0001193125-24-263876 Sample Contracts
CERTAIN IDENTIFIED INFORMATION HAS BEEN EXCLUDED FROM THE EXHIBIT BECAUSE IT IS BOTH NOT MATERIAL AND IS THE TYPE THAT THE REGISTRANT TREATS AS PRIVATE OR CONFIDENTIAL. [***] INDICATES THAT INFORMATION HAS BEEN REDACTED OR OMITTED.Facility Agreement • November 22nd, 2024 • NXP Semiconductors N.V. • Semiconductors & related devices
NXP B.V., a private limited liability company registered with the Dutch trade register under number 17070622 incorporated in the Netherlands, with official seat (statutaire zetel) in Eindhoven, the Netherlands, having its registered office at High Tech Campus 60, 5656 AG Eindhoven, the Netherlands (the “Borrower”).
GUARANTYGuaranty • November 22nd, 2024 • NXP Semiconductors N.V. • Semiconductors & related devices
GUARANTY, dated as of 22 November 2024 (this “Guaranty”), made by NXP Semiconductors N.V., a public limited company (naamloze vennootschap) registered with the Dutch trade register under number 34253298, incorporated in the Netherlands, with its official seat (statutaire zetel) in Eindhoven, the Netherlands (“NXP Semiconductors”), NXP USA, Inc., a Delaware corporation (“NXP Inc.”) and NXP Funding LLC, a Delaware corporation (“NXP LLC” and, together with NXP Semiconductors and NXP Inc. and any other Subsidiary that becomes a party hereto as a Guarantor (in each case, unless and until such person ceases to be a Guarantor in accordance with this Guaranty), individually, a “Guarantor” and, collectively, the “Guarantors”) and European Investment Bank, as bank (in such capacity, together with its successors in such capacity, the “Bank”).