DENOTES CONFIDENTIAL MATERIALS OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO A REQUEST FOR CONFIDENTIAL TREATMENT.Omnibus Agreement • April 10th, 2007 • Micron Technology Inc • Semiconductors & related devices • Delaware
This OMNIBUS AGREEMENT (this “Agreement”), is made and entered into as of this 27th day of February, 2007, by and between Micron Technology, Inc., a Delaware corporation (“Micron”), and Intel Corporation, a Delaware corporation (“Intel”) (Micron and Intel are each referred to individually as a “Party,” and collectively as the “Parties”).
SUPPLY AGREEMENTSupply Agreement • April 10th, 2007 • Micron Technology Inc • Semiconductors & related devices
This SUPPLY AGREEMENT (the “Agreement”), is made and entered into as of this 27th day of February, 2007 (the “Effective Date”), by and between Intel Technology Asia Pte Ltd, a Singapore private limited company (“Intel Singapore”), and IM Flash Singapore, LLP, a Singapore limited liability partnership (the “Joint Venture Company”).
LEXAR MEDIA, INC. To as Trustee FIRST SUPPLEMENTAL INDENTURE Dated as of June 21, 2006 Supplementing the Indenture, dated as of March 30, 2005, between Lexar Media, Inc. andFirst Supplemental Indenture • April 10th, 2007 • Micron Technology Inc • Semiconductors & related devices • New York
FIRST SUPPLEMENTAL INDENTURE, dated as of June 21, 2006 (this “First Supplemental Indenture”), between Lexar Media, Inc., a Delaware corporation (the “Company”), having its principal office at 47300 Bayside Parkway, Fremont, CA 94538 and U.S. Bank National Association, a national banking association organized under the laws of the United States, as Trustee under the Indenture referred to herein (the “Trustee”). This First Supplemental Indenture shall become effective only immediately after the closing of the Merger in accordance with the Merger Agreement.
SUPPLY AGREEMENTSupply Agreement • April 10th, 2007 • Micron Technology Inc • Semiconductors & related devices
This SUPPLY AGREEMENT (the “Agreement”), is made and entered into as of this 27th day of February, 2007 (the “Effective Date”), by and between Micron Semiconductor Asia Pte. Ltd., a Singapore private limited company (“Micron Singapore”), and IM Flash Singapore, LLP, a Singapore limited liability partnership (the “Joint Venture Company”).
DENOTES CONFIDENTIAL MATERIALS OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO A REQUEST FOR CONFIDENTIAL TREATMENT.Limited Liability Partnership Agreement • April 10th, 2007 • Micron Technology Inc • Semiconductors & related devices • Delaware
This LIMITED LIABILITY PARTNERSHIP AGREEMENT (this “Agreement”) of IM Flash Singapore, LLP, a limited liability partnership organized under the laws of Singapore (the “Joint Venture Company”), is made and entered into as of this 27th day of February, 2007 (the “Effective Date”), by and between Micron Semiconductor Asia Pte. Ltd., a private limited company organized under the laws of Singapore (“Micron Singapore”), and Intel Technology Asia Pte Ltd, a private limited company organized under the laws of Singapore (“Intel Singapore”) (Micron Singapore and Intel Singapore are each referred to individually as a “Member,” and collectively as the “Members”). Capitalized terms used in this Agreement shall have the respective meanings ascribed to such terms in Appendix A to this Agreement or as otherwise provided in Section 18.14.
