NextFactory consortium Clause Samples

NextFactory consortium. 31 1. Executive summary Mass customization will grow important for many different markets and the ability of fast prototyping is key to be competitive in fast changing and growing technological fields. Both facts are also relevant for microsystems of different types. Additive manufacturing (AM) could therefore be a future cornerstone for micro-mechatronic systems in the future. Nevertheless, AM-technologies are very limited regarding the demanding application of micro mechatronic systems. To change this NextFactory is aiming at innovating the production technology for functional prototypes and small lot sizes of micro-mechatronic systems. In the NextFactory approach, the technological fields of additive manufacturing are merged with assistive technologies for the production of individualized Smart-Products-in-Package (SPiPs). Within the project, interdisciplinary developments lead to a new, hybrid approach to manufacturing such kind of prototypes. The NextFactory system consists of a modular machine including all processes at production level and complete set of materials including conductive, insulating and functional materials that are both – compatible with process- and product requirements. Furthermore simulation models for the hybrid manufacturing process were developed to achieve predictable product quality and closed-loop process control in future. The capabilities of the system were demonstrated based on test-parts which were designed according to the requirements given by three use-cases. Each of the use-cases addresses a different market and application scenario. This was also the basis for business modelling activities to figure out the economic viability of the NextFactory system right in the development phase. 2. Project context and main objectives Project context In the future many manufacturing SMEs will have to develop a threefold capability:  Manufacture themselves three-dimensional integrated circuitry for highly miniaturised products  Produce full miniaturised mechatronic components and products, i.e. Smart Products-in- Package (SPiP), in an all-in-one process, far beyond today’s Systems-in-Package (SiPs)  Own their manufacturing processes at economically viable conditions The market demand for highly compact, individualised and smart electro-mechanical systems and products increases rapidly. Manufacturers therefore aim at advanced production technologies that can integrate in few stages and ideally at one site all (micro-) components...