1 EXHIBIT 10.21 SHAREHOLDER'S AGREEMENT THIS AGREEMENT is made as of the ___ day of ________________, 19__, by and between DALLAS SEMICONDUCTOR CORPORATION, a Delaware corporation (the "Company"), and _________________________________ (the...Shareholder's Agreement • September 24th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
EXHIBIT 10.29 INDEMNIFICATION AGREEMENT THIS AGREEMENT is made as of the _____ day of __________, 19___, by and between Dallas Semiconductor Corporation, a Delaware corporation (the "Company"), and ________________________________________, a director...Indemnification Agreement • September 24th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
EXHIBIT 99.2 Subject to the provisions of the Merger Agreement, dated as of January 28, 2001 (the "Merger Agreement"), among Maxim Integrated Products, Inc. ("Parent"), MI Acquisition Sub, Inc. and Dallas Semiconductor Corporation (the "Company"), at...Merger Agreement • January 30th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices
AMONGAgreement and Plan of Merger • January 30th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
J.P. Morgan CREDIT AGREEMENT dated as of October 13, 2011 among MAXIM INTEGRATED PRODUCTS, INC. The Lenders Party Hereto JPMORGAN CHASE BANK, N.A. as Administrative Agent andBANK OF AMERICA, N.A., WELLS FARGO BANK, NATIONAL ASSOCIATION and MORGAN...Credit Agreement • October 26th, 2011 • Maxim Integrated Products Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT (this “Agreement”) dated as of October 13, 2011 among MAXIM INTEGRATED PRODUCTS, INC., the LENDERS from time to time party hereto, JPMORGAN CHASE BANK, N.A., as Administrative Agent, and BANK OF AMERICA, N.A., WELLS FARGO BANK, NATIONAL ASSOCIATION and MORGAN STANLEY MUFG LOAN PARTNERS, LLC, as Co-Documentation Agents.
1 EXHIBIT 10.19 ASSUMPTION AGREEMENT THIS ASSUMPTION AGREEMENT is executed and delivered pursuant to that certain Agreement and Plan of Merger, dated as of January 28, 2001 (the "Merger Agreement"), by and among Maxim Integrated Products, Inc., a...Assumption Agreement • September 24th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
MAXIM INTEGRATED PRODUCTS, INC. Underwriting AgreementUnderwriting Agreement • June 13th, 2017 • Maxim Integrated Products Inc • Semiconductors & related devices • New York
Maxim Integrated Products, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as representative (the “Representative”), $500,000,000 principal amount of its 3.450% Senior Notes due 2027 having the terms set forth in Schedule 2 hereto (the “Securities”). The Securities will be issued pursuant to the Indenture dated as of June 10, 2010 (the “Base Indenture”) between the Company and Wells Fargo Bank, National Association, as trustee (the “Trustee”) as supplemented by Supplemental Indenture No. 4, to be dated as of June 15, 2017 (the “Supplemental Indenture”), between the Company and the Trustee. The Base Indenture, as supplemented by the Supplemental Indenture is referred to herein as the “Indenture.”
MAXIM INTEGRATED PRODUCTS, INC. INDEMNIFICATION AGREEMENTIndemnification Agreement • September 8th, 2005 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT is entered into, effective as of , by and between Maxim Integrated Products, Inc., a Delaware corporation (the “Company”), and (“Indemnitee”).
1 EXHIBIT 10.25 DALLAS SEMICONDUCTOR CORPORATION SPLIT-DOLLAR INSURANCE AGREEMENT THIS AGREEMENT is entered into as of this 20th day of July, 2000, by and between Merlyn D. Sampels ("Participant"), whose address is 7718 Caruth Boulevard, Dallas, Texas...Dollar Insurance Agreement • September 24th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
AGREEMENT AND PLAN OF MERGER by and among: ANALOG DEVICES, INC., a Massachusetts corporation; MAGNETO CORP., a Delaware corporation; and MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation Dated as of July 12, 2020Agreement and Plan of Merger • July 13th, 2020 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of July 12, 2020, by and among: ANALOG DEVICES, INC., a Massachusetts corporation (“Parent”); MAGNETO CORP., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”); and MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
MAXIM INTEGRATED PRODUCTS, INC. Underwriting AgreementUnderwriting Agreement • June 16th, 2010 • Maxim Integrated Products Inc • Semiconductors & related devices • New York
Maxim Integrated Products, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as representatives (the “Representatives”), $300,000,000 principal amount of its 3.45% Senior Notes due 2013 having the terms set forth in Schedule 2 hereto (the “Securities”). The Securities will be issued pursuant to an Indenture to be dated as of June 10, 2010 (the “Base Indenture”) between the Company and Wells Fargo Bank, National Association, as trustee (the “Trustee”) as supplemented by Supplemental Indenture No. 1, to be dated as of June 17, 2010 (the “Supplemental Indenture”), between the Company and the Trustee. The Base Indenture, as supplemented by the Supplemental Indenture is referred to herein as the “Indenture.”
