Assembly and packaging definition
Assembly and packaging. “Assembly and packaging” means all actions pertaining to the housing of a semiconductor chip or module, for example the affixing of a lead frame, soldering or other electrical or mechanical joining, attachment to a substrate or film, and encapsulation in moulding material or moulding compounds. Auxiliary agents: “Auxiliary agents” are media with which the semiconductors or modules are connected in order to modify, e.g., their electrical, mechanical or thermal properties, for example circuit boards, substrates, PCBs, cooling agents, electromagnetic s▇▇▇▇▇▇, mechanical guards. Material and tools: “Materials and tools” are materials and equipment utilized in the manufacture and housing of semiconductor components, e.g. chemicals, abrasives, forms, moulding compounds, adhesives, corrosives, refiners, heat treatments and lithography equipment.