Common Contracts

AGREEMENT AND PLAN OF MERGER by and among: MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation, VICTORY MERGER SUB, INC., a Delaware corporation, and VOLTERRA SEMICONDUCTOR CORPORATION, a Delaware corporation Dated as of August 15, 2013

Agreement and Plan of Merger • August 22nd, 2013 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  August 22nd, 2013
• Company
  Maxim Integrated Products Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of August 15, 2013, by and among: Maxim Integrated Products, Inc., a Delaware corporation (“Parent”), Victory Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”), and Volterra Semiconductor Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.

AGREEMENT AND PLAN OF MERGER by and among: MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation, VICTORY MERGER SUB, INC., a Delaware corporation, and VOLTERRA SEMICONDUCTOR CORPORATION, a Delaware corporation Dated as of August 15, 2013

Agreement and Plan of Merger • August 19th, 2013 • Volterra Semiconductor Corp • Semiconductors & related devices • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  August 19th, 2013
• Company
  Volterra Semiconductor Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of August 15, 2013, by and among: Maxim Integrated Products, Inc., a Delaware corporation (“Parent”), Victory Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”), and Volterra Semiconductor Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.

AGREEMENT AND PLAN OF MERGER among: APPLIED MATERIALS, INC., a Delaware corporation; JUPITER ACQUISITION SUB, INC., a Montana corporation; and SEMITOOL, INC., a Montana corporation Dated as of November 16, 2009

Agreement and Plan of Merger • November 19th, 2009 • Applied Materials Inc /De • Semiconductors & related devices • Montana

• Contract Type
  Agreement and Plan of Merger
• Filed
  November 19th, 2009
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  Montana

THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of November 16, 2009, by and among: APPLIED MATERIALS, INC., a Delaware corporation (“Parent”); JUPITER ACQUISITION SUB, INC., a Montana corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”); and SEMITOOL, INC., a Montana corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.