LEASELease • September 29th, 1997 • Maxim Integrated Products Inc • Semiconductors & related devices • California
EMPLOYMENT AGREEMENT between MAXIM INTEGRATED PRODUCTS, INC., a Delaware Corporation and TUNC DOLUCA SEP 30, 1993Employment Agreement • September 30th, 2008 • Maxim Integrated Products Inc • Semiconductors & related devices • California
THIS EMPLOYMENT AGREEMENT (this “Agreement”) is made and entered into effective as of SEP 30, 1993 by and between Maxim Integrated Products, Inc., a Delaware corporation (the “Company”), and TUNC DOLUCA (“Employee”).
1 EXHIBIT 10.23 EMPLOYMENT AGREEMENT THIS EMPLOYMENT AGREEMENT (this "Agreement") is made and entered into as of April 11, 2001, by and between Dallas Semiconductor Corporation, a Delaware corporation (the "Company"), and Alan P. Hale ("Executive")....Employment Agreement • September 24th, 2001 • Maxim Integrated Products Inc • Semiconductors & related devices • Texas
AGREEMENT AND PLAN OF MERGER by and among MAXIM INTEGRATED PRODUCTS, INC., MIP TROPIC, INC., TERIDIAN SEMICONDUCTOR HOLDINGS CORPORATION, GGC SERVICES HOLDCO, LLC, and TERIDIAN SEMICONDUCTOR CORPORATION as of April 9, 2010Agreement and Plan of Merger • April 14th, 2010 • Maxim Integrated Products Inc • Semiconductors & related devices
This Agreement and Plan of Merger (the "Agreement") is made as of April 9, 2010, by and among Maxim Integrated Products, Inc., a Delaware corporation (the "Purchaser"), MIP Tropic, Inc., a Delaware corporation and a wholly-owned subsidiary of the Purchaser (the "Merger Sub"), Teridian Semiconductor Holdings Corporation, a Delaware corporation (the "Company"), GGC Services Holdco, LLC, not individually, but solely in its capacity as the representative of the Securityholders (the "Stockholder Representative") and Teridian Semiconductor Corporation, a California corporation, solely for purposes of Article 5 hereof (the "OpCo"). Except as otherwise set forth herein, capitalized terms used herein have the meanings set forth in Exhibit A.
RESTRICTED STOCK UNIT AGREEMENTRestricted Stock Unit Agreement • August 19th, 2020 • Maxim Integrated Products Inc • Semiconductors & related devices • California
MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation (the “Company”), pursuant to its 1996 Stock Incentive Plan (the “Plan”) has granted to Grantee an award of restricted stock units (the “Restricted Stock Units”) with the terms set forth in a document delivered separately to Grantee (the “Grant Notice”). The Restricted Stock Units are subject to all of the terms and conditions in the Grant Notice, this Restricted Stock Unit Agreement and any appendix for Grantee’s country1 (the “Appendix,” and together with the Restricted Stock Unit Agreement and the Grant Notice, the “Agreement”) and the Plan. Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
PERFORMANCE SHARE AGREEMENTPerformance Share Agreement • October 30th, 2019 • Maxim Integrated Products Inc • Semiconductors & related devices • California
MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation (the “Company”), pursuant to its 1996 Stock Incentive Plan (the “Plan”) has granted to Grantee an award of performance shares (the “Performance Shares”). The Performance Shares are subject to all of the terms and conditions in this Performance Share Agreement and any appendix for Grantee’s country (the “Appendix,” and together with the Performance Share Agreement, the “Agreement”) and the Plan. Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
AGREEMENT AND PLAN OF MERGER by and among: MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation, VICTORY MERGER SUB, INC., a Delaware corporation, and VOLTERRA SEMICONDUCTOR CORPORATION, a Delaware corporation Dated as of August 15, 2013Agreement and Plan of Merger • August 22nd, 2013 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of August 15, 2013, by and among: Maxim Integrated Products, Inc., a Delaware corporation (“Parent”), Victory Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”), and Volterra Semiconductor Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
TENDER AND SUPPORT AGREEMENTTender and Support Agreement • August 22nd, 2013 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
This Tender and Support Agreement (“Agreement”) is made and entered into as of August 15, 2013, by and among: Maxim Integrated Products, Inc., a Delaware corporation (“Parent”), Victory Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”), and each of the stockholders set forth on Exhibit A, in their individual capacities (the “Stockholders”). Capitalized terms used but not defined herein have the definitions given to them in the Merger Agreement (as defined below).
