BETWEENRights Agreement • December 23rd, 1998 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 2.1 AGREEMENT AND PLAN OF REORGANIZATION THIS AGREEMENT AND PLAN OF REORGANIZATION (the "Agreement") is entered into as of this October 1, 1996 by and among Integrated Device Technology, Inc., a Delaware corporation ("Acquirer"), Integrated...Agreement and Plan of Reorganization • February 10th, 1997 • Integrated Device Technology Inc • Semiconductors & related devices • California
EXHIBIT 10.1 SECOND AMENDMENT TO LEASE 2975 STENDER WAY, SANTA CLARA, CALIFORNIA THIS SECOND AMENDMENT TO LEASE (this "2nd Amendment") is made this 1st day of September, 1999 between the Morton and Jeanette Rude Trust, successor in interest to Morton...Lease • June 27th, 2000 • Integrated Device Technology Inc • Semiconductors & related devices
INTEGRATED DEVICE TECHNOLOGY, INC. AND WILMINGTON TRUST, NATIONAL ASSOCIATION as Trustee INDENTURE 0.875% CONVERTIBLE SENIOR NOTES DUE 2022 Dated as of November 4, 2015Indenture • November 4th, 2015 • Integrated Device Technology Inc • Semiconductors & related devices • New York
INDENTURE dated as of November 4, 2015 between Integrated Device Technology, Inc., a Delaware corporation, as issuer (as more fully set forth in Section 1.01, the “Company”), and Wilmington Trust, National Association, a national banking association organized under the laws of the United States of America, as trustee (as more fully set forth in Section 1.01, the “Trustee”).
October 29, 2015Integrated Device Technology Inc • November 4th, 2015 • Semiconductors & related devices
The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between JPMorgan Chase Bank, National Association, London Branch (“Dealer”) and Integrated Device Technology, Inc. (“Counterparty”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. This Confirmation shall replace any previous agreements and serve as the final documentation for the Transaction.
EXHIBIT 2.2 AGREEMENT OF MERGER THIS AGREEMENT OF MERGER (the "Agreement") is entered into as of this October 1, 1996, by and among Integrated Device Technology, Inc., a Delaware corporation ("Acquirer"), Integrated Device Technology Salinas Corp., a...Agreement of Merger • February 10th, 1997 • Integrated Device Technology Inc • Semiconductors & related devices
EXHIBIT 10.1 REGISTRATION RIGHTS AGREEMENT This Registration Rights Agreement (the "Agreement") is made and entered into as of this October 1, 1996, by and between Integrated Device Technology, Inc., a Delaware corporation ("Acquirer"), and Carl E....Registration Rights Agreement • February 10th, 1997 • Integrated Device Technology Inc • Semiconductors & related devices • California
Redacted Version CONFIDENTIAL TREATMENT REQUIRED TECHNOLOGY LICENSE AGREEMENT This Technology License Agreement ("Agreement") is made effective as of December 31, 1997 by and between Integrated Device Technology, Inc., a Delaware corporation with a...Technology License Agreement • June 28th, 1999 • Integrated Device Technology Inc • Semiconductors & related devices • California
EXHIBIT 10.3 NET LEASE AGREEMENT (Single Tenant) For and in consideration of the rentals, covenants, and conditions hereinafter set forth, Landlord hereby leases to Tenant, and Tenant hereby rents from Landlord, the herein described Premises for the...Net Lease Agreement • June 27th, 2000 • Integrated Device Technology Inc • Semiconductors & related devices • California
October 29, 2015Integrated Device Technology Inc • November 4th, 2015 • Semiconductors & related devices • New York
The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the Warrants issued by Integrated Device Technology, Inc. (“Company”) to JPMorgan Chase Bank, National Association, London Branch (“Dealer”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. This Confirmation shall replace any previous agreements and serve as the final documentation for the Transaction.
