EXHIBIT 10.29 AMENDED AND RESTATED CREDIT AGREEMENT DATED AS OF NOVEMBER 24, 2003Credit Agreement • February 12th, 2004 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Exhibit 10.10 REGISTRATION RIGHTS AGREEMENT by and between CABOT MICROELECTONICS CORPORATIONRegistration Rights Agreement • March 27th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • New York
Exhibit 10.12 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Services Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Massachusetts
1 Exhibit 10.6 CONFIDENTIAL DISCLOSURE & LICENSE AGREEMENT This Confidential Disclosure & License Agreement (as such agreement may be amended from time to time, the "CDL Agreement") is entered into as of March 28, 2000 by and between Cabot...License Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
RECITALSCredit Agreement • May 13th, 2002 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
2 3 (e) Except for the restrictions arising out of its purchase of the property underlying its plant in Geino, Japan from the Japanese government, the Company has (except for the Geino, Japan plant as to which the Company and Cabot Corporation and its...Underwriting Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • New York
WITNESSETH:Rights Agreement • October 6th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
1 EXHIBIT 10.20 EXTENSION OF MANAGEMENT SERVICES AGREEMENT This Extension of the Management Services Agreement (this "Extension") is executed as of the 29th day of September, 2000 by and between Cabot Corporation, a Delaware corporation ("Cabot"), and...Management Services Agreement • December 28th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
1 Exhibit 10.16 REVOLVING CREDIT AGREEMENT Dated as of March 29, 2000Revolving Credit Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
BETWEENCredit Agreement • August 10th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Exhibit 10.2 [CABOT MICROELECTRONICS LOGO] CABOT MICROELECTRONICS CORPORATION SECOND AMENDED AND RESTATED 2000 EQUITY INCENTIVE PLAN NON-QUALIFIED STOCK OPTION GRANT AGREEMENT FOR DIRECTORS [Grant Date] [Director Name] [Address] [Address] Dear...Cabot Microelectronics Corp • December 8th, 2004 • Semiconductors & related devices • Illinois
andRights Agreement • April 4th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • New York
and TENANT: CABOT MICROELECTRONICS CORPORATION SUB-SUB-UNDERLEASE OF LAND AT THE SOUTH SIDE OF CARDIFF ROAD, BARRYCabot Microelectronics Corp • April 3rd, 2000 • Abrasive, asbestos & misc nonmetallic mineral prods
AGREEMENT AND PLAN OF MERGER Dated as of December 14, 2021, by and among CMC MATERIALS, INC., ENTEGRIS, INC. and YOSEMITE MERGER SUB, INC.Agreement and Plan of Merger • December 16th, 2021 • CMC Materials, Inc. • Semiconductors & related devices • Delaware
This AGREEMENT AND PLAN OF MERGER (this “Agreement”), dated as of December 14, 2021, is by and among CMC MATERIALS, INC., a Delaware corporation (the “Company”), ENTEGRIS, INC., a Delaware corporation (“Parent”), and YOSEMITE MERGER SUB, INC., a Delaware corporation and a wholly owned Subsidiary of Parent (“Merger Sub”).
1 EXHIBIT 10.26 AMENDED AND RESTATED CREDIT AGREEMENT dated as of July 5, 2000,Credit Agreement • February 14th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
CREDIT AGREEMENT Dated as of February 13, 2012 among [Missing Graphic Reference] CABOT MICROELECTRONICS CORPORATION, as the Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an L/C Issuer, and The Other Lenders Party...Credit Agreement • May 9th, 2012 • Cabot Microelectronics Corp • Semiconductors & related devices • New York
FOR VALUE RECEIVED, the undersigned (the “Borrower”), hereby promises to pay to _____________________ or registered assigns (the “Lender”), in accordance with the provisions of the Agreement (as hereinafter defined), the principal amount of each Term Loan from time to time made by the Lender to the Borrower under that certain Credit Agreement, dated as of February 13, 2012 (as amended, restated, extended, supplemented or otherwise modified in writing from time to time, the “Agreement;” the terms defined therein being used herein as therein defined), among Cabot Microelectronics Corporation, a Delaware corporation (the “Borrower”), the Lenders from time to time party thereto, and Bank of America, N.A., as Administrative Agent, Swing Line Lender and an L/C Issuer.
