INDENTUREIndenture • April 7th, 2014 • Micron Technology Inc • Semiconductors & related devices • New York
THIS INDENTURE is made as of December 16, 2013 by and among MICRON SEMICONDUCTOR ASIA PTE. LTD., a company organized under the laws of the Republic of Singapore, as Issuer (the “Issuer”), WELLS FARGO BANK, NATIONAL ASSOCIATION, not in its individual capacity, except as expressly provided herein, but solely as indenture trustee on behalf of the Noteholders and/or as custodian and agent pursuant to Section 2.03(b)(ii) hereof (in either such capacity, together with its successors, the “Indenture Trustee”), WELLS FARGO BANK NORTHWEST, NATIONAL ASSOCIATION, not in its individual capacity, but solely as security trustee, (in such capacity, together with its successors, the “Security Trustee”) and EXPORT-IMPORT BANK OF THE UNITED STATES, an independent agency of the United States of America (“Ex-Im Bank”).
INDEMNIFICATION AGREEMENTIndemnification Agreement • April 7th, 2014 • Micron Technology Inc • Semiconductors & related devices • Delaware
This Indemnification Agreement (“Agreement”) is made as of ________________, by and between Micron Technology, Inc., a Delaware corporation (the “Company”), and ____________________ (“Indemnitee”).