CREDIT AGREEMENT dated as of April 4, 2017 among INTEGRATED DEVICE TECHNOLOGY, INC., The Lenders Party Hereto, and JPMORGAN CHASE BANK, N.A., as Administrative Agent and Collateral Agent JPMORGAN CHASE BANK, N.A., as Sole Lead Arranger and Sole BookrunnerCredit Agreement • April 4th, 2017 • Integrated Device Technology Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT (this “Agreement”) dated as of April 4, 2017, among Integrated Device Technology, Inc., a Delaware corporation (the “Borrower”), the Lenders party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent and Collateral Agent.
Exhibit 10.27 PURCHASE AND SALE AGREEMENT AND JOINT ESCROW INSTRUCTIONS by and between Integrated Device Technology, Inc.Purchase and Sale Agreement and Joint Escrow Instructions • March 24th, 1999 • Integrated Device Technology Inc • Semiconductors & related devices • California
AGREEMENT AND PLAN OF MERGER by and among INTEGRATED DEVICE TECHNOLOGY, INC., GLIDER MERGER SUB, INC., and GIGPEAK, INC. Dated as of February 13, 2017Agreement and Plan of Merger • February 13th, 2017 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER, dated as of February 13, 2017 (as amended, restated, modified or supplemented from time to time, this “Agreement”), by and among Integrated Device Technology, Inc., a Delaware corporation (“Parent”), Glider Merger Sub, Inc., a Delaware corporation and a wholly-owned subsidiary of Parent (the “Purchaser”) and GigPeak, Inc., a Delaware corporation (the “Company”). All capitalized terms used in this Agreement shall have the meanings assigned to such terms in Section 8.4 or as otherwise defined elsewhere in this Agreement, unless the context clearly indicates otherwise.
AMENDMENT NO. 1Credit Agreement • June 1st, 2018 • Integrated Device Technology Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT (this “Agreement”) dated as of April 4, 2017,2017 and amended by Amendment No. 1 as of May 29, 2018, among Integrated Device Technology, Inc., a Delaware corporation (the “Borrower”), the Lenders party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent and Collateral Agent.
INDEMNIFICATION AGREEMENTIndemnification Agreement • May 19th, 2015 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
This Indemnification Agreement (“Agreement”) is made as of this ___ day of _______, 20__, by and between INTEGRATED DEVICE TECHNOLOGY, INC., a Delaware corporation (the “Company”), and ______________ (“Indemnitee”).
TENDER AND SUPPORT AGREEMENTTender and Support Agreement • February 13th, 2017 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
This TENDER AND SUPPORT AGREEMENT (this “Agreement”), dated as of February 13, 2017, is entered into by and among Integrated Device Technology, Inc., a Delaware corporation (“Parent”), Glider Merger Sub, Inc., a Delaware corporation and a wholly-owned Subsidiary of Parent (the “Purchaser”), and each of the Persons set forth on Schedule A hereto (each, a “Stockholder”). All capitalized terms used but not otherwise defined in this Agreement shall have the respective meanings ascribed to such terms in the Merger Agreement (as defined below).
VOTING AGREEMENTVoting Agreement • June 20th, 2005 • Integrated Device Technology Inc • Semiconductors & related devices • New York
This VOTING AGREEMENT (the “Agreement”), dated as of June 15, 2005, is entered into between the undersigned stockholder (“Stockholder”) of Integrated Device Technology, Inc., a Delaware corporation (“Parent”), and Integrated Circuit Systems, Inc., a Pennsylvania corporation (the “Company”).
EXHIBIT 10.1 EMPLOYMENT AGREEMENT Made January 25, 1999, by and between Glenn Henry, an individual having his residence at 411 Lake Cliff Trail, Austin, TX 78746 (hereinafter "Executive") and Integrated Device Technology, Inc., a Delaware corporation...Employment Agreement • February 10th, 1999 • Integrated Device Technology Inc • Semiconductors & related devices • Texas
EMPLOYMENT AGREEMENTEmployment Agreement • July 22nd, 2005 • Integrated Device Technology Inc • Semiconductors & related devices • California
THIS EMPLOYMENT AGREEMENT dated as of the 15th day of June, 2005, is entered into by and between Randall Frederick (the “Employee”) and Integrated Device Technology, Inc., a Delaware corporation (“the Corporation”).
