EXHIBIT "A" SECOND AMENDMENT TO DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC.Assignment of Interest Under Letter Agreement • September 3rd, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
THIS ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC. ("Assignment"), is entered into effective as of April 21, 1999 ("Effective Date"), between FI Financial, LLC ("FIF"), and the party whose name appears below, which party is referred to herein as the "Assignee":
