FRONT-END MANUFACTURING SUPPLY AGREEMENTSupply Agreement • August 6th, 2013 • Micron Technology Inc • Semiconductors & related devices
This Front-End Manufacturing Supply Agreement (the “Agreement”) is entered into as of July 31, 2013 by and between Micron Semiconductor Asia Pte. Ltd., a company with limited liability organized under the laws of Singapore, having an address of 990 Bendemeer Road, Singapore, 339942 (“Recipient”) and Elpida Memory, Inc., a corporation organized under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
RESEARCH AND DEVELOPMENT ENGINEERING SERVICES AGREEMENTResearch and Development Engineering Services Agreement • August 6th, 2013 • Micron Technology Inc • Semiconductors & related devices
This Research and Development Engineering Services Agreement (this “Agreement”) is entered into as of July 31, 2013 by and between Micron Technology, Inc., a Delaware corporation, with its principal place of business at 8000 S. Federal Way, Boise, Idaho 83707 (“Recipient”) and Elpida Memory, Inc., a corporation organized and operating under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
GENERAL SERVICES AGREEMENTGeneral Services Agreement • August 6th, 2013 • Micron Technology Inc • Semiconductors & related devices
This General Services Agreement (the “Agreement”) is entered into as of July 31, 2013 by and between Micron Semiconductor Asia Pte. Ltd., a company with limited liability organized under the laws of Singapore, having an address of 990 Bendemeer Road, Singapore, 339942 (“Recipient”) and Elpida Memory, Inc., a corporation organized under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
ContractSponsor Agreement • August 6th, 2013 • Micron Technology Inc • Semiconductors & related devices
[*] Certain information in this document has been omitted and filed separately with the Securities and Exchange Commission. Confidential treatment has been requested with respect to the omitted portions.
