DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • May 14th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • May 14th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC.Assignment of Interest Under Letter Agreement • May 14th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
THIS ASSIGNMENT OF INTEREST UNDER LETTER AGREEMENT WITH STMICROELECTRONICS, INC. ("Assignment"), is entered into effective as of April 21, 1999 ("Effective Date"), between FI Financial, LLC ("FIF"), and the party whose name appears below, which party is referred to herein as the "Assignee":
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENTConversion Agreement • May 14th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.80 VIA FAX April 15, 1999 Mr. James T. Waring, Manager FI Financial, LLC c/o Ross Dixon & Bell 550 West B Street, Suite 400 San Diego, CA 92101-3599 RE: Conditional Agreement Reached on Conversion of Debt to Equity Dear Mr. Waring: On...Microelectronic Packaging Inc /Ca/ • May 14th, 1999 • Semiconductors & related devices