February 28, 2017 Raluca Dinu Dear Raluca:Integrated Device Technology Inc • March 7th, 2017 • Semiconductors & related devices
This letter supersedes and replaces the offer letter issued to and accepted by you on February 7, 2017. As you know, Integrated Device Technology, Inc. (“IDT”) and GigPeak, Inc. (“GigPeak”) are entering into an agreement pursuant to which GigPeak will become a wholly owned subsidiary of IDT (the “Merger”). In connection with the Merger, we are pleased to offer you the following employment package with IDT. Effective immediately at the closing of the merger, your title with IDT will be Vice President, General Manager, reporting directly to Sean Fan in our San Jose office.
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • May 21st, 2012 • Integrated Device Technology Inc • Semiconductors & related devices • California
THIS ASSET PURCHASE AGREEMENT is made as of August 31, 2011 by and among QUALCOMM Incorporated, a Delaware corporation (the “Parent Purchaser”), Subsidiary Purchaser, Integrated Device Technology, Inc., a Delaware corporation (the “Parent Seller”), and Subsidiary Seller.
CHANGE OF CONTROL AGREEMENTChange of Control Agreement • June 15th, 2011 • Integrated Device Technology Inc • Semiconductors & related devices • California
This Change of Control Agreement (the “Agreement”) is made and entered into effective as of , 2011, by and between (“Employee”) and Integrated Device Technology, Inc., a Delaware corporation (the “Company”).
NON-COMPETITION AND NON-SOLICITATION AGREEMENTNon-Competition and Non-Solicitation Agreement • March 7th, 2017 • Integrated Device Technology Inc • Semiconductors & related devices • California
THIS NON-COMPETITION AND NON-SOLICITATION AGREEMENT (the “Noncompetition Agreement”) is being executed and delivered as of February 13, 2017, by Dr. Avi Katz (“Executive”), in favor of, and for the benefit of Integrated Device Technology. Inc., a Delaware corporation (“Parent”), and the other Beneficiaries. Certain capitalized terms used in this Noncompetition Agreement are defined in Section 14.
ASSET PURCHASE AGREEMENT BY AND BETWEEN INTEGRATED DEVICE TECHNOLOGY, INC. AND NETLOGIC MICROSYSTEMS, INC. DATED AS OF APRIL 30, 2009Asset Purchase Agreement • May 6th, 2009 • Integrated Device Technology Inc • Semiconductors & related devices • California
This Asset Purchase Agreement (this “Agreement”) is made and entered into this 30 day of April, 2009, by and between Integrated Device Technology, Inc., a Delaware corporation (“Seller”), and NetLogic Microsystems, Inc., a Delaware corporation (“Buyer”).
AGREEMENTAgreement • June 20th, 2012 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
This Agreement (this “Agreement”) is made and entered into as of June 19, 2012, by and among Integrated Device Technology, Inc. (the “Company”) and the entities and natural persons listed on Exhibit A hereto and their Affiliates (as defined herein) (collectively, “Starboard”) (each of the Company and Starboard, a “Party” to this Agreement, and collectively, the “Parties”).
AGREEMENT AND PLAN OF MERGER BY AND AMONG INTEGRATED DEVICE TECHNOLOGY, INC. COLONIAL MERGER SUB I, INC. AND INTEGRATED CIRCUIT SYSTEMS, INC. DATED AS OF JUNE 15, 2005Agreement and Plan of Merger • June 20th, 2005 • Integrated Device Technology Inc • Semiconductors & related devices • New York
This Agreement and Plan of Merger, dated as of June 15, 2005 (this “Agreement”), is by and among Integrated Device Technology, Inc., a Delaware corporation (“Parent”), Colonial Merger Sub I, Inc., a Pennsylvania corporation and a direct, wholly-owned subsidiary of Parent (“Merger Sub”), and Integrated Circuit Systems, Inc., a Pennsylvania corporation (the “Company”).
