WITNESSETH:Loan Agreement • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices
ALLEGRO MICROSYSTEMS, INC. INDEMNIFICATION AGREEMENTIndemnification Agreement • October 21st, 2020 • Allegro Microsystems Inc • Semiconductors & related devices • Delaware
THIS INDEMNIFICATION AGREEMENT (the “Agreement”) is made and entered into as of ______________, 2020 between Allegro MicroSystems, Inc., a Delaware corporation (the “Company”), and [Name] (“Indemnitee”).
WITNESSETHAllegro Microsystems Inc • August 8th, 2007 • Semiconductors & related devices
WITNESSETH:Lease Agreement • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices • New Hampshire
• ] shares of Common Stock ALLEGRO MICROSYSTEMS, INC. UNDERWRITING AGREEMENTUnderwriting Agreement • October 21st, 2020 • Allegro Microsystems Inc • Semiconductors & related devices • New York
Allegro MicroSystems, Inc., a Delaware corporation (the “Company”), propose to sell [•] shares (the “Firm Stock”) of the Company’s common stock, par value $0.01 per share (the “Common Stock”). In addition, certain stockholders of the Company named in Schedule II attached hereto (the “Selling Stockholders”) propose to grant to the underwriters named in Schedule I (the “Underwriters”) attached to this agreement (this “Agreement”) an option to purchase up to an aggregate of [•] additional shares of the Common Stock on the terms set forth in Section 3 (the “Option Stock”). The Firm Stock and the Option Stock, if purchased, are hereinafter collectively called the “Stock.” This Agreement is to confirm the agreement concerning the purchase of the Stock from the Company and the Selling Stockholders by the Underwriters.
7,500,000 Shares of Common Stock ALLEGRO MICROSYSTEMS, INC. UNDERWRITING AGREEMENTUnderwriting Agreement • November 3rd, 2021 • Allegro Microsystems, Inc. • Semiconductors & related devices • New York
The stockholder named in Schedule II attached hereto (the “Selling Stockholder”) of Allegro MicroSystems, Inc., a Delaware corporation (the “Company”), propose to sell, severally and not jointly, to the underwriters named in Schedule I (the “Underwriters”) attached to this agreement (this “Agreement”), an aggregate of 7,500,000 shares (the “Firm Stock”) of the Company’s common stock, par value $0.01 per share (the “Common Stock”) and, at the election of the Underwriters, up to an aggregate of 1,125,000 additional shares of the Common Stock on the terms set forth in Section 3 (the “Option Stock”). The Firm Stock and the Option Stock, if purchased, are hereinafter collectively called the “Stock.” This Agreement is to confirm the agreement concerning the purchase of the Stock from the Selling Stockholder by the Underwriters. To the extent there are no additional Underwriters listed on Schedule I other than you, the term Representatives as used herein shall mean you, as the Underwriter, an
ALLEGRO MICROSYSTEMS, INC. INDENTURE Dated as of____________, 20__ TrusteeIndenture • November 1st, 2021 • Allegro Microsystems, Inc. • Semiconductors & related devices • New York
AMENDMENT NO. 1 (this “Amendment”), dated as of October 31, 2023, to the Credit Agreement, dated as of June 21, 2023 (as amended, restated, supplemented or otherwise modified from time to time prior to the date hereof, the “Existing Credit...Credit Agreement • November 1st, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices • New York
This CREDIT AGREEMENT is entered into as of June 21, 2023 by and among Allegro MicroSystems, Inc., a Delaware corporation (the “Borrower”), Morgan Stanley Senior Funding, Inc., as administrative agent under the Loan Documents (in such capacity, including any successor thereto, the “Administrative Agent”), Morgan Stanley Senior Funding, Inc., as collateral agent under the Loan Documents (in such capacity, including any successor thereto, the “Collateral Agent”), and each lender from time to time party hereto (collectively, the “Lenders” and, individually, a “Lender”). Capitalized terms used herein are defined as set forth in Section 1.01.