MAXIM INTEGRATED PRODUCTS, INC.Employee Stock Purchase Plan • October 30th, 2019 • Maxim Integrated Products Inc • Semiconductors & related devices
MAXIM INTEGRATED PRODUCTS INC. 1996 STOCK INCENTIVE PLAN STOCK OPTION AGREEMENT (LEGAL PROVISIONS GOVERNING THE OPTION)Stock Incentive Plan Stock Option Agreement • November 6th, 2008 • Maxim Integrated Products Inc • Semiconductors & related devices • California
Maxim Integrated Products, Inc., a Delaware corporation (the "Company"), pursuant to its 1996 Stock Incentive Plan (the "Plan") has granted to Grantee, the Grantee named on the Notice of Grant of Stock Options (the "Grant Notice"), which has been delivered to Grantee separately, an option (the "Option") to purchase shares of the common stock of the Company ("Common Stock"). The Option will not be treated as an "incentive stock option" within the meaning of Section 422 of the Internal Revenue Code of 1986, as amended (the "Code"). Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
Volterra Semiconductor Corporation 47467 Fremont Blvd. Fremont, CA 94538 Attn: General Counsel Ladies and Gentlemen:Maxim Integrated Products Inc • September 20th, 2013 • Semiconductors & related devices • California
In order to facilitate the consideration and negotiation of a possible negotiated transaction involving Maxim Integrated Products, Inc (the “Recipient”) and Volterra Semiconductor Corporation (the “Company”), the Recipient has requested access to certain non-public information regarding the Company and its subsidiaries. This letter agreement sets forth the Recipient’s obligations regarding the use and disclosure of such information and regarding various related matters.
MAXIM INTEGRATED PRODUCTS, INC. 1996 STOCK INCENTIVE PLAN RESTRICTED STOCK UNIT AGREEMENT FOR NON-U.S. GRANTEESRestricted Stock Unit Agreement • November 6th, 2008 • Maxim Integrated Products Inc • Semiconductors & related devices • California
MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation (the "Company"), pursuant to its 1996 Stock Incentive Plan (the "Plan") has granted to Grantee, the Grantee named on the Notice of Grant of Restricted Stock Unit (the "Grant Notice"), which has been delivered to Grantee separately, an award of restricted stock units (the "Restricted Stock Units"), subject to all of the terms and conditions in the Grant Notice, this Agreement, any country-specific appendix for Grantee's country of residence (the "Appendix") and the Plan. Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
ENROLLMENT FORM AGREEMENTEmployee Stock Purchase Plan • November 1st, 2018 • Maxim Integrated Products Inc • Semiconductors & related devices
August 14, 2013Maxim Integrated Products Inc • September 20th, 2013 • Semiconductors & related devices
We are writing with regard to that certain Letter Agreement, dated as of June 24, 2013 and as amended in July 2013, by and between Maxim Integrated Products, Inc. (“Maxim”) and Volterra Semiconductor Corporation (“Volterra”) governing Maxim’s and Volterra’s confidentiality obligations in connection with its consideration and negotiation of a possible negotiated transaction involving Volterra (as so amended, the “Letter Agreement”). This letter confirms the parties’ mutual understanding and agreement that the Letter Agreement is hereby amended as follows:
RELEASE OF CLAIMS AND VESTING AGREEMENTRelease of Claims and Vesting Agreement • May 21st, 2008 • Maxim Integrated Products Inc • Semiconductors & related devices
MAXIM INTEGRATED PRODUCTS, INC. 1996 STOCK INCENTIVE PLAN RESTRICTED STOCK UNIT AGREEMENT FOR U.S. GRANTEESRestricted Stock Unit Agreement • November 6th, 2008 • Maxim Integrated Products Inc • Semiconductors & related devices • California
MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation (the "Company"), pursuant to its 1996 Stock Incentive Plan (the "Plan") has granted to Grantee, the Grantee named on the Notice of Grant of Restricted Stock Unit (the "Grant Notice"), which has been delivered to Grantee separately, an award of restricted stock units (the "Restricted Stock Units"), subject to all of the terms and conditions in the Grant Notice, this Agreement and the Plan. Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
CREDIT AGREEMENT dated as of June 23, 2016 among MAXIM HOLDING COMPANY LTD. and THE BANK OF TOKYO-MITSUBISHI UFJ, LTD., NEW YORK BRANCH as LenderCredit Agreement • June 24th, 2016 • Maxim Integrated Products Inc • Semiconductors & related devices • New York
SUPPLY AGREEMENTSupply Agreement • May 10th, 2016 • Maxim Integrated Products Inc • Semiconductors & related devices • California
This Supply Agreement (this “Agreement”) is made and entered into effective as of the Closing Date by and among MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation (“Maxim US”), and MAXIM INTEGRATED PRODUCTS INTERNATIONAL, LTD., an Ireland corporation (“MIPI”) (together, “Maxim”), and TJ TEXAS, INC., a corporation organized under the laws of Delaware (“Supplier”). Maxim and Supplier are each sometimes referred to herein as a “Party” and collectively as the “Parties.” The Parties agree that this Agreement will be binding on the Parties on the date hereof, however, will only become effective on the Closing Date (as defined below).
