FRONT-END MANUFACTURING SUPPLY AGREEMENTSupply Agreement • October 2nd, 2013 • Micron Technology Inc • Semiconductors & related devices
This Front-End Manufacturing Supply Agreement (the “Agreement”) is entered into as of July 31, 2013 by and between Micron Semiconductor Asia Pte. Ltd., a company with limited liability organized under the laws of Singapore, having an address of 990 Bendemeer Road, Singapore, 339942 (“Recipient”) and Elpida Memory, Inc., a corporation organized under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
GENERAL SERVICES AGREEMENTGeneral Services Agreement • October 2nd, 2013 • Micron Technology Inc • Semiconductors & related devices
This General Services Agreement (the “Agreement”) is entered into as of July 31, 2013 by and between Micron Semiconductor Asia Pte. Ltd., a company with limited liability organized under the laws of Singapore, having an address of 990 Bendemeer Road, Singapore, 339942 (“Recipient”) and Elpida Memory, Inc., a corporation organized under the laws of Japan with its principal place of business at 2-1, Yaesu 2-chome, Chuo-ku, Tokyo, 104-0028, Japan (“Provider”). Each of Recipient and Provider may be referred to individually as a “Party” and collectively as the “Parties”.
