75,000,000 REDUCING REVOLVING CREDIT FACILITY $2,000,000 LETTER OF CREDIT FACILITY CREDIT AGREEMENT by and among PARK ELECTROCHEMICAL CORP., as Borrower, THE GUARANTORS PARTY HERETO, and HSBC BANK USA, NATIONAL ASSOCIATION, as Lender Dated: as of...Credit Agreement • May 13th, 2016 • Park Electrochemical Corp • Printed circuit boards
THIS CREDIT AGREEMENT (as hereafter amended, modified, supplemented or restated, this “Agreement”) is dated as of January 15, 2016 and effective as of January 21, 2016 and is made by and among PARK ELECTROCHEMICAL CORP., a New York corporation (the “Parent Company”), and any of its Subsidiaries that hereafter join this Agreement as Borrowers (with the Parent Company, each a “Borrower” and collectively, the “Borrowers”), each of the GUARANTORS (as hereinafter defined) party hereto, and HSBC BANK USA, NATIONAL ASSOCIATION (“HSBC” or “Lender”).
