Agreement No. 98-143 ------ Effective Date: 7/21/98 -------Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • Illinois
EXHIBIT 10.72 VIA FAX AND EMAIL January 19, 1999 Mr. Thomas J. Gentry Vice President, Corporate Staff Manager, Treasury Services Texas Instruments Incorporated P.O. Box 650311 MS 3994 Dallas, TX 75265 RE: Conditional Agreement Reached on Conversion of...Microelectronic Packaging Inc /Ca/ • April 15th, 1999 • Semiconductors & related devices
EXHIBIT 10.73 January 25, 1999 Mr. Wong Lin Hong Director and Executive Vice President Transpac Capital Pte. Ltd. 6 Shenton Way #20-09 DBS Building Tower Two Singapore 068809 RE: Conditional Agreement Reached on Conversion of Debt to Equity Dear Lin...Microelectronic Packaging Inc /Ca/ • April 15th, 1999 • Semiconductors & related devices
EXHIBIT 10.70 January 20, 1999 Dr. Ted Nunthirapakorn, Ph.D. Chief Financial Officer NS Electronics Bangkok Ltd. 40/10 Soi Lasalle, Sukhumvit 105 Bangna, Prakanong Bangkok 10260, Thailand RE: Conditional Agreement Reached on Conversion of Debt to...Microelectronic Packaging Inc /Ca/ • April 15th, 1999 • Semiconductors & related devices
AMENDMENT --------- RESTRUCTURING, SETTLEMENT AND MUTUAL RELEASE AGREEMENT This Amendment to the Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of November 24, 1998 by and among Microelectronic Packaging,...Settlement and Mutual Release Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