EXHIBIT 10.15 CONTRACT OF LEASE KNOW ALL MEN BY THESE PRESENTS: This Contract of Lease, made and executed by and between: The GOVERNMENT OF THE REPUBLIC OF THE PHILIPPINES, through its Trustee, the ASSET PRIVATIZATION TRUST, a government agency...Contract of Lease • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices
EXHIBIT 10.11 CONFIDENTIAL MATERIALS OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION. THE LOCATIONS OF THE OMITTED MATERIALS ARE INDICATED BY THE FOLLOWING NOTATION: [***]. TECHNOLOGY DEVELOPMENT AGREEMENTTechnology Development Agreement • March 7th, 2008 • Allegro Microsystems Inc • Semiconductors & related devices
FIRST AMENDMENTTerm Loan Credit Agreement • August 4th, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices • New York
This TERM LOAN CREDIT AGREEMENT is entered into as of September 30, 2020, by and among Allegro MicroSystems, Inc., a Delaware corporation (the “Borrower”), Credit Suisse AG, Cayman Islands Branch, as administrative agent under the Loan Documents (in such capacity, including any successor thereto, the “Administrative Agent”), Credit Suisse AG, Cayman Islands Branch, as collateral agent under the Loan Documents (in such capacity, including any successor thereto, the “Collateral Agent”), Credit Suisse Loan Funding LLC, Barclays Bank PLC, Mizuho Bank, Ltd. and Sumitomo Mitsui Banking Corporation as joint lead arrangers and joint bookrunners (collectively, the “Lead Arrangers”), and each lender from time to time party hereto (collectively, the “Lenders” and, individually, a “Lender”). Capitalized terms used herein are defined as set forth in Section 1.01.
AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • November 2nd, 2020 • Allegro Microsystems, Inc. • Semiconductors & related devices • New York
This AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENT (this “Agreement”), dated as of November 2, 2020, is by and among Allegro MicroSystems, Inc., a Delaware corporation (the “Corporation”), Sanken Electric Co., Ltd, a Japanese corporation (“Sanken”) and OEP SKNA, L.P., a Cayman Islands exempted limited partnership (“OEP” and, together with Sanken and any other Person who may become a party hereto pursuant to Section 13(c), each a “Stockholder” and, collectively, the “Stockholders”).
REVOLVING CREDIT AGREEMENTRevolving Credit Agreement • October 6th, 2020 • Allegro Microsystems Inc • Semiconductors & related devices • New York
REVOLVING CREDIT AGREEMENT, dated as of January 22, 2019 (as the same may be amended, supplemented or otherwise modified from time to time, this “Credit Agreement”), between ALLEGRO MICROSYSTEMS, LLC, a limited liability company duly formed and validly existing under the laws of the State of Delaware (the “Borrower”), and MIZUHO BANK, LTD. (together with its successors and assigns, the “Lender”).
AMENDED AND RESTATED SEVERANCE AGREEMENTSeverance Agreement • February 1st, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices • New Hampshire
THIS AGREEMENT (the “Agreement”) is entered into as of September 30, 2020 between Allegro MicroSystems, LLC, a Delaware limited liability company (“Allegro”), and Thomas Teebagy, Sr. VP, Operations & Quality of Allegro (“Executive”).
SEVERANCE AGREEMENTSeverance Agreement • February 1st, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices • New Hampshire
THIS AGREEMENT (the "Agreement") is entered into as of February 15th, 2021 between Allegro MicroSystems, LLC, a Delaware limited liability company("Allegro") and Suman Narayan, VP, Magnetic Sensor Business Unit of Allegro ("Executive").
CREDIT AGREEMENT dated as of June 21, 2023 by and among Allegro MicroSystems, Inc., as Borrower Morgan Stanley Senior Funding, Inc., as Administrative Agent, Morgan Stanley Senior Funding, Inc., as Collateral Agent and THE LENDERS PARTY HERETO...Credit Agreement • June 23rd, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices • New York
REVOLVING FACILITY SECURITY AGREEMENT dated as of September 30, 2020 by and among ALLEGRO MICROSYSTEMS, INC., as Borrower and Grantor THE OTHER GRANTORS PARTY HERETO FROM TIME TO TIME, and MIZUHO BANK, LTD., as Collateral AgentSecurity Agreement • October 13th, 2020 • Allegro Microsystems Inc • Semiconductors & related devices • New York
This REVOLVING FACILITY SECURITY AGREEMENT, dated as of September 30, 2020 (this “Agreement”), by and among Allegro MicroSystems, Inc., a Delaware corporation (the “Borrower”), the entities set forth on Schedule I hereto, each other entity from time to time party hereto as a grantor hereunder (together with the Borrower and each entity set forth on Schedule I hereto, collectively, the “Grantors”), and Mizuho Bank, Ltd., as the Collateral Agent for the Secured Parties (together with its successors and permitted assigns, the “Collateral Agent”).
