Philips Pension Trustees LTD Sample Contracts

Sales Plan
Sales Plan • July 30th, 2012 • Philips Pension Trustees LTD • Semiconductors & related devices

WHEREAS, the Seller desires to establish this Sales Plan to sell shares of common stock (the "Stock") of NXP Semiconductors NV (the "Issuer"); and

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2013 UNDERWRITING AGREEMENT
2013 Underwriting Agreement • February 8th, 2013 • Philips Pension Trustees LTD • Semiconductors & related devices • New York
MARCH 2013 OFFERING LOCK-UP LETTER
Philips Pension Trustees LTD • March 14th, 2013 • Semiconductors & related devices

The undersigned understands that you, as the Underwriters (as defined below) or, if applicable, as representatives of the several Underwriters (the “Representatives”), propose to enter into an Underwriting Agreement (the “Underwriting Agreement”) with NXP Semiconductors N.V., a public company with limited liability (naamloze vennootschap) formed in The Netherlands (the “Company”) and certain shareholders of the Company named in Schedule I of the Underwriting Agreement (the “Selling Shareholders”), providing for the public offering (the “Public Offering”) by the Underwriter or the several Underwriters, as the case may be, named in Schedule II of the Underwriting Agreement (the “Underwriters”) of the ordinary shares, par value €0.20 per share, of the Company, to be sold by the Selling Shareholders (the “Shares”).

MARCH 2013 UNDERWRITING AGREEMENT
Underwriting Agreement • March 14th, 2013 • Philips Pension Trustees LTD • Semiconductors & related devices • New York

The undersigned understands that you, as the Underwriters (as defined below) or, if applicable, as representatives of the several Underwriters (the “Representatives”), propose to enter into an Underwriting Agreement (the “Underwriting Agreement”) with NXP Semiconductors N.V., a public company with limited liability (naamloze vennootschap) formed in The Netherlands (the “Company”) and certain shareholders of the Company named in Schedule I of the Underwriting Agreement (the “Selling Shareholders”), providing for the public offering (the “Public Offering”) by the Underwriter or the several Underwriters, as the case may be, named in Schedule II of the Underwriting Agreement (the “Underwriters”) of the ordinary shares, par value €0.20 per share, of the Company, to be sold by the Selling Shareholders (the “Shares”).

SIXTH SALES PLAN Sales Plan
Sixth Sales Plan • April 30th, 2013 • Philips Pension Trustees LTD • Semiconductors & related devices

WHEREAS, the Seller desires to establish this Sales Plan to sell shares of common stock (the “Stock”) of NXP Semiconductors NV (the “Issuer”); and

JOINT FILING AGREEMENT
Joint Filing Agreement • November 2nd, 2010 • Philips Pension Trustees LTD • Semiconductors & related devices

In accordance with Rule 13d-1(k)(1) promulgated under the Securities Exchange Act of 1934, the undersigned agree to the joint filing of a Statement on Schedule 13D (including any and all amendments thereto) with respect to the Common Stock, nominal value €.20 per share, of NXP Semiconductors N.V. and further agree to the filing of this Agreement as an Exhibit thereto. In addition, each party to this Agreement expressly authorizes each other party to this Agreement to file on its behalf any and all amendments to such Statement on Schedule 13D.

FIFTH SALES PLAN
Sales Plan • November 28th, 2012 • Philips Pension Trustees LTD • Semiconductors & related devices
Contract
Philips Pension Trustees LTD • February 15th, 2013 • Semiconductors & related devices
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