MAXIM INTEGRATED PRODUCTS, INC. 1996 STOCK INCENTIVE PLAN RESTRICTED STOCK UNIT AGREEMENT U.S. GRANTEESRestricted Stock • November 5th, 2009 • Maxim Integrated Products Inc • Semiconductors & related devices • California
Maxim Integrated Products, Inc., a Delaware corporation (the "Company"), pursuant to its 1996 Stock Incentive Plan (the "Plan") has granted to Grantee, the Grantee named on the Notice of Grant of Restricted Stock Unit (the "Grant Notice"), which has been delivered to Grantee separately, an award of restricted stock units (the "Restricted Stock Units"), subject to all of the terms and conditions in the Grant Notice, this Agreement and the Plan. Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
MAXIM INTEGRATED PRODUCTS INC. 1996 STOCK INCENTIVE PLAN STOCK OPTION AGREEMENT (LEGAL PROVISIONS GOVERNING THE OPTION)Stock Incentive Plan Stock Option Agreement • November 5th, 2009 • Maxim Integrated Products Inc • Semiconductors & related devices • California
Maxim Integrated Products, Inc., a Delaware corporation (the "Company"), pursuant to its 1996 Stock Incentive Plan (the "Plan") has granted to Grantee, the Grantee named on the Notice of Grant of Stock Options (the "Grant Notice"), which has been delivered to Grantee separately, an option (the "Option") to purchase shares of the common stock of the Company ("Common Stock"). The Option will not be treated as an "incentive stock option" within the meaning of Section 422 of the Internal Revenue Code of 1986, as amended (the "Code"). Unless otherwise defined herein, capitalized terms shall have the meaning ascribed to such terms in the Plan.
MAXIM INTEGRATED PRODUCTS, INC. PERFORMANCE SHARE AGREEMENTPerformance Share Agreement • October 26th, 2012 • Maxim Integrated Products Inc • Semiconductors & related devices • California
This Performance Share Agreement (the “Agreement”) is made as of the ___ day of October 2012 by and among Maxim Integrated Products, Inc., a Delaware corporation (“Maxim Integrated”), and ______________ (“Grantee”).
SECOND AMENDMENT TO CREDIT AGREEMENTCredit Agreement • August 18th, 2015 • Maxim Integrated Products Inc • Semiconductors & related devices
THIS SECOND AMENDMENT TO CREDIT AGREEMENT (this “Agreement”), dated as of July 21, 2015, is made among Maxim Integrated Products, Inc., the Lenders party hereto, and Wells Fargo Bank, National Association (“Wells Fargo Bank”), in its capacity as Administrative Agent.
THIRD AMENDMENT TO CREDIT AGREEMENTCredit Agreement • August 12th, 2016 • Maxim Integrated Products Inc • Semiconductors & related devices
THIS THIRD AMENDMENT TO CREDIT AGREEMENT (this “Agreement”), dated as of June 13, 2016, is made among Maxim Integrated Products, Inc., the Lenders party hereto, and Wells Fargo Bank, National Association (“Wells Fargo Bank”), in its capacity as Administrative Agent.
AGREEMENT AND PLAN OF MERGER by and among: MAXIM INTEGRATED PRODUCTS, INC., a Delaware corporation, VICTORY MERGER SUB, INC., a Delaware corporation, and VOLTERRA SEMICONDUCTOR CORPORATION, a Delaware corporation Dated as of August 15, 2013Agreement and Plan of Merger • August 19th, 2013 • Maxim Integrated Products Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of August 15, 2013, by and among: Maxim Integrated Products, Inc., a Delaware corporation (“Parent”), Victory Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”), and Volterra Semiconductor Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
