SECOND LIEN PLEDGE AND SECURITY AGREEMENT DATED AS OF OCTOBER 27, 2004Pledge and Security Agreement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
AMONG AMKOR TECHNOLOGY, INC. AS BORROWERCredit Agreement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 1 TO CREDIT AGREEMENT This AMENDMENT NO. 1 TO THE CREDIT AGREEMENT, dated as of October 27, 2004, among Amkor Technology, Inc. a Delaware corporation (the "Borrower"), the Lenders (as defined below) party hereto and the Administrative...Credit Agreement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
SUBSIDIARY GUARANTY SUBSIDIARY GUARANTY, dated as of October 27, 2004 (this "Guaranty"), by GUARDIAN ASSETS, INC. ("Guardian"), UNITIVE, INC. ("Unitive"), UNITIVE ELECTRONICS, INC. ("ELECTRONICS") and each other entity that becomes a party hereto...Subsidiary Guaranty • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
EXHIBIT 10.7 INTERCREDITOR AGREEMENT This INTERCREDITOR AGREEMENT, dated as of October 27, 2004, is entered into among CITICORP NORTH AMERICA, INC. ("CNAI"), as administrative agent and collateral agent for the Senior Parties (in such capacity, the...Intercreditor Agreement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
GUARANTY SUPPLEMENTAmkor Technology Inc • November 2nd, 2004 • Semiconductors & related devices
Each of the undersigned hereby agrees to be bound as a Guarantor for purposes of the Guaranty, dated as of June 29, 2004 (the "Guaranty"), among GUARDIAN ASSETS, INC. and certain other Subsidiaries of AMKOR TECHNOLOGY, INC. from time to time party thereto as Guarantors and acknowledged by CITICORP NORTH AMERICA, INC., as Administrative Agent, and each of the undersigned hereby acknowledges receipt of a copy of the Guaranty and the Credit Agreement. Each of the undersigned hereby represents and warrants that each of the representations and warranties contained in Section 16 (Representations and Warranties; Covenants) of the Guaranty applicable to it is true and correct on and as the date hereof as if made on and as of such date. Capitalized terms used herein but not defined herein are used with the meanings given them in the Guaranty.
