Party Responsibilities. 3.1 Tower will be primarily responsible for: 3.1.1 Deliver appropriate device test chips and related electrical test programs for the Module production monitoring 3.1.2 Designing, testing and characterizing an array level test-chip of [***]. 3.1.3 Participating in the following inter-company reviews: (a) Preliminary and final design reviews, to be held prior to [***]. (b) Layout review to ensure compatibility with Product requirements, to be held prior to [***]. 3.1.4 Designing the Module and a test chip and creating the following [***] views for the Module: data Sheet, behavioral model, integration guidelines, physical abstract (LEF), timing views, and antenna LEF. 3.1.5 Testing, characterizing and qualifying the test chip for the Module according to agreed upon characterization and qualification plans 3.2 Alien will be primarily responsible for: 3.2.1 Defining the Specifications for the Module 3.2.2 Defining the [***] used in the Alien tool flow 3.2.3 Integrating the Module in the Product 3.2.4 Participating in the following inter-company reviews: (a) Preliminary and final design reviews, [***]. (b) Layout review to ensure compatibility with Product requirements, [***]. *** Confidential treatment requested pursuant to a request for confidential treatment filed with the Securities and Exchange Commission. Omitted portions have been filed separately with the Commission.
Appears in 2 contracts
Sources: Ic Technology Development Agreement (Alien Technology Corp), Ic Technology Development Agreement (Alien Technology Corp)