AMONGCredit Agreement • August 10th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Exhibit 10.11 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Cabot Microelectronics Corp • February 8th, 2000 • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
AGREEMENT:Credit Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
R E C I T A L SCredit Agreement • December 10th, 2003 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
1 Exhibit 10.7 TRADEMARK LICENSE AGREEMENT THIS AGREEMENT is made and effective as of this 28th day of March, 2000, by and between Cabot Corporation, a corporation organized and existing under the laws of the State of Delaware and having its corporate...License Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Massachusetts
ContractCredit Agreement • December 24th, 2019 • Cabot Microelectronics Corp • Semiconductors & related devices • Delaware
AMENDMENT NO. 1, dated as of December 20, 2019 (this “Amendment”), to the Credit Agreement, dated as of November 15, 2018 (as amended, restated, amended and restated, modified or otherwise supplemented from time to time prior to the date hereof, the “Credit Agreement,” and the Credit Agreement, as amended by this Amendment, the “Amended Credit Agreement”), among CABOT MICROELECTRONICS CORPORATION, a Delaware corporation (the “Borrower”), the several banks and other financial institutions or entities from time to time parties to the Credit Agreement (the “Lenders”), JPMORGAN CHASE BANK, N.A., as Administrative Agent (the “Administrative Agent”) and Collateral Agent and the various other parties thereto. Capitalized terms used and not otherwise defined herein shall have the meanings assigned to such terms in the Credit Agreement.
CREDIT AGREEMENT dated as of November 15, 2018, as amended by Amendment No. 1 dated December 20, 2019 among as the Borrower, THE LENDERS PARTY HERETO, JPMORGAN CHASE BANK, N.A., as Administrative Agent, BANK OF MONTREAL, HSBC BANK USA, NATIONAL...Credit Agreement • February 4th, 2021 • CMC Materials, Inc. • Semiconductors & related devices • Delaware
1 Exhibit 10.11 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as...Of Purchase Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
BYTax Sharing Agreement • March 27th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
VOTING AND SUPPORT AGREEMENTVoting and Support Agreement • August 17th, 2018 • Cabot Microelectronics Corp • Semiconductors & related devices • Delaware
This Voting and Support Agreement (this “Agreement”) dated as of August 14, 2018, is by and between Cabot Microelectronics Corporation, a Delaware corporation (“Parent”) and Fred C. Leonard III (“Shareholder”).
EXHIBIT 10.2 INITIAL PUBLIC OFFERING AND DISTRIBUTION AGREEMENT, DATED AS OF MARCH 28, 2000, BY AND BETWEEN CABOT CORPORATIONOffering and Distribution Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Cabot Microelectronics Corporation 2012 Omnibus Incentive Plan Restricted Stock Award Agreement (United States Employees)Restricted Stock Award Agreement • August 8th, 2012 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
1 Exhibit 10.8 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Dispersion Services Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
EXHIBIT 10.43 GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE This GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE ("Agreement"), is made and entered into on this 29th day of February, 2004, ("Execution Date") by Jeffrey Michael Jenkins (SSN...Cabot Microelectronics Corp • May 7th, 2004 • Semiconductors & related devices • Illinois
RECITALSCabot Microelectronics Corp • February 12th, 2002 • Abrasive, asbestos & misc nonmetallic mineral prods
Exhibit 10.5 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Fumed Metal Oxide Supply Agreement • March 27th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Second Amended and Restated Cabot Microelectronics Corporation 2000 Equity Incentive Plan [Initial] [Annual] Non-Qualified Stock Option Grant Agreement for DirectorsCabot Microelectronics Corp • May 7th, 2010 • Semiconductors & related devices • Illinois
Second Amended and Restated Cabot Microelectronics Corporation 2000 Equity Incentive Plan [Initial][Annual] Restricted Stock Award Agreement for DirectorsCabot Microelectronics Corp • November 25th, 2008 • Semiconductors & related devices • Illinois
Second Amended and Restated Cabot Microelectronics Corporation 2000 Equity Incentive Plan Non-Qualified Stock Option Grant Agreement (United States Employees)Cabot Microelectronics Corp • November 25th, 2008 • Semiconductors & related devices • Illinois
