AMENDMENT NO. 1Credit Agreement • June 1st, 2018 • Integrated Device Technology Inc • Semiconductors & related devices • New York
CREDIT AGREEMENT (this “Agreement”) dated as of April 4, 2017,2017 and amended by Amendment No. 1 as of May 29, 2018, among Integrated Device Technology, Inc., a Delaware corporation (the “Borrower”), the Lenders party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent and Collateral Agent.