LOAN AGREEMENTLoan Agreement • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices • Massachusetts
ALLEGRO MICROSYSTEMS, INC. RESTRICTED STOCK UNIT AGREEMENTRestricted Stock Unit Agreement • May 19th, 2021 • Allegro Microsystems, Inc. • Semiconductors & related devices • Delaware
This RESTRICTED STOCK UNIT AGREEMENT (the “Agreement”), dated as of [●] (the “Date of Grant”), is delivered by Allegro MicroSystems, Inc. (the “Company”) to [●] (the “Participant”).
SG8 Collaboration AgreementSg8 Collaboration Agreement • October 13th, 2020 • Allegro Microsystems Inc • Semiconductors & related devices
THIS SG8 COLLABORATION AGREEMENT (“Agreement”) is entered into as of July 5, 2014 between Sanken Electric Co., Ltd., located at 3-6-3 Kitano Niiza-Shi, Saitama-Ken, Japan 352-8666 (“Sanken”), Polar Semiconductor, LLC, located at 2800 East Old Shakopee Road, Bloomington, MN 55425 (“Polar”), and Allegro MicroSystems, LLC, located at 115 Northeast Cutoff, Worcester, MA 01615 (“Allegro”). Sanken, Polar, and Allegro may hereinafter be referred to individually as “Party” or collectively as “Parties”
SEVERANCE AGREEMENTSeverance Agreement • January 29th, 2008 • Allegro Microsystems Inc • Semiconductors & related devices • Massachusetts
THIS AGREEMENT (the “Agreement”) is entered into as of October 3, 2007 between Allegro MicroSystems, Inc., a Delaware corporation having its principal place of business at 115 Northeast Cutoff, Worcester, Massachusetts 01615 (“Allegro”), and Mark A. Feragne, a resident of the State of Rhode Island (“Executive”).
WITNESSETH:Contract of Lease • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices
ALLEGRO MICROSYSTEMS, INC. PERFORMANCE STOCK UNIT AGREEMENTPerformance Stock Unit Agreement • May 19th, 2021 • Allegro Microsystems, Inc. • Semiconductors & related devices • Delaware
This PERFORMANCE STOCK UNIT AGREEMENT (the “Agreement”), dated as [ ] (the “Date of Grant”), is delivered by Allegro MicroSystems, Inc. (the “Company”) to [ ] (the “Participant”).
EXHIBIT 10.7 CONFIDENTIAL MATERIALS OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION. THE LOCATIONS OF THE OMITTED MATERIALS ARE INDICATED BY THE FOLLOWING NOTATION: [***]. DISTRIBUTION AGREEMENT THIS AGREEMENT (the...Distribution Agreement • March 7th, 2008 • Allegro Microsystems Inc • Semiconductors & related devices
ALLEGRO MICROSYSTEMS, LLC AMENDMENT TO SEVERANCE AGREEMENTSeverance Agreement • May 25th, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices
This Amendment (this “Amendment”) is entered into as of May 15, 2023 (the “Effective Date”) between Derek D’Antilio, Senior Vice President, CFO and Treasurer (“Executive”) and Allegro MicroSystems, LLC (the “Company”) and amends the Severance Agreement between the Executive and the Company dated January 10, 2022 (the “Original Agreement”). Capitalized terms used but not otherwise defined herein shall have the respective meanings ascribed to such terms in the Original Agreement.