Page SECTION 1 DEFINED TERMS; RULES OF CONSTRUCTION 1 1.1 Definitions 1 1.2 Use of Certain Terms 1 1.3 Headings and References 2 SECTION 2 REPRESENTATIONS AND WARRANTIES 2 2.1 Due Formation 2 2.2 Authorization; No Contravention 2 2.3 Governmental...Idti Agreement • June 17th, 2011 • Integrated Device Technology Inc • Semiconductors & related devices • New York
IDTI AGREEMENT, dated as of June 13, 2011 (as amended, amended and restated or otherwise modified from time to time, this “Agreement”), by Integrated Device Technology, Inc., a Delaware corporation (“IDTI”), in favor of each and every Applicable Person (as defined in Exhibit A) in existence on the date hereof and from time to time.
Amendment No. 2 to the Master Repurchase AgreementMaster Repurchase Agreement • December 7th, 2012 • Integrated Device Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 2 TO THE MASTER REPURCHASE AGREEMENT, dated as of December 4, 2012 (the “Amendment”), between Integrated Device Technology, Inc. (the “Seller”) and Bank of America, N.A. (the “Buyer”).
AGREEMENT FOR PURCHASE AND SALE OF REAL PROPERTYLease Agreement • June 14th, 2005 • Integrated Device Technology Inc • Semiconductors & related devices • California
This Agreement for Purchase and Sale of Real Property (“Agreement”) is made as of this 16th day of December, 2004 (“Effective Date”) by and between ELECTROGLAS, INC., a Delaware corporation (“Seller”), and INTEGRATED DEVICE TECHNOLOGY, INC., a Delaware corporation (“Buyer”).
February 28, 2017 Andrea Betti-Berutto Dear Andrea:Integrated Device Technology Inc • March 7th, 2017 • Semiconductors & related devices
This letter supersedes and replaces the offer letter issued to and accepted by you on February 7, 2017. As you know, Integrated Device Technology, Inc. (“IDT”) and GigPeak, Inc. (“GigPeak”) are entering into an agreement pursuant to which GigPeak will become a wholly owned subsidiary of IDT (the “Merger”). In connection with the Merger, we are pleased to offer you the following employment package with IDT. Effective immediately at the closing of the merger, your title with IDT will be Fellow in our San Jose office.
Business Purchase AgreementBusiness Purchase Agreement • July 20th, 2012 • Integrated Device Technology Inc • Semiconductors & related devices
AGREEMENT FOR PURCHASE AND SALE OF REAL PROPERTY Between BACCARAT SILICON INC. a California corporation (“Seller) and DAN CAPUTO CO., a California corporation (“Buyer”)Agreement for Purchase and Sale • August 12th, 2003 • Integrated Device Technology Inc • Semiconductors & related devices • California
This Agreement for Purchase and Sale of Real Property (“Agreement”) is made as of this Fifth (5th) day of August, 2003 (“Effective Date”) by and between BACCARAT SILICON INC., a California corporation (“Seller”), and DAN CAPUTO CO., a California corporation (“Buyer”).
Amendment No. 1 to the Master Repurchase AgreementMaster Repurchase Agreement • May 21st, 2012 • Integrated Device Technology Inc • Semiconductors & related devices • New York
AMENDMENT NO. 1 TO THE MASTER REPURCHASE AGREEMENT, dated as of May 17, 2012 (the “Amendment”), between Integrated Device Technology, Inc. (the “Seller”) and Bank of America, N.A. (the “Buyer”).
TRANSITION AGREEMENTTransition Agreement • March 30th, 2006 • Integrated Device Technology Inc • Semiconductors & related devices • California
This Transition Agreement (this “Agreement”) is entered into by and between Hock E. Tan, an individual (“Mr. Tan”), and Integrated Device Technology, Inc., a Delaware corporation (the “Company”), effective as of March 30, 2006 (the “Effective Date”).
EXHIBIT 10.11 RENT PURCHASE AGREEMENT by and among SUMITOMO BANK LEASING AND FINANCE, INC., a Delaware corporation, as LandlordRent Purchase Agreement • June 27th, 2000 • Integrated Device Technology Inc • Semiconductors & related devices
