as Administrative Agent (in such capacity, the “Administrative Agent”) and Collateral Agent, and each Issuing Bank and Lender (each as defined below) party hereto from time to time.
