0001011240-06-000010 Sample Contracts

STOCK PURCHASE AGREEMENT BY AND AMONG ELECTRICAL COMPONENTS INTERNATIONAL HOLDINGS COMPANY, VIASYSTEMS GROUP, INC., WIRE HARNESS HOLDING COMPANY, INC. AND WIRE HARNESS INDUSTRIES, INC. Dated as of March 21, 2006

Stock Purchase Agreement • March 22nd, 2006 • Viasystems Inc • Printed circuit boards • New York

• Contract Type
  Stock Purchase Agreement
• Filed
  March 22nd, 2006
• Company
  Viasystems Inc
• Industry
  Printed circuit boards
• Jurisdiction
  New York

This STOCK PURCHASE AGREEMENT, dated as of March 21, 2006 (this “Agreement”), is entered into by and among Electrical Components International Holdings Company, a Delaware corporation (“Purchaser”), Viasystems Group, Inc., a Delaware corporation (“Parent”), Wire Harness Holding Company, Inc., a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Seller”), and Wire Harness Industries, Inc., a Delaware corporation and a direct wholly-owned subsidiary of Seller (the “Company”).