Failure Analysis; Corrective Action Program Sample Clauses
The "Failure Analysis; Corrective Action Program" clause establishes a process for identifying, investigating, and addressing failures or defects in products or services. Typically, this clause requires the responsible party to conduct a thorough analysis to determine the root cause of any failure and to implement corrective actions to prevent recurrence. For example, if a component malfunctions, the supplier must analyze the issue, report findings, and take steps such as design changes or process improvements. The core function of this clause is to ensure continuous quality improvement and to minimize the risk of repeated failures, thereby protecting both parties' interests and maintaining product reliability.
Failure Analysis; Corrective Action Program. In the event of a suspected Epidemic Failure, IDT shall promptly notify TSMC in writing, and provide, if known and as may then exist, a description of the failure, and the suspected Lot numbers, serial numbers or other identifiers, and delivery dates, of the Affected Product. IDT shall also deliver or make available to TSMC samples of the failed Wafers for testing and analysis. Upon receipt of such Wafers from IDT, TSMC shall promptly provide its preliminary findings regarding the cause of the failure. The parties shall cooperate and work together to determine the root cause. Thereafter, TSMC shall promptly provide the results of its root cause analysis, its proposed plan for the identification of and the repair and/or replacement of the Affected Product which may be affected Lot or affected Wafer or affected Die, and such other appropriate information. TSMC shall recommend a corrective action program, subject to IDT’s written approval, that identifies the Affected Product for repair or replacement, and minimizes disruption to the end user. Upon receipt of IDT’s written approval, TSMC shall implement the corrective action program.