LOAN AGREEMENTLoan Agreement • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices • Massachusetts
EXHIBIT 10.9 CONFIDENTIAL MATERIALS OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION. THE LOCATIONS OF THE OMITTED MATERIALS ARE INDICATED BY THE FOLLOWING NOTATION: [***] WAFER FOUNDRY AGREEMENTWafer Foundry Agreement • March 7th, 2008 • Allegro Microsystems Inc • Semiconductors & related devices • Massachusetts
EXHIBIT 10.12 CONFIDENTIAL MATERIALS OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION. THE LOCATIONS OF THE OMITTED MATERIALS ARE INDICATED BY THE FOLLOWING NOTATION: [***] TECHNOLOGY TRANSFER AGREEMENT THIS TECHNOLOGY TRANSFER...Technology Transfer Agreement • March 7th, 2008 • Allegro Microsystems Inc • Semiconductors & related devices • Massachusetts
DISCRETE TECHNOLOGY DEVELOPMENT AGREEMENTDiscrete Technology Development Agreement • October 6th, 2020 • Allegro Microsystems Inc • Semiconductors & related devices • Minnesota
THIS DISCRETE TECHNOLOGY DEVELOPMENT AGREEMENT (“Agreement”) is entered into as of April 1, 2015 by and between Polar Semiconductor, LLC, a Delaware corporation headquartered in Bloomington, Minnesota (“PSL”); Sanken Electric Co., Ltd., a Japanese corporation headquartered in Saitama, Japan (“Sanken”). Such parties are singularly referred to herein as a “Party” and collectively referred to as “Parties.”
AGREEMENTAgreement • August 8th, 2007 • Allegro Microsystems Inc • Semiconductors & related devices • Massachusetts
AMENDMENT TO THE DISCRETE TECHNOLOGY DEVELOPMENT AGREEMENTDevelopment Agreement • October 6th, 2020 • Allegro Microsystems Inc • Semiconductors & related devices
THIS AMENDMENT TO THE DISCRETE TECHNOLOGY DEVELOPMENT AGREEMENT (“Amendment”), entered into as of June 15th, 2018, by and between Polar Semiconductor, LLC, a Minnesota limited liability company headquartered in Bloomington, Minnesota (formerly Polar Semiconductor, Inc., “PSL”), Allegro MicroSystems, Inc., a Delaware corporation headquartered in Manchester, NH (“AMI”), and Sanken Electric Co., Ltd., a Japanese corporation headquartered in Saitama, Japan (“Sanken”), amends the Discrete Technology Development Agreement by and between PSL and Sanken, dated April 1st, 2015 (the “Agreement”).
AMENDED AND RESTATED STOCKHOLDERS AGREEMENT OF ALLEGRO MICROSYSTEMS, INC.Stockholders Agreement • June 21st, 2022 • Allegro Microsystems, Inc. • Semiconductors & related devices • Delaware
This AMENDED AND RESTATED STOCKHOLDERS AGREEMENT (as it may be amended, amended and restated or otherwise modified from time to time in accordance with the terms hereof, this “Agreement”) is entered into by and among Allegro Microsystems, Inc., a Delaware corporation (the “Corporation”), OEP SKNA, L.P., a Cayman Islands exempted limited partnership (“OEP”) and Sanken Electric Co., Ltd., a Japanese corporation (“Sanken” and together with OEP, the “Stockholders”) as of June 16, 2022. Certain terms used in this Agreement are defined in Section 9.
Agreement Sanken Electric Co., Ltd. ("Sanken") and Allegro MicroSystems, Inc. ("Allegro") agreed as follows concerning the certain terms of the Licensing Agreement for "Allegro Trademark" dated on December 28, 2006.Allegro Microsystems Inc • March 7th, 2008 • Semiconductors & related devices
SANKEN NORTH AMERICA, INC. CLASS L COMMON STOCK GRANT AGREEMENTCommon Stock Grant Agreement • October 13th, 2020 • Allegro Microsystems Inc • Semiconductors & related devices • New York
THIS CLASS L COMMON STOCK GRANT AGREEMENT (this “Agreement”) is made as of _________ (the “Effective Date”) by and between Sanken North America, Inc., a Delaware corporation (the “Company”), and _________ (“Holder”).
TERMINATION OF THE DISTRIBUTION AGREEMENTDistribution Agreement • April 5th, 2023 • Allegro Microsystems, Inc. • Semiconductors & related devices
THIS TERMINATION OF THE DISTRIBUTION AGREEMENT is entered into this 31st day of March 2023 (the “Effective Date”) by and between Sanken Electric, Co., Ltd., located at 3-6-3 Kitano, Niiza-shi, Saitama, Japan (“SANKEN”), and Allegro MicroSystems, Inc, located at 955 Perimeter Road, Manchester, New Hampshire 03103, U.S.A. (“ALLEGRO”).
